公开(公告)号：US20150233551A1

公开(公告)日：2015-08-20

申请号：US14507544

申请日：2014-10-06

申请人： Hyoung Cheol CHO ,  Tae Gyu KIM ,  Tai Oh CHUNG ,  Min Soo HAN

发明人： Hyoung Cheol CHO ,  Tae Gyu KIM ,  Tai Oh CHUNG ,  Min Soo HAN

IPC分类号： F21V15/01 ,  H01L25/075 ,  H01L33/62 ,  H01L33/48 ,  F21V19/00 ,  H05K13/04

CPC分类号： H01L25/0753 ,  F21K9/233 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/24 ,  H01L33/382 ,  H01L33/54 ,  H01L2224/14 ,  H01L2933/0016 ,  Y10T29/49144 ,  Y10T29/49146

摘要： There is provided a method of manufacturing a light source module including: preparing a board including circuit wirings and a lens having an accommodation groove formed in a bottom surface thereof; attaching a buffer film to a bottom surface of the accommodation groove of the lens; mounting and arranging a plurality of light emitting devices on one surface of the board such that the plurality of light emitting devices are electrically connected to the circuit wirings; mounting the lens on the board such that the plurality of light emitting devices are accommodated within the accommodation groove in a state in which the buffer film faces the plurality of light emitting devices; and attaching the lens to the board such that the buffer film is tightly attached to upper surfaces of the plurality of light emitting devices and the bottom surface of the accommodation groove.

摘要翻译： 提供了一种制造光源模块的方法，包括：准备包括电路布线的板和在其底表面中形成有容纳槽的透镜; 将缓冲膜附着到透镜的容纳槽的底面; 在所述板的一个表面上安装和布置多个发光器件，使得所述多个发光器件电连接到所述电路布线; 将所述透镜安装在所述板上，使得所述多个发光装置在所述缓冲膜面向所述多个发光装置的状态下容纳在所述容纳槽内; 以及将所述透镜附接到所述板，使得所述缓冲膜紧密地附接到所述多个发光器件的上表面和所述容纳槽的底表面。

公开(公告)号：US20160118551A1

公开(公告)日：2016-04-28

申请号：US14987410

申请日：2016-01-04

申请人： Tae Gyu KIM ,  Tai Oh CHUNG ,  Hyoung Cheol CHO ,  Min Soo HAN

发明人： Tae Gyu KIM ,  Tai Oh CHUNG ,  Hyoung Cheol CHO ,  Min Soo HAN

IPC分类号： H01L33/50 ,  H01L33/60 ,  H01L33/48

CPC分类号： H01L33/50 ,  H01L24/97 ,  H01L27/15 ,  H01L33/24 ,  H01L33/36 ,  H01L33/44 ,  H01L33/48 ,  H01L33/502 ,  H01L33/504 ,  H01L33/507 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2924/00

摘要： A light emitting device is provide comprising a light emitting diode (LED) chip having a first main surface and a second main surface opposing the first main surface, and one or more side surfaces extending between the first main surface and second main surface. A plurality of electrodes is disposed on the first main surface. A wavelength conversion film is disposed on the second main surface. A mark is formed in the wavelength conversion film. The mark contains orientation information of the light emitting device, thereby enabling the light emitting device to be properly oriented on a receiving substrate.