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公开(公告)号：US20140247572A1
公开(公告)日：2014-09-04
申请号：US14279465
申请日：2014-05-16
Applicant: IBIDEN CO., LTD.
Inventor： Yasushi INAGAKI , Motoo ASAI , Dongdong WANG , Hideo YABASHI , Seiji SHIRAI
IPC: H05K1/18
CPC classification number: H05K1/115 , H01G2/06 , H01G4/12 , H01G4/224 , H01G4/228 , H01G4/248 , H01G4/40 , H01L21/4857 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L25/16 , H01L25/162 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05027 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2924/01002 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01046 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/112 , H05K1/181 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/4602 , H05K2201/09509 , H05K2201/09545 , H05K2201/096 , H05K2201/10015 , H05K2201/10636 , H05K2201/10674 , Y02P70/611
Abstract: A printed circuit board includes an accommodating layer, chip capacitor devices accommodated in the accommodating layer, and a buildup structure formed on the accommodating layer such that the buildup structure covers the chip capacitor devices in the accommodating layer. The buildup structure has mounting conductor structures positioned to mount an IC chip device on a surface of the buildup structure such that the IC chip device is mounted directly over the chip capacitor devices, each of the chip capacitor devices has a dielectric body having a surface facing the buildup structure, a first electrode formed on the dielectric body and extending on the surface of the dielectric body, and a second electrode formed on the dielectric body and extending on the surface of the dielectric body, and the dielectric body is interposed between the first electrode and the second electrode.
Abstract translation: 印刷电路板包括容纳层，容纳层中容纳的片状电容器器件，以及形成在容纳层上的堆积结构，使得堆积结构覆盖容纳层中的片状电容器器件。 积层结构具有安装导体结构，其被定位成将IC芯片装置安装在积层结构的表面上，使得IC芯片装置直接安装在芯片电容器装置上，每个芯片电容器装置具有电介质体， 所述积聚结构，形成在所述电介质体上且在所述电介质体的表面上延伸的第一电极，以及形成在所述电介质体上并在所述电介质体的表面上延伸的第二电极，并且所述电介质体介于所述第一电极 电极和第二电极。
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公开(公告)号：US20150250056A1
公开(公告)日：2015-09-03
申请号：US14714548
申请日：2015-05-18
Applicant: IBIDEN CO., LTD.
Inventor： Yasushi INAGAKI , Motoo ASAI , Dongdong WANG , Hideo YABASHI , Seiji SHIRAI
CPC classification number: H05K1/115 , H01G2/06 , H01G4/12 , H01G4/224 , H01G4/228 , H01G4/248 , H01G4/40 , H01L21/4857 , H01L23/498 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L23/642 , H01L23/645 , H01L25/16 , H01L25/162 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05027 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2924/01002 , H01L2924/01005 , H01L2924/01011 , H01L2924/01012 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01046 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/3511 , H05K1/0231 , H05K1/112 , H05K1/181 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/4602 , H05K2201/09509 , H05K2201/09545 , H05K2201/096 , H05K2201/10015 , H05K2201/10636 , H05K2201/10674 , Y02P70/611
Abstract: A printed circuit board includes a substrate having an opening portion, a chip capacitor device accommodated in the opening portion of the substrate, and a buildup structure formed on the substrate such that the buildup structure covers the chip capacitor device in the opening portion of the substrate. The chip capacitor has a dielectric body having a surface facing the buildup structure, first electrodes formed on the surface of the dielectric body and second electrodes formed on the surface of the dielectric body, and the buildup structure has first via structures and second via structures such that the first via structures are connected to the first electrodes, respectively, and the second via structures are connected to the second electrodes, respectively.
Abstract translation: 印刷电路板包括具有开口部的基板，容纳在基板的开口部的片状电容器装置以及形成在基板上的积层结构，使得该积层结构覆盖基板的开口部分中的片状电容器器件 。 片状电容器具有电介体，该电介质体具有面向积累结构的表面，形成在电介质体的表面上的第一电极和形成在电介质体的表面上的第二电极，并且积聚结构具有第一通孔结构和第二通孔结构 第一通孔结构分别连接到第一电极，并且第二通孔结构分别连接到第二电极。
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公开(公告)号：US20160095207A1
公开(公告)日：2016-03-31
申请号：US14865061
申请日：2015-09-25
Applicant: IBIDEN CO., LTD.
Inventor： Hirotaka TANIGUCHI , Dongdong WANG , Michimasa TAKAHASHI
CPC classification number: H05K3/4691 , H05K1/0206 , H05K1/0207 , H05K2201/0323 , H05K2201/096
Abstract: A flex-rigid wiring board includes a flexible substrate, a first non-flexible substrate positioned on a first side of the flexible substrate, a second non-flexible substrate positioned on a second side of the flexible substrate, a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates, and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates. Each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion including a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers.
Abstract translation: 挠性刚性布线板包括柔性基板，位于柔性基板的第一侧上的第一非柔性基板，位于柔性基板第二侧上的第二非柔性基板，第一绝缘层 柔性基板和第一和第二非柔性基板的表面以及层压在柔性基板的第二表面上的第二绝缘层以及第一和第二非柔性基板。 第一和第二绝缘层中的每一个具有暴露柔性基板的一部分的开口部分，使得柔性基板的该部分形成连接非柔性刚性部分的柔性部分，并且第一和第二非柔性基板包括热 散热部分包括具有高于第一和第二绝缘层的热导率的导热性的散热材料。
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公开(公告)号：US20160066429A1
公开(公告)日：2016-03-03
申请号：US14837143
申请日：2015-08-27
Applicant: IBIDEN CO., LTD.
Inventor： Hirotaka TANIGUCHI , Dongdong WANG , Michimasa TAKAHASHI
CPC classification number: H05K1/0278 , H05K1/0281 , H05K1/186 , H05K3/4069 , H05K3/421 , H05K3/429 , H05K3/4602 , H05K3/4652 , H05K3/4688 , H05K3/4691 , H05K2201/0154 , H05K2201/0187 , H05K2201/09518 , H05K2201/09536 , H05K2201/096 , H05K2201/09845 , H05K2203/072 , H05K2203/0723 , H05K2203/1184 , H05K2203/308
Abstract: A flex-rigid wiring board includes a flexible base material structure, a rigid base material structure extending from opposite ends of the flexible base material structure, an electronic component embedded in the rigid base material structure, a first buildup layer laminated on first surfaces of the flexible base material structure and rigid base material structure and having an exposing portion exposing the flexible base material structure, and a second buildup layer laminated on second surfaces of the flexible base material structure and rigid base material structure and having an exposing portion exposing the flexible base material structure. The first and second buildup layers are formed such that the flexible base material structure exposed by the exposing portions of the first and second buildup layers forms a bendable portion and that the rigid base material structure and the first and second buildup layers form non-bendable portions connected to the bendable portion.
Abstract translation: 挠性刚性布线板包括柔性基材结构，从柔性基材结构的相对端延伸的刚性基材结构，嵌入刚性基材结构中的电子部件，层压在第一表面上的第一堆积层 柔性基材结构和刚性基材结构，并具有暴露柔性基材结构的曝光部分，以及层压在柔性基材结构和刚性基材结构的第二表面上的第二堆积层，并具有露出柔性基体 材料结构。 第一和第二积层形成为使得由第一和第二积聚层的暴露部分暴露的柔性基底材料结构形成可弯曲部分，并且刚性基底材料结构和第一和第二积聚层形成不可弯曲部分 连接到可弯曲部分。
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