公开(公告)号：US10051734B2

公开(公告)日：2018-08-14

申请号：US15452775

申请日：2017-03-08

Applicant: IBIDEN CO., LTD.

Inventor： Katsutoshi Kitagawa

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/40 ,  H05K3/00

Abstract: A wiring board includes a substrate, a surface protection film laminated on the substrate and having an opening portion, and a conductor block embedded in the substrate and having a pad portion exposed by the opening portion of the surface protection film. The conductor block has an annular groove formed such that the annular groove is surrounding the pad portion of the conductor block, and the surface protection film is formed such that a portion of the surface protection film is extending into the annular groove.

公开(公告)号：US09750136B2

公开(公告)日：2017-08-29

申请号：US15375297

申请日：2016-12-12

Applicant: IBIDEN CO., LTD.

Inventor： Michimasa Takahashi ,  Katsutoshi Kitagawa

IPC: H05K1/16 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46 ,  H05K3/42 ,  H05K1/09

CPC classification number: H05K1/115 ,  H05K1/0206 ,  H05K3/4007 ,  H05K3/42 ,  H05K2203/0733

Abstract: A wiring board includes an insulating substrate, a first conductor layer laminated on a first side of the insulating substrate, a second conductor layer laminated on a second side of the insulating substrate, first plating posts fitted in through holes in the insulating substrate respectively such that the first plating posts are projecting from the first conductor layer, and plating connecting parts connecting the second conductor layer and the first plating posts and having electronic component connecting portions such that the electronic component connecting portions form an electronic component mounting part positioned to mount an electronic component and are positioned on the through holes, respectively.

公开(公告)号：US10219383B2

公开(公告)日：2019-02-26

申请号：US15924412

申请日：2018-03-19

Applicant: IBIDEN CO., LTD.

Inventor： Katsutoshi Kitagawa ,  Takema Adachi

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/46 ,  H05K3/42 ,  H01L27/146

Abstract: A printed wiring board includes a laminate including resin insulating layers and conductor layers such that the resin insulating layers and the conductor layers are laminated alternately and that the laminate has a through hole opening to a first surface of the laminate and a component accommodating cavity that accommodates an electronic component and having an opening part formed on a second surface of the laminate on the opposite side with respect to the first surface. The through hole is formed through the laminate such that the through hole is extending to the component accommodating cavity, and the laminate has a resin coating formed on an inner wall surface of the through hole.

公开(公告)号：US09554462B2

公开(公告)日：2017-01-24

申请号：US14640502

申请日：2015-03-06

Applicant: IBIDEN CO., LTD.

Inventor： Katsutoshi Kitagawa

IPC: H05K1/00 ,  H05K1/02 ,  H01L23/498 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H01L23/367 ,  H01L21/48

CPC classification number: H05K1/0298 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/367 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/032 ,  H05K1/115 ,  H05K1/18 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4655 ,  H05K2201/0335 ,  H05K2201/096

Abstract: A printed wiring board includes a multilayer core substrate, a first buildup layer formed on the multilayer core substrate and including an interlayer insulation layer and a conductive layer, a second buildup layer formed on the multilayer core substrate and including an interlayer resin insulation layer and a conductive layer, and an end-surface through hole conductor formed on side surfaces of the first and second buildup layers and core substrate such that the through hole conductor connects the conductive layers of the first and second buildup layers. The core substrate includes a first conductive layer, a middle conductive layer, a second conductive layer, a first insulation layer between the first and middle conductive layers and a second insulation layer between the second and middle conductive layers, and the middle conductive layer is connected to the through-hole conductor and has thickness greater than thicknesses of the first and second conductive layers.

Abstract translation: 印刷电路板包括：多层芯基板，形成在所述多层芯基板上并具有层间绝缘层和导电层的第一累积层，形成在所述多层芯基板上的第二累积层，其包括层间树脂绝缘层和 导电层和形成在第一和第二堆积层和芯基板的侧表面上的端表面通孔导体，使得通孔导体连接第一和第二堆积层的导电层。 芯基板包括第一导电层，中间导电层，第二导电层，第一和中间导电层之间的第一绝缘层和第二和中间导电层之间的第二绝缘层，并且中间导电层被连接 并且具有大于第一和第二导电层的厚度的厚度。