公开(公告)号：US20180116057A1

公开(公告)日：2018-04-26

申请号：US15793084

申请日：2017-10-25

Applicant: IBIDEN CO., LTD.

Inventor： Kazuki KAJIHARA ,  Naoki KURAHASHI

IPC: H05K3/46 ,  H05K1/18 ,  H05K3/00 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K3/4697 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/036 ,  H05K1/09 ,  H05K1/183 ,  H05K1/186 ,  H05K3/0032 ,  H05K3/0097 ,  H05K3/4007 ,  H05K3/4655 ,  H05K3/4682 ,  H05K2201/0209 ,  H05K2203/308

Abstract: A printed wiring board includes a laminate, conductor posts formed on a surface of the laminate, and a mold resin layer formed on the surface of the laminate such that the posts are in the mold layer covering side surfaces of the posts. The laminate includes conductor layers and one or more resin insulating layers, the conductor layers includes a first conductor layer embedded in a resin insulating layer forming the surface of the laminate and has one surface exposed on the surface of the laminate, the first conductor layer includes first and second conductor pads such that the second pads are formed on outer peripheral side of the first pads, the mold layer has a cavity exposing the first pads, the posts are formed on the second pads on the surface of the laminate, and the first conductor layer includes fan-out wirings extending from inside to outside the cavity.

公开(公告)号：US20170372980A1

公开(公告)日：2017-12-28

申请号：US15633968

申请日：2017-06-27

Applicant: IBIDEN CO., LTD.

Inventor： Naoki KURAHASHI

IPC: H01L23/13 ,  H01L21/48 ,  H01L21/683 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46 ,  H01L23/498 ,  H01L25/10 ,  H01L23/538 ,  H01L23/00

CPC classification number: H01L23/13 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/48 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/15153 ,  H05K3/0097 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/09127 ,  H05K2203/107

Abstract: A method for manufacturing a wiring board includes forming on a first support plate a first laminated wiring portion including conductor and insulating layers such that the first portion has a first surface on first support plate side and a second surface, separating the first portion from the first plate, forming a conductor layer exposed on the first surface and including pads, laminating the first portion on a second support plate such that the second surface of the first portion faces second support plate side, forming on the first surface of the first portion a second laminated wiring portion including conductor and insulating layers such that the second portion has a third surface on second support plate side and a fourth surface, forming cavity in the second portion on the second plate such that the cavity exposes the pads, and separating the first and second portions from the second plate.

公开(公告)号：US20170354044A1

公开(公告)日：2017-12-07

申请号：US15609435

申请日：2017-05-31

Applicant: IBIDEN CO., LTD.

Inventor： Naoki KURAHASHI

IPC: H05K3/46 ,  H05K3/40 ,  H05K3/28

Abstract: A method for manufacturing a wiring board includes preparing a core substrate having first and second surfaces, forming a first build-up structure including interlayer insulating layers and conductor layers on the first surface of the substrate, and forming a second build-up structure including interlayer insulating layers and one or more conductor layers on the second surface of the substrate. The forming of the first structure includes laminating the insulating layers and metal layers on first surface side of the substrate and forming the conductor layers from all of the metal layers on the first surface side, and the forming of the second structure includes laminating the insulating layers and metal layers on second surface side of the substrate, forming the one or more conductor layers from one or more of the metal layers on the second surface side, and entirely removing the other metal layers on the second surface side.