公开(公告)号：US20150075851A1

公开(公告)日：2015-03-19

申请号：US14548725

申请日：2014-11-20

Applicant: IBIDEN CO., LTD.

Inventor： Masahiro KANEKO ,  Satoru KOSE ,  Hirokazu HIGASHI

IPC: H05K3/42 ,  H05K1/03 ,  H05K3/22 ,  H05K1/11

CPC classification number: H05K3/42 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85001 ,  H01L2224/85385 ,  H01L2224/85444 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0313 ,  H05K1/113 ,  H05K1/115 ,  H05K3/007 ,  H05K3/108 ,  H05K3/22 ,  H05K3/388 ,  H05K2201/0344 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/072 ,  H05K2203/1377 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A printed wiring board includes an interlayer resin insulation layer having a penetrating hole, a conductive circuit formed on a first surface of the interlayer resin insulation layer, a filled via conductor formed in the penetrating hole of the interlayer resin insulation layer and connected to the conductive circuit, a first surface-treatment coating structure formed on a first surface of the filled via conductor and having an electroless plating structure, and a second surface-treatment coating structure formed on a second surface of the filled via conductor on an opposite side with respect to the first surface-treatment coating structure and having an electroless plating structure. The filled via conductor includes a first conductive layer formed on side wall of the penetrating hole and a plated material filling the penetrating hole, and the first surface-treatment coating structure has a thickness which is different from a thickness of the second surface-treatment coating structure.

Abstract translation: 印刷电路板包括具有贯通孔的层间树脂绝缘层，形成在层间树脂绝缘层的第一表面上的导电电路，形成在层间树脂绝缘层的穿透孔中并与导电 电路，形成在填充的通路导体的第一表面上并具有无电解电镀结构的第一表面处理涂层结构和形成在填充通孔导体的第二表面上的第二表面处理涂层结构，该第二表面处理涂层结构相对于 涉及第一表面处理涂层结构并具有化学镀层结构。 填充的通孔导体包括形成在穿透孔的侧壁上的第一导电层和填充穿透孔的电镀材料，第一表面处理涂层结构的厚度与第二表面处理涂层的厚度不同 结构体。