公开(公告)号：US20180049327A1

公开(公告)日：2018-02-15

申请号：US15672498

申请日：2017-08-09

Applicant: IBIDEN CO., LTD.

Inventor： Toru FURUTA ,  Masashi AWAZU

IPC: H05K3/46 ,  H05K1/03 ,  H05K3/24 ,  H05K1/02

CPC classification number: H05K3/4688 ,  H05K1/0271 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/24 ,  H05K3/323 ,  H05K3/4602 ,  H05K3/4682 ,  H05K2201/0212 ,  H05K2201/096

Abstract: A printed wiring board includes a central resin insulating layer, an electronic component embedded in the central insulating layer, a first resin insulating layer formed on first surface side of the central insulating layer, a second resin insulating layer formed on second surface side of the central insulating layer, via conductors formed in the central insulating layer such that the via conductors are formed toward the first surface side, and metal posts formed in the central insulating layer such that the metal posts are formed toward the second surface side. The central insulating layer does not contain a core material, and the via conductors include a group of via conductors connected with the metal posts respectively such that a via conductor and a respective metal post connected to the via conductor is connecting a first surface and a second surface of the central insulating layer on the opposite side.

公开(公告)号：US20180042114A1

公开(公告)日：2018-02-08

申请号：US15670185

申请日：2017-08-07

Applicant: IBIDEN CO. , LTD.

Inventor： Toru FURUTA ,  Masashi AWAZU

IPC: H05K1/18 ,  H01L23/00 ,  H05K1/16 ,  H05K3/46

CPC classification number: H05K1/185 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/2518 ,  H01L2224/73267 ,  H01L2924/3511 ,  H05K1/16 ,  H05K1/187 ,  H05K3/4647 ,  H05K3/4682 ,  H05K2203/0733

Abstract: A printed wiring board includes a central resin insulating layer, an electronic component embedded in the central resin insulating layer, a first resin insulating layer formed on a first surface side of the central resin insulating layer, and a second resin insulating layer formed on a second surface side of the central resin insulating layer on the opposite side with respect to the firs surface side. The central resin insulating layer does not contain a core material, and one of the first resin insulating layer and the second resin insulating layer includes a core material and the other one of the first resin insulating layer and the second resin insulating layer does not contain a core material.

公开(公告)号：US20160295691A1

公开(公告)日：2016-10-06

申请号：US15082407

申请日：2016-03-28

Applicant: IBIDEN CO., LTD.

Inventor： Toru FURUTA ,  Osamu FUTONAGANE

IPC: H05K1/02

CPC classification number: H05K3/4682 ,  H05K1/0289 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/162 ,  H05K2201/10151

Abstract: A printed wiring board includes a first insulating layer, a first conductor circuit including fingerprint authentication circuitry and embedded in the first insulating layer such that the first circuit has exposed surface exposed from surface of the first insulating layer, a second insulating layer on which the first insulating layer is formed, a second conductor circuit including fingerprint authentication circuitry and embedded in the second insulating layer such that the second circuit has exposed surface exposed from surface of the second insulating layer and is interposed between the first and second insulating layers, and a solder resist layer formed on the surface of the first insulating layer and covering the first circuit. The first and second circuits are positioned such that the first and second circuits are opposing each other across the first insulating layer and that a finger for fingerprint authentication is placed on the solder resist layer.

Abstract translation: 印刷电路板包括：第一绝缘层，包括指纹认证电路的第一导体电路，并且嵌入在第一绝缘层中，使得第一电路具有从第一绝缘层的表面露出的暴露表面;第二绝缘层， 形成绝缘层，第二导体电路包括指纹认证电路并嵌入在第二绝缘层中，使得第二电路具有从第二绝缘层的表面露出并且介于第一和第二绝缘层之间的暴露表面，以及焊料 形成在第一绝缘层的表面上并覆盖第一电路的抗蚀剂层。 定位第一和第二电路使得第一和第二电路跨越第一绝缘层彼此相对，并且用于指纹认证的手指放置在阻焊层上。

公开(公告)号：US20150282314A1

公开(公告)日：2015-10-01

申请号：US14674301

申请日：2015-03-31

Applicant: IBIDEN CO., LTD.

Inventor： Toru FURUTA ,  Takeshi FURUSAWA ,  Tomoya TERAKURA

IPC: H05K1/11 ,  H05K3/42 ,  H05K3/40 ,  H05K1/09 ,  H05K3/06

CPC classification number: H05K3/4007 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/0097 ,  H05K3/282 ,  H05K3/3436 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/09745 ,  H05K2201/09772 ,  H05K2203/0369 ,  H05K2203/1536 ,  Y02P70/611 ,  Y10T29/49165

Abstract: A method for manufacturing a printed wiring board with conductive posts includes forming on a first foil provided on carrier a first conductive layer including mounting pattern to connect electronic component via conductive posts, forming on the first foil a laminate including an insulating layer and a second foil to form the laminate on the first conductive layer, removing the carrier, forming a metal film on the laminate and first film, forming resist on the metal film to have pattern exposing portion of the metal film corresponding to the mounting pattern and portion of the second foil for a second conductive layer, forming an electroplating layer on the portion of the metal film not covered by the resist, removing the resist, and applying etching to remove the first and second foils below the metal film exposed by the removing the resist and to form the posts on the mounting pattern.

Abstract translation: 一种用于制造具有导电柱的印刷线路板的方法，包括在载体上形成第一导电层，第一导电层包括安装图案，以经由导电柱连接电子部件，在第一箔上形成包括绝缘层和第二箔 在第一导电层上形成层压体，去除载体，在层压体上形成金属膜和第一膜，在金属膜上形成抗蚀剂，使金属膜的图案曝光部分对应于安装图案和第二导电层的部分 箔片用于第二导电层，在未被抗蚀剂覆盖的金属膜的部分上形成电镀层，去除抗蚀剂，并施加蚀刻以除去通过除去抗蚀剂暴露的金属膜下面的第一和第二箔，并且 形成安装模式上的柱。