公开(公告)号：US20140175495A1

公开(公告)日：2014-06-26

申请号：US13901816

申请日：2013-05-24

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Tung-Han Chuang ,  Jian-Shian Lin ,  Ying-Tsun Su ,  Meng-Chi Huang

IPC: H01L33/48

CPC classification number: H01L33/0079 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/04026 ,  H01L2224/05624 ,  H01L2224/05687 ,  H01L2224/29082 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/83193 ,  H01L2224/83409 ,  H01L2224/83411 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00

Abstract: A die bonding method and a die bonding structure of a light emitting diode package are provided. The die bonding structure includes a light transmissive adhesive layer formed on a surface of a base plate of a light emitting diode chip, a first metal layer formed on the adhesive layer, a second metal layer formed on a packaging base plate and multiple metallic compound layers. The metallic compound layers are formed by spreading a third metal layer disposed on at least one of the first metal layer and the second metal layer into the first metal layer and the second metal layer after the third metal layer is heated up. The melting points of the first metal layer and the second metal layer are higher than the melting point of the third metal layer.

Abstract translation: 提供了一种发光二极管封装的管芯接合方法和管芯接合结构。 芯片接合结构包括形成在发光二极管芯片的基板的表面上的透光粘合剂层，在粘合剂层上形成的第一金属层，形成在封装基板上的第二金属层和多个金属化合物层 。 金属化合物层通过在第三金属层被加热之后将设置在第一金属层和第二金属层中的至少一个上的第三金属层扩散到第一金属层和第二金属层中而形成。 第一金属层和第二金属层的熔点高于第三金属层的熔点。

公开(公告)号：US09127979B2

公开(公告)日：2015-09-08

申请号：US14026947

申请日：2013-09-13

Applicant: Industrial Technology Research Institute

Inventor： Chen-Chin Cheng ,  Jian-Shian Lin ,  Min-Chieh Chou ,  Yu-Tang Chen

IPC: G01J1/04 ,  G01J1/02 ,  G01J1/42

CPC classification number: G01J1/0204 ,  G01J1/0271 ,  G01J1/0422 ,  G01J2001/0481 ,  G01J2001/4252

Abstract: An optical measuring device includes a case, a reflective layer and a light collecting lens module. A measuring chamber and a channel, which is connected to the measuring chamber and is connected to an opening of the case, reside in the case. The reflective layer is disposed onto an inner surface of the measuring chamber. The light collecting lens module is located inside the channel. A light beam emits into the channel of the optical measuring device through an opening, passes through the light collecting lens module and enters the measuring chamber afterward.

Abstract translation: 光学测量装置包括壳体，反射层和聚光透镜模块。 连接到测量室并连接到壳体的开口的测量室和通道驻留在壳体中。 反射层设置在测量室的内表面上。 光收集透镜模块位于通道内。 光束通过开口发射到光学测量装置的通道中，然后通过聚光透镜模块并进入测量室。