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公开(公告)号：US10020569B2
公开(公告)日：2018-07-10
申请号：US14983553
申请日：2015-12-30
Applicant: Industrial Technology Research Institute
Inventor： Meng-Chi Huang , Tune-Hune Kao , Wei-Yu Li , Wei Chung , Wen-Hua Zhang
Abstract: A laminated antenna structure includes a substrate, a first conductive circuit layer, an insulating colloidal layer, a second conductive circuit layer and a conductive structure. The first conductive circuit layer is disposed on or above the substrate, the second conductive circuit layer is disposed above the first conductive circuit layer, and the insulating colloidal layer is disposed between the first and the second conductive circuit layers. The first conductive circuit layer, the insulating colloidal layer and the second conductive circuit layer form a laminated capacitive structure. The conductive structure is electrically connected to a signal source on the substrate, and the signal source is electrically connected to at least one of the first conductive circuit layer and the second conductive circuit layer. The insulating colloidal layer contains catalyzers.
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公开(公告)号：US20230209706A1
公开(公告)日：2023-06-29
申请号：US18073561
申请日：2022-12-02
Applicant: Industrial Technology Research Institute
Inventor： Min-Chieh Chou , Meng-Chi Huang , Tune-Hune Kao , Yue-Zhen Huang
CPC classification number: H05K1/0284 , G01R1/07342 , H05K1/0306
Abstract: A three-dimensional circuit board, including a ceramic substrate and multiple circuits, is provided. The ceramic substrate has a first plane, a second plane, a third plane located between the first plane and the second plane, a first side surface connecting the first plane and the second plane, and a second side surface connecting the first plane and the third plane and opposite to the first side surface. A first height of the first side surface is greater than a second height of the second side surface. The circuits are separately embedded on the first plane of the ceramic substrate and extend along the first side surface to be embedded on the second plane.
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公开(公告)号：US20190177231A1
公开(公告)日：2019-06-13
申请号：US15842902
申请日：2017-12-15
Applicant: Industrial Technology Research Institute
Inventor： Meng-Chi Huang , Tune-Hune Kao , Guan-Ting Lin
IPC: C04B35/465 , C04B35/04 , C25D5/02 , C23C18/16 , C04B41/53
Abstract: A ceramic device including a ceramic material, a patterned metal structure, and a surface activation material is provided. A surface of the ceramic material at least includes a first surface and a second surface that are not coplanar. The ceramic material has recesses on the surface thereof. The patterned metal structure is disposed on the first surface and the second surface. The surface activation material is disposed on a surface of the recesses and located at an interface between the ceramic material and the patterned metal structure.
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公开(公告)号：US09590292B2
公开(公告)日：2017-03-07
申请号：US14961911
申请日：2015-12-08
Applicant: Industrial Technology Research Institute
Inventor： Wei-Yu Li , Tune-Hune Kao , Meng-Chi Huang , Wei Chung , Min-Chieh Chou
CPC classification number: H01Q1/243 , H01Q1/52 , H01Q9/0442
Abstract: A beam antenna comprising a first material layer, a second material layer, a first radiating conductor unit and an energy transmission conductor layer is provided. The first material layer has a signal source and a first conductor layer. The second material layer has a first thin-film layer, where the first thin-film layer is adhered on a surface of the second material layer. The first thin-film layer further comprises an insulating gel and a plurality of trigger particles. The first radiating conductor unit is adhered on a surface of the first thin-file layer, and the first thin-file layer is located between the first radiating conductor unit and the second material layer. The energy transmission conductor structure is disposed between the first and the second material layers, which has a first terminal and a second terminal that electrically coupled or connected to the signal source and the first radiating conductor unit respectively.
Abstract translation: 提供一种包括第一材料层，第二材料层，第一辐射导体单元和能量传输导体层的波束天线。 第一材料层具有信号源和第一导体层。 第二材料层具有第一薄膜层，其中第一薄膜层粘附在第二材料层的表面上。 第一薄膜层还包括绝缘凝胶和多个触发颗粒。 第一辐射导体单元粘附在第一薄文件层的表面上，第一薄文件层位于第一辐射导体单元和第二材料层之间。 能量传输导体结构设置在第一和第二材料层之间，第一和第二材料层分别具有电耦合或连接到信号源和第一辐射导体单元的第一端子和第二端子。
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公开(公告)号：US20230204628A1
公开(公告)日：2023-06-29
申请号：US17561997
申请日：2021-12-27
Applicant: Industrial Technology Research Institute
Inventor： Min-Chieh Chou , Meng-Chi Huang , Tune-Hune Kao , Yue-Zhen Huang
IPC: G01R1/073
CPC classification number: G01R1/07342 , G01R1/0735
Abstract: A probe card includes a flexible inorganic material layer, a metal micro structure, and a circuit board. The flexible inorganic material layer has a first surface and a second surface opposite to each other. The metal micro structure is disposed on the first surface. The circuit board is disposed on the second surface, and the circuit board is electrically connected to the metal micro structure. The test signal is adapted to be conducted to the circuit board through the flexible inorganic material layer.
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Patent Agency Ranking
公开(公告)号：US20220177364A1
公开(公告)日：2022-06-09
申请号：US17199462
申请日：2021-03-12
Applicant: Industrial Technology Research Institute
Inventor： Yiu-Hsiang Chang , Wei-Yen Wang , Meng-Chi Huang
Abstract: Provided are an adhesion promoting layer, a method for depositing a conductive layer on an inorganic or organic-inorganic hybrid substrate and a conductive structure. The adhesion promoting layer is suitable for depositing a conductive layer on an inorganic or organic-inorganic hybrid substrate, which includes a metal oxide layer and an interface layer. The metal oxide layer is disposed on the inorganic or organic-inorganic hybrid substrate. The interface layer is disposed between the metal oxide layer and the inorganic or organic-inorganic hybrid substrate. The metal oxide layer includes metal oxide and a chelating agent. The interface layer includes the metal oxide, the chelating agent and metal-nonmetal-oxide composite material.
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公开(公告)号：US10669209B2
公开(公告)日：2020-06-02
申请号：US15842902
申请日：2017-12-15
Applicant: Industrial Technology Research Institute
Inventor： Meng-Chi Huang , Tune-Hune Kao , Guan-Ting Lin
IPC: B32B3/00 , C04B35/465 , C04B35/04 , C04B41/53 , C23C18/16 , C25D5/02 , C23C18/42 , C04B41/52 , C23C18/32 , C04B41/45 , C04B41/88 , C04B41/00 , C23C18/38 , C23C18/18 , C25D5/48 , C04B41/90 , C04B111/00
Abstract: A ceramic device including a ceramic material, a patterned metal structure, and a surface activation material is provided. A surface of the ceramic material at least includes a first surface and a second surface that are not coplanar. The ceramic material has recesses on the surface thereof. The patterned metal structure is disposed on the first surface and the second surface. The surface activation material is disposed on a surface of the recesses and located at an interface between the ceramic material and the patterned metal structure.
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公开(公告)号：US20170173718A1
公开(公告)日：2017-06-22
申请号：US14977639
申请日：2015-12-22
Applicant: Industrial Technology Research Institute
Inventor： Yi-Hao Huang , Min-Chieh Chou , Wen-Hua Zhang , Meng-Chi Huang
CPC classification number: B23K1/0016 , B23K20/002 , B23K20/026 , B23K20/233 , B23K2101/36 , B23K2103/12 , C23C28/321 , C25D3/46 , C25D3/48 , C25D3/56 , C25D5/10 , C25D5/48 , C25D5/505 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/2712 , H01L2224/2908 , H01L2224/29109 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29155 , H01L2224/29166 , H01L2224/29172 , H01L2224/29186 , H01L2224/3201 , H01L2224/32245 , H01L2224/32503 , H01L2224/32507 , H01L2224/83101 , H01L2224/8321 , H01L2224/83447 , H01L2224/8381 , H01L2224/8382 , H01L2224/83825 , H01L2224/83907 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/15747 , H01L2924/20105 , H01L2924/01015 , H01L2924/00014 , H01L2924/01049 , H01L2924/01322 , H01L2924/00012 , H01L2924/0103 , H01L2924/01017
Abstract: A metal patch suitable for connecting a high-power element and a substrate is provided. The metal patch includes an intermediate metal layer, two first metal layers, and two second metal layers. The first metal layers are respectively disposed on two opposite surfaces of the intermediate metal layer. The intermediate metal layer is located between the first metal layers. The melting point of each of the first metal layers is greater than 800° C. The second metal layers are respectively disposed on the first metal layers. The intermediate metal layer and the first metal layers are located between the second metal layers. The material of each of the second metal layers includes an indium-tin alloy. Each of the first metal layers and the corresponding second metal layer can generate an intermetal via a solid-liquid diffusion reaction.
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9.发明申请DIE BONDING METHOD AND DIE BONDING STRUCTURE OF LIGHT EMITTING DIODE PACKAGE 审中-公开LED发光二极管封装的DIE结合方法和DIE结合结构公开(公告)号：US20140175495A1
公开(公告)日：2014-06-26
申请号：US13901816
申请日：2013-05-24
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Tung-Han Chuang , Jian-Shian Lin , Ying-Tsun Su , Meng-Chi Huang
IPC: H01L33/48
CPC classification number: H01L33/0079 , H01L24/29 , H01L24/32 , H01L24/83 , H01L33/62 , H01L2224/04026 , H01L2224/05624 , H01L2224/05687 , H01L2224/29082 , H01L2224/29109 , H01L2224/29111 , H01L2224/29124 , H01L2224/29139 , H01L2224/32225 , H01L2224/32245 , H01L2224/32503 , H01L2224/32507 , H01L2224/83193 , H01L2224/83409 , H01L2224/83411 , H01L2224/83825 , H01L2924/01322 , H01L2924/12041 , H01L2924/15787 , H01L2924/351 , H01L2924/00
Abstract: A die bonding method and a die bonding structure of a light emitting diode package are provided. The die bonding structure includes a light transmissive adhesive layer formed on a surface of a base plate of a light emitting diode chip, a first metal layer formed on the adhesive layer, a second metal layer formed on a packaging base plate and multiple metallic compound layers. The metallic compound layers are formed by spreading a third metal layer disposed on at least one of the first metal layer and the second metal layer into the first metal layer and the second metal layer after the third metal layer is heated up. The melting points of the first metal layer and the second metal layer are higher than the melting point of the third metal layer.
Abstract translation: 提供了一种发光二极管封装的管芯接合方法和管芯接合结构。 芯片接合结构包括形成在发光二极管芯片的基板的表面上的透光粘合剂层，在粘合剂层上形成的第一金属层，形成在封装基板上的第二金属层和多个金属化合物层 。 金属化合物层通过在第三金属层被加热之后将设置在第一金属层和第二金属层中的至少一个上的第三金属层扩散到第一金属层和第二金属层中而形成。 第一金属层和第二金属层的熔点高于第三金属层的熔点。
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公开(公告)号：US10051737B2
公开(公告)日：2018-08-14
申请号：US15461495
申请日：2017-03-17
Applicant: Industrial Technology Research Institute
Inventor： Meng-Chi Huang , Tune-Hune Kao
Abstract: An insulating colloidal material and a multilayer circuit structure are provided, wherein the insulating colloidal material includes a resin, trigger particles, and an organic solvent. The trigger particles are selected from the group consisting of organometallic particles and ionic compounds. The ratio of the trigger particles to the insulating colloidal material is between 0.1 wt % and 10 wt %. At least one insulating colloidal layer in the multilayer circuit structure contains the trigger particles.
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