公开(公告)号：US09142473B2

公开(公告)日：2015-09-22

申请号：US13849553

申请日：2013-03-25

Applicant: Industrial Technology Research Institute

Inventor： Yin-Po Hung ,  Tao-Chih Chang

IPC: H01L23/31 ,  H01L23/538 ,  H01L23/29 ,  H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/367 ,  H01L23/498

CPC classification number: H01L23/3135 ,  H01L21/568 ,  H01L23/295 ,  H01L23/3677 ,  H01L23/49548 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/06 ,  H01L24/13 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/0603 ,  H01L2224/13023 ,  H01L2224/13147 ,  H01L2224/24226 ,  H01L2224/24246 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/83851 ,  H01L2224/92163 ,  H01L2224/92247 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15151 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The disclosure relates to a stacked type power device module. May use the vertical conductive layer for coupling the stacked devices, the electrical transmission path may be shortened. Hence, current crowding or contact damages by employing the conductive vias or wire bonding may be alleviated.

Abstract translation: 本公开涉及一种堆叠型功率器件模块。 可以使用垂直导电层来耦合堆叠的器件，可以缩短电传输路径。 因此，可以减轻通过使用导电通孔或引线接合的电流拥挤或接触损伤。

公开(公告)号：US20140159212A1

公开(公告)日：2014-06-12

申请号：US13849553

申请日：2013-03-25

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yin-Po Hung ,  Tao-Chih Chang

IPC: H01L25/00

CPC classification number: H01L23/3135 ,  H01L21/568 ,  H01L23/295 ,  H01L23/3677 ,  H01L23/49548 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/06 ,  H01L24/13 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/0603 ,  H01L2224/13023 ,  H01L2224/13147 ,  H01L2224/24226 ,  H01L2224/24246 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/83851 ,  H01L2224/92163 ,  H01L2224/92247 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15151 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The disclosure relates to a stacked type power device module. May use the vertical conductive layer for coupling the stacked devices, the electrical transmission path may be shortened. Hence, current crowding or contact damages by employing the conductive vias or wire bonding may be alleviated.

Abstract translation: 本公开涉及一种堆叠型功率器件模块。 可以使用垂直导电层来耦合堆叠的器件，可以缩短电传输路径。 因此，可以减轻通过使用导电通孔或引线接合的电流拥挤或接触损伤。