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    DISPLAY DEVICES AND METHODS FOR FORMING DISPLAY DEVICES
    1.
    发明申请
    DISPLAY DEVICES AND METHODS FOR FORMING DISPLAY DEVICES 审中-公开

    公开(公告)号：US20200020831A1

    公开(公告)日：2020-01-16

    申请号：US16581939

    申请日：2019-09-25

    Applicant: InnoLux Corporation

    Inventor： Tung-Kai LIU ,  Tsau-Hua HSIEH ,  Hui-Chieh WANG ,  Shu-Ming KUO ,  Ming-I CHAO ,  Shun-Yuan HU

    IPC: H01L33/44 ,  H01L33/62

    Abstract: A display device is provided. The display device includes a thin-film transistor substrate, a conductive pad disposed on the thin-film transistor substrate, and an adhesion film disposed on the conductive pad. The adhesion film includes a plurality of conductive particles. The display device also includes a light-emitting component disposed on the adhesion film. The light-emitting component includes a connection feature. The display device also includes a protection layer partially surrounding the light-emitting component. The connection feature of the light-emitting component has a lower portion not surrounded by the protection layer. The adhesion film has a thickness of T, one of the plurality of conductive particles has a diameter of d, the lower portion of the connection feature has a thickness of t, and 0

    METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICE
    2.
    发明申请
    METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20190044023A1

    公开(公告)日：2019-02-07

    申请号：US16002156

    申请日：2018-06-07

    Applicant: InnoLux Corporation

    Inventor： Kai CHENG ,  Tsau-Hua HSIEH ,  Fang-Ying LIN ,  Tung-Kai LIU ,  Hui-Chieh WANG ,  Chun-Hsien LIN ,  Jui-Feng KO

    IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075

    Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

    METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICE
    3.
    发明申请
    METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20220246791A1

    公开(公告)日：2022-08-04

    申请号：US17725741

    申请日：2022-04-21

    Applicant: InnoLux Corporation

    Inventor： Kai CHENG ,  Tsau-Hua HSIEH ,  Fang-Ying LIN ,  Tung-Kai LIU ,  Hui-Chieh WANG ,  Chun-Hsien LIN ,  Jui-Feng KO

    IPC: H01L33/00 ,  H01L33/62

    Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

    Display Panel and Display Device
    6.
    发明申请
    Display Panel and Display Device 审中-公开
    显示面板和显示设备

    公开(公告)号：US20160190182A1

    公开(公告)日：2016-06-30

    申请号：US15064236

    申请日：2016-03-08

    Applicant: InnoLux Corporation

    Inventor： Kuan-Feng LEE ,  Hui-Chieh WANG

    IPC: H01L27/12 ,  H01L51/52 ,  G02F1/1362 ,  H01L27/32 ,  H01L29/786 ,  G02F1/1368

    CPC classification number: H01L27/1248 ,  G02F1/133345 ,  G02F1/136227 ,  G02F1/136286 ,  G02F1/1368 ,  H01L27/1225 ,  H01L27/124 ,  H01L27/3248 ,  H01L27/3258 ,  H01L27/3262 ,  H01L27/3276 ,  H01L29/78618 ,  H01L29/7869 ,  H01L51/524 ,  H01L2251/301 ,  H01L2251/303 ,  H01L2251/558

    Abstract: A display panel includes a TFT substrate, an opposite substrate and a display layer. A TFT of the TFT substrate has a drain. A first insulating layer has a first sub-layer and a second sub-layer disposed on the drain sequentially. The first sub-layer has a first opening with a first width. The second sub-layer has a second opening with a second width on the first opening. The first and second openings form a first via, and the second width is greater than the first width. A passivation layer is disposed on the first insulating layer. A second insulating layer is disposed on the passivation layer. A pixel electrode layer is disposed on the second insulating layer and disposed in the first via to connect the drain. The display layer is disposed between the TFT substrate and the opposite substrate.

    Abstract translation: 显示面板包括TFT基板，相对基板和显示层。 TFT基板的TFT具有漏极。 第一绝缘层具有顺序地设置在漏极上的第一子层和第二子层。 第一子层具有第一宽度的第一开口。 第二子层具有在第一开口上具有第二宽度的第二开口。 第一和第二开口形成第一通孔，第二宽度大于第一宽度。 钝化层设置在第一绝缘层上。 第二绝缘层设置在钝化层上。 像素电极层设置在第二绝缘层上并且设置在第一通孔中以连接漏极。 显示层设置在TFT基板和相对基板之间。

    DISPLAY PANEL AND DISPLAY DEVICE
    7.
    发明申请
    DISPLAY PANEL AND DISPLAY DEVICE 有权
    显示面板和显示设备

    公开(公告)号：US20150243684A1

    公开(公告)日：2015-08-27

    申请号：US14625429

    申请日：2015-02-18

    Applicant: INNOLUX CORPORATION

    Inventor： Kuan-Feng LEE ,  Hui-Chieh WANG

    IPC: H01L27/12 ,  G02F1/1333 ,  G02F1/1368 ,  G02F1/1362 ,  H01L29/786 ,  H01L27/32

    CPC classification number: H01L27/1248 ,  G02F1/133345 ,  G02F1/136227 ,  G02F1/136286 ,  G02F1/1368 ,  H01L27/1225 ,  H01L27/124 ,  H01L27/3248 ,  H01L27/3258 ,  H01L27/3262 ,  H01L27/3276 ,  H01L29/78618 ,  H01L29/7869 ,  H01L51/524 ,  H01L2251/301 ,  H01L2251/303 ,  H01L2251/558

    Abstract: A display panel includes a TFT substrate, an opposite substrate and a display layer. A TFT of the TFT substrate has a drain. A first insulating layer has a first sub-layer and a second sub-layer disposed on the drain sequentially. The first sub-layer has a first opening with a first width. The second sub-layer has a second opening with a second width on the first opening. The first and second openings form a first via, and the second width is greater than the first width. A passivation layer is disposed on the first insulating layer. A second insulating layer is disposed on the passivation layer. A pixel electrode layer is disposed on the second insulating layer and disposed in the first via to connect the drain. The display layer is disposed between the TFT substrate and the opposite substrate.

    Abstract translation: 显示面板包括TFT基板，相对基板和显示层。 TFT基板的TFT具有漏极。 第一绝缘层具有顺序地设置在漏极上的第一子层和第二子层。 第一子层具有第一宽度的第一开口。 第二子层具有在第一开口上具有第二宽度的第二开口。 第一和第二开口形成第一通孔，第二宽度大于第一宽度。 钝化层设置在第一绝缘层上。 第二绝缘层设置在钝化层上。 像素电极层设置在第二绝缘层上并且设置在第一通孔中以连接漏极。 显示层设置在TFT基板和相对基板之间。

    METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICE
    10.
    发明申请
    METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20200259044A1

    公开(公告)日：2020-08-13

    申请号：US16858826

    申请日：2020-04-27

    Applicant: InnoLux Corporation

    Inventor： Kai CHENG ,  Tsau-Hua HSIEH ,  Fang-Ying LIN ,  Tung-Kai LIU ,  Hui-Chieh WANG ,  Chun-Hsien LIN ,  Jui-Feng KO

    IPC: H01L33/00 ,  H01L33/62

    Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

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