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106 条记录 (耗时 0.022 秒)

    SMALL FORM FACTOR TRANSMITTING DEVICE
    3.
    发明申请
    SMALL FORM FACTOR TRANSMITTING DEVICE 有权

    公开(公告)号：US20210091536A1

    公开(公告)日：2021-03-25

    申请号：US17115296

    申请日：2020-12-08

    申请人： Inphi Corporation ,  Luxnet Corporation

    发明人： Radhakrishnan L. NAGARAJAN ,  Peng-Chih LI ,  Pi-Cheng LAW

    IPC分类号： H01S5/06 ,  H04B10/50 ,  H01S5/024 ,  H01S5/00 ,  H01S5/022 ,  G02B6/42 ,  H01S5/068 ,  H01S5/125

    摘要： A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

    SMALL FORM FACTOR TRANSMITTING DEVICE
    4.
    发明申请
    SMALL FORM FACTOR TRANSMITTING DEVICE 审中-公开

    公开(公告)号：US20200076158A1

    公开(公告)日：2020-03-05

    申请号：US16679014

    申请日：2019-11-08

    申请人： INPHI CORPORATION ,  Luxnet Corporation

    发明人： Radhakrishnan L. NAGARAJAN ,  Peng-Chih LI ,  Pi-Cheng LAW

    IPC分类号： H01S5/06 ,  H01S5/125 ,  H01S5/068 ,  H01S5/022 ,  G02B6/42 ,  H01S5/00 ,  H01S5/024 ,  H04B10/50

    摘要： A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

    IN-PACKAGED MULTI-CHANNEL LIGHT ENGINE ON SINGLE SUBSTRATE
    6.
    发明申请
    IN-PACKAGED MULTI-CHANNEL LIGHT ENGINE ON SINGLE SUBSTRATE 有权

    公开(公告)号：US20210385000A1

    公开(公告)日：2021-12-09

    申请号：US16894597

    申请日：2020-06-05

    申请人： INPHI CORPORATION

    发明人： Radhakrishnan L. NAGARAJAN ,  Liang DING ,  Mark PATTERSON ,  Roberto COCCIOLI

    IPC分类号： H04J14/02 ,  G02B6/42 ,  G02B6/293

    摘要： An in-packaged multi-channel light engine is packaged for four or more sub-assemblies of optical-electrical sub-modules. Each is assembled with at least four laser chips, one or more driver chip, and one or more trans-impedance amplifier (TIA) chip separately flip-mounted on a silicon photonics interposer and is coupled to an optical interface block and an electrical interface block on a sub-module substrate. The in-packaged multi-channel light engine further includes a first frame fixture holding the four or more sub-assemblies and a second frame fixture configured to hold the first frame fixture with the four or more sub-assemblies. The in-packaged multi-channel light engine further includes an interposer plate inserted between the sub-module substrates and a module substrate and is compressed between a backplate member attached to a bottom side of the module substrate and a top plate member configured as a heatsink with a plurality of fin structures.

    LIGHT SOURCE FOR INTEGRATED SILICON PHOTONICS
    7.
    发明申请
    LIGHT SOURCE FOR INTEGRATED SILICON PHOTONICS 有权

    公开(公告)号：US20210265805A1

    公开(公告)日：2021-08-26

    申请号：US17169037

    申请日：2021-02-05

    申请人： INPHI CORPORATION

    发明人： Xiaoguang HE ,  Radhakrishnan L. NAGARAJAN

    IPC分类号： H01S5/00 ,  H04B10/07 ,  H04B10/27 ,  G02B6/12 ,  G01R31/26 ,  H01S5/0234 ,  H01S5/323 ,  H01S5/02

    摘要： A light source based on integrated silicon photonics includes a die of a silicon substrate having at least one chip site configured with a surface region, a trench region, and a first stopper region located separately between the surface region and the trench region. The trench region is configured to be a depth lower than the surface region. The light source includes a laser diode chip having a p-side facing the chip site and a n-side being distal to the chip site. The p-side includes a gain region bonded to the trench region, an electrode region bonded to the surface region, and an isolation region engaged with the stopper region to isolate the gain region from the electrode region. The light source also includes a conductor layer in the die configured to connect the gain region to an anode electrode and separately connect the electrode region to a cathode electrode.

    APPARATUS AND METHOD FOR THERMAL DISSIPATION OF PHOTONIC TRANSCEIVING MODULE
    8.
    发明申请
    APPARATUS AND METHOD FOR THERMAL DISSIPATION OF PHOTONIC TRANSCEIVING MODULE 有权

    公开(公告)号：US20210088739A1

    公开(公告)日：2021-03-25

    申请号：US17095269

    申请日：2020-11-11

    申请人： INPHI CORPORATION

    发明人： Chris TOGAMI ,  Radhakrishnan L. NAGARAJAN ,  Gary SASSER ,  Brian TAYLOR

    IPC分类号： G02B6/42 ,  F28F1/14 ,  H05K7/20

    摘要： An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.

    OPTICAL MODULE
    9.
    发明申请
    OPTICAL MODULE 审中-公开

    公开(公告)号：US20200343990A1

    公开(公告)日：2020-10-29

    申请号：US16926344

    申请日：2020-07-10

    申请人： INPHI CORPORATION

    发明人： Radhakrishnan L. NAGARAJAN

    IPC分类号： H04J14/02 ,  H04B10/40

    摘要： An integrated apparatus with optical/electrical interfaces and protocol converter on a single silicon substrate. The apparatus includes an optical module comprising one or more modulators respectively coupled with one or more laser devices for producing a first optical signal to an optical interface and one or more photodetectors for detecting a second optical signal from the optical interface to generate a current signal. Additionally, the apparatus includes a transmit lane module coupled between the optical module and an electrical interface to receive a first electric signal from the electrical interface and provide a framing protocol for driving the one or more modulators. Furthermore, the apparatus includes a receive lane module coupled between the optical module and the electrical interface to process the current signal to send a second electric signal to the electrical interface.