Patent search ap:("INTEL CORPORATION") AND inv:"Jiamiao Tang" Page 1

1.

发明申请
FLEXIBLE SYSTEM-IN-PACKAGE SOLUTIONS FOR WEARABLE DEVICES 有权
Title translation: 用于可穿戴设备的灵活的系统级封装解决方案

公开(公告)号：US20160327977A1

公开(公告)日：2016-11-10

申请号：US14779300

申请日：2014-11-12

Applicant: INTEL CORPORATION

Inventor： Jiamiao Tang , Junfeng Zhao , Michael P. Skinner , Yong She , Jiun Hann Sir , Bok Eng Cheah , Shanggar Periaman , Kooi Chi Ooi , Yen Hsiang Chew

IPC: G06F1/16 , H01L23/498 , H01L23/31 , H01L25/00 , H01L21/48 , H01L21/56 , H05K1/18 , G06F1/18 , H01L23/00 , H02J1/14 , F03G5/06 , A43B3/00 , A43B7/14 , A41B1/00 , A41D1/06 , A44C5/00 , A44C15/00 , A41F9/00 , A41D1/08 , H01L25/065

CPC classification number: G06F1/163 , A41B1/00 , A41D1/002 , A41D1/06 , A41D1/08 , A41F9/002 , A43B3/001 , A43B3/0015 , A43B7/141 , A44C5/0015 , A44C15/005 , F03G5/06 , G06F1/189 , H01L21/4853 , H01L21/56 , H01L21/565 , H01L23/3135 , H01L23/49838 , H01L23/4985 , H01L23/5387 , H01L23/562 , H01L25/0655 , H01L25/50 , H01L2224/16225 , H01L2224/48091 , H01L2224/73257 , H01L2924/0002 , H01L2924/181 , H02J1/14 , H05K1/189 , H05K2201/05 , H01L2924/00014 , H01L2924/00012 , H01L2924/00

Abstract: Embodiments of the present disclosure are directed towards an integrated circuit (IC) package. In embodiments, an integrated circuit (IC) package may include a flexible substrate. The flexible substrate may have a plurality of dies coupled therewith. The IC package may include a first encapsulation material, having a first rigidity, disposed on the flexible substrate to at least partially encapsulate each die of the plurality dies. The IC package may further include a second encapsulation material, having a second rigidity, disposed on the flexible substrate. In embodiments, the second rigidity and the first rigidity are different from one another. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及集成电路（IC）封装。在实施例中，集成电路（IC）封装可以包括柔性衬底。柔性基板可以具有与其连接的多个模具。 IC封装可以包括具有第一刚性的第一封装材料，其设置在柔性基板上以至少部分地封装多个裸片的每个裸片。 IC封装还可包括设置在柔性基板上的具有第二刚性的第二封装材料。在实施例中，第二刚性和第一刚度彼此不同。可以描述和/或要求保护其他实施例。

2.

发明授权
Apparatus, system, and method for wireless connection in integrated circuit packages 有权
Title translation: 用于集成电路封装中的无线连接的装置，系统和方法

公开(公告)号：US08981573B2

公开(公告)日：2015-03-17

申请号：US13970241

申请日：2013-08-19

Applicant: Intel Corporation

Inventor： Jiamiao Tang , Henry Xu , Shinichi Sakamoto

IPC: H01L23/528 , H01L23/522 , H01L23/00 , H01L25/065

CPC classification number: H01L23/49811 , H01L21/50 , H01L21/56 , H01L23/49838 , H01L23/50 , H01L23/5226 , H01L24/09 , H01L24/24 , H01L24/25 , H01L24/43 , H01L24/82 , H01L24/85 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L2021/60007 , H01L2224/24011 , H01L2224/24051 , H01L2224/24145 , H01L2224/24226 , H01L2224/24998 , H01L2224/32145 , H01L2224/32225 , H01L2224/435 , H01L2224/43985 , H01L2224/45144 , H01L2224/45147 , H01L2224/73267 , H01L2224/82007 , H01L2224/82039 , H01L2224/82047 , H01L2224/85138 , H01L2224/85815 , H01L2224/92244 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06524 , H01L2225/06527 , H01L2225/06551 , H01L2225/06568 , H01L2225/06582 , H01L2924/00011 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/30105 , H01L2924/30107 , H01L2224/82 , H01L2924/00 , H01L2224/48

Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.

Abstract translation: 本发明的一些实施例包括在支撑件和附接到支撑件的至少一个模具之间的连接结构。模具包括在模具的表面上的多个管芯接合焊盘。连接结构包括多个通孔和凹槽组合。导电材料形成在通孔和沟槽组合中，以提供管芯接合焊盘和支撑件上的接合焊盘之间的连接。描述和要求保护其他实施例。

3.

发明授权
Apparatus, system, and method for wireless connection in integrated circuit packages 有权

公开(公告)号：US09837340B2

公开(公告)日：2017-12-05

申请号：US15195310

申请日：2016-06-28

Applicant: Intel Corporation

Inventor： Jiamiao Tang , Henry Xu , Shinichi Sakamoto

IPC: H01L23/498 , H01L23/00 , H01L25/065 , H01L23/522 , H01L23/50 , H01L25/18 , H01L21/50 , H01L21/56 , H01L21/60

CPC classification number: H01L23/49811 , H01L21/50 , H01L21/56 , H01L23/49838 , H01L23/50 , H01L23/5226 , H01L24/09 , H01L24/24 , H01L24/25 , H01L24/43 , H01L24/82 , H01L24/85 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L2021/60007 , H01L2224/24011 , H01L2224/24051 , H01L2224/24145 , H01L2224/24226 , H01L2224/24998 , H01L2224/32145 , H01L2224/32225 , H01L2224/435 , H01L2224/43985 , H01L2224/45144 , H01L2224/45147 , H01L2224/73267 , H01L2224/82007 , H01L2224/82039 , H01L2224/82047 , H01L2224/85138 , H01L2224/85815 , H01L2224/92244 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06524 , H01L2225/06527 , H01L2225/06551 , H01L2225/06568 , H01L2225/06582 , H01L2924/00011 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/30105 , H01L2924/30107 , H01L2224/82 , H01L2924/00 , H01L2224/48

Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.

4.

发明申请
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED CIRCUIT PACKAGES 审中-公开
Title translation: 集成电路封装中的无线连接的装置，系统和方法

公开(公告)号：US20150187713A1

公开(公告)日：2015-07-02

申请号：US14658743

申请日：2015-03-16

Applicant: Intel Corporation

Inventor： Jiamiao Tang , Henry Xu , Shinichi Sakamoto

IPC: H01L23/00 , H01L25/18 , H01L23/50

CPC classification number: H01L23/49811 , H01L21/50 , H01L21/56 , H01L23/49838 , H01L23/50 , H01L23/5226 , H01L24/09 , H01L24/24 , H01L24/25 , H01L24/43 , H01L24/82 , H01L24/85 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L2021/60007 , H01L2224/24011 , H01L2224/24051 , H01L2224/24145 , H01L2224/24226 , H01L2224/24998 , H01L2224/32145 , H01L2224/32225 , H01L2224/435 , H01L2224/43985 , H01L2224/45144 , H01L2224/45147 , H01L2224/73267 , H01L2224/82007 , H01L2224/82039 , H01L2224/82047 , H01L2224/85138 , H01L2224/85815 , H01L2224/92244 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06524 , H01L2225/06527 , H01L2225/06551 , H01L2225/06568 , H01L2225/06582 , H01L2924/00011 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/30105 , H01L2924/30107 , H01L2224/82 , H01L2924/00 , H01L2224/48

Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.

Abstract translation: 本发明的一些实施例包括在支撑件和附接到支撑件的至少一个模具之间的连接结构。模具包括在模具的表面上的多个管芯接合焊盘。连接结构包括多个通孔和凹槽组合。导电材料形成在通孔和沟槽组合中，以提供管芯接合焊盘和支撑件上的接合焊盘之间的连接。描述和要求保护其他实施例。

5.

发明授权
Flexible system-in-package solutions for wearable devices 有权

公开(公告)号：US09778688B2

公开(公告)日：2017-10-03

申请号：US14779300

申请日：2014-11-12

Applicant: INTEL CORPORATION

Inventor： Jiamiao Tang , Junfeng Zhao , Michael P. Skinner , Yong She , Jiun Hann Sir , Bok Eng Cheah , Shanggar Periaman , Kooi Chi Ooi , Yen Hsiang Chew

IPC: H01L23/48 , G06F1/16 , H01L23/31 , A41B1/00 , A41D1/06 , A41D1/08 , A41F9/00 , A43B3/00 , A43B7/14 , A44C5/00 , A44C15/00 , F03G5/06 , G06F1/18 , H01L21/48 , H01L21/56 , H01L23/498 , H01L23/00 , H01L25/065 , H01L25/00 , H02J1/14 , H05K1/18

CPC classification number: G06F1/163 , A41B1/00 , A41D1/002 , A41D1/06 , A41D1/08 , A41F9/002 , A43B3/001 , A43B3/0015 , A43B7/141 , A44C5/0015 , A44C15/005 , F03G5/06 , G06F1/189 , H01L21/4853 , H01L21/56 , H01L21/565 , H01L23/3135 , H01L23/49838 , H01L23/4985 , H01L23/5387 , H01L23/562 , H01L25/0655 , H01L25/50 , H01L2224/16225 , H01L2224/48091 , H01L2224/73257 , H01L2924/0002 , H01L2924/181 , H02J1/14 , H05K1/189 , H05K2201/05 , H01L2924/00014 , H01L2924/00012 , H01L2924/00

Abstract: Embodiments of the present disclosure are directed towards an integrated circuit (IC) package. In embodiments, an integrated circuit (IC) package may include a flexible substrate. The flexible substrate may have a plurality of dies coupled therewith. The IC package may include a first encapsulation material, having a first rigidity, disposed on the flexible substrate to at least partially encapsulate each die of the plurality dies. The IC package may further include a second encapsulation material, having a second rigidity, disposed on the flexible substrate. In embodiments, the second rigidity and the first rigidity are different from one another. Other embodiments may be described and/or claimed.

6.

发明申请
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED CIRCUIT PACKAGES 审中-公开
Title translation: 集成电路封装中的无线连接的装置，系统和方法

公开(公告)号：US20160379920A1

公开(公告)日：2016-12-29

申请号：US15195310

申请日：2016-06-28

Applicant: Intel Corporation

Inventor： Jiamiao Tang , Henry Xu , Shinichi Sakamoto

IPC: H01L23/498 , H01L23/00 , H01L21/50 , H01L25/065 , H01L21/56

CPC classification number: H01L23/49811 , H01L21/50 , H01L21/56 , H01L23/49838 , H01L23/50 , H01L23/5226 , H01L24/09 , H01L24/24 , H01L24/25 , H01L24/43 , H01L24/82 , H01L24/85 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L2021/60007 , H01L2224/24011 , H01L2224/24051 , H01L2224/24145 , H01L2224/24226 , H01L2224/24998 , H01L2224/32145 , H01L2224/32225 , H01L2224/435 , H01L2224/43985 , H01L2224/45144 , H01L2224/45147 , H01L2224/73267 , H01L2224/82007 , H01L2224/82039 , H01L2224/82047 , H01L2224/85138 , H01L2224/85815 , H01L2224/92244 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06524 , H01L2225/06527 , H01L2225/06551 , H01L2225/06568 , H01L2225/06582 , H01L2924/00011 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/30105 , H01L2924/30107 , H01L2224/82 , H01L2924/00 , H01L2224/48

Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die, The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.

Abstract translation: 本发明的一些实施例包括在支撑件和附接到支撑件的至少一个模具之间的连接结构。模具包括在模具的表面上的多个管芯接合焊盘。连接结构包括多个通孔和沟槽组合。导电材料形成在通孔和沟槽组合中，以提供管芯接合焊盘和支撑件上的接合焊盘之间的连接。描述和要求保护其他实施例。