公开(公告)号：US20180342463A1

公开(公告)日：2018-11-29

申请号：US16035048

申请日：2018-07-13

Applicant: Intel Corporation

Inventor： Taylor GAINES ,  Anna M. PRAKASH ,  Suriyakala RAMALINGAM ,  Boxi LIU ,  Mohit GUPTA ,  Ziv BELMAN ,  Baruch SCHIFFMANN ,  Arnon HIRSHBERG ,  Vladimir MALAMUD ,  Ron WITTENBERG

IPC: H01L23/552 ,  H01L23/00 ,  H01L25/16 ,  H01L25/00 ,  H01L23/31 ,  H01L31/107 ,  H01S5/022

Abstract: In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding structures (for example, metal cans and/or covers) to a semiconductor package to enclose one or more electronic components on the semiconductor package. In another embodiment, the conductive adhesive layers disclosed herein can be used in connection with optoelectronic devices (for example, optoelectronic devices including laser diodes and/or avalanche photodiodes, APDs). In one embodiment, the conductive adhesives can additionally be used for thermal dissipation and for electrical contact in connection with one or more electronic components on a semiconductor package. In one embodiment, various materials including, spray prints, conductive paste, inks (for example, sintering silver-based materials), epoxy material (for example, epoxy materials filled with silver and/or other metal particles) can be used to provide a conductive adhesive layer.

公开(公告)号：US20180190593A1

公开(公告)日：2018-07-05

申请号：US15396415

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Taylor GAINES ,  Anna M. PRAKASH ,  Suriyakala RAMALINGAM ,  Boxi LIU ,  Mohit GUPTA ,  Ziv BELMAN ,  Baruch SCHIFFMANN ,  Arnon HIRSHBERG ,  Vladimir MALAMUD ,  Ron WITTENBERG

IPC: H01L23/552 ,  H01L25/00 ,  H01L25/16 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L24/83 ,  H01L23/3142 ,  H01L23/552 ,  H01L24/27 ,  H01L24/32 ,  H01L25/167 ,  H01L25/50 ,  H01L31/107 ,  H01L2224/2731 ,  H01L2224/27318 ,  H01L2224/27418 ,  H01L2224/27505 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/32503 ,  H01L2224/83191 ,  H01L2224/8322 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2924/0133 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/1434 ,  H01L2924/3025

Abstract: In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding structures (for example, metal cans and/or covers) to a semiconductor package to enclose one or more electronic components on the semiconductor package. In another embodiment, the conductive adhesive layers disclosed herein can be used in connection with optoelectronic devices (for example, optoelectronic devices including laser diodes and/or avalanche photodiodes, APDs). In one embodiment, the conductive adhesives can additionally be used for thermal dissipation and for electrical contact in connection with one or more electronic components on a semiconductor package. In one embodiment, various materials including, spray prints, conductive paste, inks (for example, sintering silver-based materials), epoxy material (for example, epoxy materials filled with silver and/or other metal particles) can be used to provide a conductive adhesive layer.

公开(公告)号：US20210405206A1

公开(公告)日：2021-12-30

申请号：US17471215

申请日：2021-09-10

Applicant: Intel Corporation

Inventor： Nikolai BERKOVITCH ,  Vladimir MALAMUD ,  Konstantin MATYUCH ,  Yoav MAGRISSO ,  Gal DVORETZKI ,  Ron FRIEDMAN ,  Israel PETRONIUS

IPC: G01S17/933 ,  G01S7/481 ,  B23K26/06 ,  B23K31/00 ,  G02B7/00

Abstract: A light detection and ranging system including a mounting connection of a lens system in a mounting structure, including a lens system mounted in the mounting structure, the mounting connection including that the mounting structure includes at least one alignment opening, and the lens system includes a mounting shaft configured to mount the lens system in the mounting structure, wherein the alignment opening laterally surrounds the mounting shaft at least in part spaced apart in an alignment distance from the mounting shaft in the predefined alignment condition; and a spacer configured to span at least in part the alignment distance, wherein the mounting shaft is fixed in the alignment condition in the alignment opening by a first connection that fixes the spacer to the mounting structure, and by a second connection that fixes the spacer to the mounting shaft.

公开(公告)号：US20180095503A1

公开(公告)日：2018-04-05

申请号：US15282950

申请日：2016-09-30

Applicant: INTEL CORPORATION

Inventor： Sandeep S. IYER ,  Amanuel ABEBAW ,  Mark SALTAS ,  Mayank PATEL ,  Charavana K. GURUMURTHY ,  Suriyakala RAMALINGAM ,  Vladimir MALAMUD

IPC: G06F1/16 ,  H01F7/02

CPC classification number: G06F1/1684 ,  H01F7/0252

Abstract: An apparatus is provided which comprises: a chassis compartment having a bottom surface and walls orthogonal to the bottom, wherein the chassis compartment comprises: a rectangular opening, which may be designed to accept a microelectromechanical (MEMS) device and four slots, which may be designed to accept one or more magnet(s), extending outwardly from the rectangular opening, wherein each of the slots comprises: an inner opening having a length coextensive with a side of the rectangular opening, and an outer opening having corresponding ends that extend a length of the outer opening beyond the length of the inner opening. Other embodiments are also disclosed and claimed.