公开(公告)号：US20190202136A1

公开(公告)日：2019-07-04

申请号：US15859318

申请日：2017-12-29

Applicant: Intel Corporation

Inventor： Taylor GAINES ,  Mark SALTAS ,  Amram EITAN

IPC: B29C65/48 ,  B29C65/02 ,  C09J9/02 ,  C09J163/00 ,  C09J175/04 ,  C09J5/06 ,  H05K1/18 ,  H05K3/32

CPC classification number: B29C65/4805 ,  B29C65/02 ,  B29L2031/3425 ,  C08K3/02 ,  C08K3/04 ,  C08K2003/023 ,  C08K2003/0806 ,  C08K2003/0812 ,  C08K2201/001 ,  C09J5/06 ,  C09J9/02 ,  C09J163/00 ,  C09J175/04 ,  C09J2205/31 ,  C09J2400/10 ,  C09J2400/16 ,  C09J2463/00 ,  C09J2475/00 ,  H05K1/181 ,  H05K3/321 ,  H05K2201/0215 ,  H05K2203/166

Abstract: Apparatuses, systems and methods associated with procedures and adhesive elements for affixing components together are disclosed herein. In embodiments, an assembly may include a first component and a second component coupled to the first component. The assembly may further include a plurality of adhesive elements located between the first component and the second component, wherein the plurality of adhesive elements couple the second component to the first component, and wherein each adhesive element of the plurality of adhesive elements is equidistance from adjacent adhesive elements of the plurality of adhesive elements. Other embodiments may be described and/or claimed.

公开(公告)号：US20240213074A1

公开(公告)日：2024-06-27

申请号：US18089468

申请日：2022-12-27

Applicant: Intel Corporation

Inventor： Mark SALTAS ,  Edvin CETEGEN ,  Tony DAMBRAUSKAS ,  Albert KAMGA ,  Mine KAYA ,  James MELLODY ,  Rajesh Kumar NEERUKATTI

IPC: H01L21/683 ,  B25J15/06

CPC classification number: H01L21/6838 ,  B25J15/0616 ,  H01L2224/81203

Abstract: This disclosure describes nozzle designs for holding disaggregated die flat in a bonding process. The nozzle designs may have trenches extending radially outward from the center of the nozzle to the corners, such as in a snowflake pattern. The trenches may be positioned to be axially unaligned with any mold dishes of the disaggregated die when lifting the disaggregated die. The trenches may have a depth of at least 200 micrometers to allow for sufficient air flow to prevent warpage of the disaggregated die.

公开(公告)号：US20180095503A1

公开(公告)日：2018-04-05

申请号：US15282950

申请日：2016-09-30

Applicant: INTEL CORPORATION

Inventor： Sandeep S. IYER ,  Amanuel ABEBAW ,  Mark SALTAS ,  Mayank PATEL ,  Charavana K. GURUMURTHY ,  Suriyakala RAMALINGAM ,  Vladimir MALAMUD

IPC: G06F1/16 ,  H01F7/02

CPC classification number: G06F1/1684 ,  H01F7/0252

Abstract: An apparatus is provided which comprises: a chassis compartment having a bottom surface and walls orthogonal to the bottom, wherein the chassis compartment comprises: a rectangular opening, which may be designed to accept a microelectromechanical (MEMS) device and four slots, which may be designed to accept one or more magnet(s), extending outwardly from the rectangular opening, wherein each of the slots comprises: an inner opening having a length coextensive with a side of the rectangular opening, and an outer opening having corresponding ends that extend a length of the outer opening beyond the length of the inner opening. Other embodiments are also disclosed and claimed.