Two-bit magnetoresistive random-access memory device architecture

    公开(公告)号:US11437083B2

    公开(公告)日:2022-09-06

    申请号:US17168891

    申请日:2021-02-05

    Abstract: A magnetoresistive random-access memory (MRAM) device includes a first cell selectively connected to a first bit line and a second cell selectively connected to a second bit line. The MRAM device further includes a shared transistor connected to the first cell and connected to the second cell. The MRAM device further includes a first selector device and a second selector device. The first selector device is configured to permit current to flow through the first cell to the shared transistor when a voltage applied to the first selector device is larger than a threshold activation voltage. The second selector device is configured to permit current to flow through the second cell to the shared transistor when a voltage applied to the second selector device is larger than a threshold activation voltage. The MRAM cell further includes a word line connected to a gate of the shared transistor.

    Magnetoresistive random access memory thin film transistor unit cell

    公开(公告)号:US10727273B2

    公开(公告)日:2020-07-28

    申请号:US16159798

    申请日:2018-10-15

    Abstract: A MRAM-TFT unit cell and a method for fabricating the same. The MRAM-TFT unit cell includes a MRAM device and a TFT device electrically coupled to the MRAM device. The MRAM device and the TFT device are situated within a common plane of the MRAM-TFT cell. The method includes forming a TFT device comprising a source/drain region, and a semiconducting layer on a substrate. A magnetic tunnel junction stack (MTJ) is formed in contact with the source region. A first contact is formed on the MTJ, and a second contact is formed on the drain region. A first interconnect metal layer is formed in contact with the first contact, and a second first interconnect metal layer is formed in contact with the second contact. A third contact is formed on a gate region of the TFT device. A third interconnect metal layer is formed in contact with the third contact.

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