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公开(公告)号：US20180050903A1
公开(公告)日：2018-02-22
申请号：US15787023
申请日：2017-10-18
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Russell T. HERRIN , Jeffrey C. MALING , Anthony K. STAMPER
CPC classification number: B81B3/0072 , B81B3/0021 , B81B2201/01 , B81B2201/014 , B81B2203/0118 , B81B2203/0315 , B81B2203/04 , B81C1/0015 , B81C1/00365 , B81C1/00476 , B81C1/00619 , B81C1/00626 , B81C1/00666 , B81C2201/0109 , B81C2201/013 , B81C2201/0167 , B81C2201/017 , B81C2203/0136 , B81C2203/0172 , G06F17/5068 , G06F17/5072 , H01H1/0036 , H01H57/00 , H01H59/0009 , H01H2057/006 , H01L41/1136 , H01L2924/0002 , Y10S438/937 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , Y10T29/49105 , Y10T29/49121 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/5313 , H01L2924/00
Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.
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公开(公告)号：US20160126695A1
公开(公告)日：2016-05-05
申请号：US14531291
申请日：2014-11-03
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Jeffrey P. GAMBINO , Richard S. GRAF , Robert K. LEIDY , Jeffrey C. MALING
IPC: H01S5/022
CPC classification number: H01S5/02272 , H01L23/4825 , H01L24/06 , H01L24/17 , H01L2224/05573 , H01L2224/05582 , H01L2224/0601 , H01L2224/1403 , H01L2224/1703 , H01L2924/12042 , H01L2924/152
Abstract: A dual bond pad structure for a wafer with laser die attachment and methods of manufacture are disclosed. The method includes forming a bonding layer on a surface of a substrate. The method further includes forming solder bumps on the bonding layer. The method further includes patterning the bonding layer to form bonding pads some of which comprise the solder bumps thereon. The method further includes attaching a laser diode to selected bonding pads using solder connections formed on the laser diode. The method further includes attaching an interposer substrate to the solder bumps formed on the bonding pads.
Abstract translation: 公开了一种用于具有激光芯片附件的晶片的双键焊盘结构和制造方法。 该方法包括在基板的表面上形成接合层。 该方法还包括在接合层上形成焊料凸块。 该方法还包括图案化结合层以形成其中包括其上的焊料凸点的焊盘。 该方法还包括使用形成在激光二极管上的焊料连接将激光二极管附接到选定的焊盘。 该方法还包括将内插衬底附接到形成在接合焊盘上的焊料凸块。
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公开(公告)号：US20160055282A1
公开(公告)日：2016-02-25
申请号：US14840422
申请日：2015-08-31
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Russell T. HERRIN , Jeffrey C. MALING , Anthony K. STAMPER
IPC: G06F17/50
CPC classification number: B81B3/0072 , B81B3/0021 , B81B2201/01 , B81B2201/014 , B81B2203/0118 , B81B2203/0315 , B81B2203/04 , B81C1/0015 , B81C1/00365 , B81C1/00476 , B81C1/00619 , B81C1/00626 , B81C1/00666 , B81C2201/0109 , B81C2201/013 , B81C2201/0167 , B81C2201/017 , B81C2203/0136 , B81C2203/0172 , G06F17/5068 , G06F17/5072 , H01H1/0036 , H01H57/00 , H01H59/0009 , H01H2057/006 , H01L41/1136 , H01L2924/0002 , Y10S438/937 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , Y10T29/49105 , Y10T29/49121 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/5313 , H01L2924/00
Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.
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4.发明申请PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE AND DESIGN STRUCTURES 有权平面CAVITY MEMS及相关结构，制造方法和设计结构公开(公告)号：US20160325982A1
公开(公告)日：2016-11-10
申请号：US15212888
申请日：2016-07-18
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Russell T. HERRIN , Jeffrey C. MALING , Anthony K. STAMPER
CPC classification number: B81B3/0072 , B81B3/0021 , B81B2201/01 , B81B2201/014 , B81B2203/0118 , B81B2203/0315 , B81B2203/04 , B81C1/0015 , B81C1/00365 , B81C1/00476 , B81C1/00619 , B81C1/00626 , B81C1/00666 , B81C2201/0109 , B81C2201/013 , B81C2201/0167 , B81C2201/017 , B81C2203/0136 , B81C2203/0172 , G06F17/5068 , G06F17/5072 , H01H1/0036 , H01H57/00 , H01H59/0009 , H01H2057/006 , H01L41/1136 , H01L2924/0002 , Y10S438/937 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , Y10T29/49105 , Y10T29/49121 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/5313 , H01L2924/00
Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.
Abstract translation: 形成至少一个微电子机械系统（MEMS）的方法包括在远离梁结构的绝缘体层上形成梁结构和电极。 该方法还包括在光束结构上方并且远离电极形成至少一个牺牲层。 该方法还包括在至少一个牺牲层和电极上形成盖结构。 该方法还包括同时提供穿过盖结构的通气孔以暴露牺牲层并在电极上形成部分通孔。 该方法还包括排出牺牲层以形成空腔。 该方法还包括用材料密封通气孔。 该方法还包括通过部分通孔在盖结构中形成最终通孔至电极。
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公开(公告)号：US20160060099A1
公开(公告)日：2016-03-03
申请号：US14840434
申请日：2015-08-31
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Russell T. HERRIN , Jeffrey C. MALING , Anthony K. STAMPER
IPC: B81B3/00
CPC classification number: B81B3/0072 , B81B3/0021 , B81B2201/01 , B81B2201/014 , B81B2203/0118 , B81B2203/0315 , B81B2203/04 , B81C1/0015 , B81C1/00365 , B81C1/00476 , B81C1/00619 , B81C1/00626 , B81C1/00666 , B81C2201/0109 , B81C2201/013 , B81C2201/0167 , B81C2201/017 , B81C2203/0136 , B81C2203/0172 , G06F17/5068 , G06F17/5072 , H01H1/0036 , H01H57/00 , H01H59/0009 , H01H2057/006 , H01L41/1136 , H01L2924/0002 , Y10S438/937 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , Y10T29/49105 , Y10T29/49121 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/5313 , H01L2924/00
Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.
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Patent Agency Ranking
公开(公告)号：US20150113494A1
公开(公告)日：2015-04-23
申请号：US14060098
申请日：2013-10-22
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Jeffrey C. MALING , Anthony K. STAMPER , Zeljka TOPIC-BEGANOVIC
IPC: H01L23/544 , G01N23/20 , G06F17/50
Abstract: Methods, systems, and structures for detecting residual material on semiconductor wafers are provided. A method includes scanning a test structure including topographic features on a surface of a semiconductor wafer. The method further includes determining, based on the scanning, that the test structure includes an amount of a residual material of a sacrificial layer that exceeds a predetermined threshold.
Abstract translation: 提供了用于检测半导体晶片上的残留材料的方法，系统和结构。 一种方法包括在半导体晶片的表面上扫描包括地形特征的测试结构。 该方法还包括基于扫描确定测试结构包括超过预定阈值的牺牲层的残余材料的量。
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7.发明申请公开(公告)号：US20190315619A1
公开(公告)日：2019-10-17
申请号：US16448533
申请日：2019-06-21
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Russell T. HERRIN , Jeffrey C. MALING , Anthony K. STAMPER
Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.
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公开(公告)号：US20170125974A1
公开(公告)日：2017-05-04
申请号：US15407515
申请日：2017-01-17
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Jeffrey P. GAMBINO , Richard S. GRAF , Robert K. LEIDY , Jeffrey C. MALING
IPC: H01S5/022 , H01L23/00 , H01L23/482
CPC classification number: H01S5/02272 , H01L23/4825 , H01L24/06 , H01L24/17 , H01L2224/05573 , H01L2224/05582 , H01L2224/0601 , H01L2224/1403 , H01L2224/1703 , H01L2924/12042 , H01L2924/152
Abstract: A dual bond pad structure for a wafer with laser die attachment and methods of manufacture are disclosed. The method includes forming a bonding layer on a surface of a substrate. The method further includes forming solder bumps on the bonding layer. The method further includes patterning the bonding layer to form bonding pads some of which comprise the solder bumps thereon. The method further includes attaching a laser diode to selected bonding pads using solder connections formed on the laser diode. The method further includes attaching an interposer substrate to the solder bumps formed on the bonding pads.
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公开(公告)号：US20170125973A1
公开(公告)日：2017-05-04
申请号：US15407498
申请日：2017-01-17
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Jeffrey P. GAMBINO , Richard S. GRAF , Robert K. LEIDY , Jeffrey C. MALING
IPC: H01S5/022
Abstract: A dual bond pad structure for a wafer with laser die attachment and methods of manufacture are disclosed. The method includes forming a bonding layer on a surface of a substrate. The method further includes forming solder bumps on the bonding layer. The method further includes patterning the bonding layer to form bonding pads some of which comprise the solder bumps thereon. The method further includes attaching a laser diode to selected bonding pads using solder connections formed on the laser diode. The method further includes attaching an interposer substrate to the solder bumps formed on the bonding pads.
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10.发明申请PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE AND DESIGN STRUCTURES 有权平面CAVITY MEMS及相关结构，制造方法和设计结构公开(公告)号：US20130221454A1
公开(公告)日：2013-08-29
申请号：US13768246
申请日：2013-02-15
Applicant: International Business Machines Corporation
Inventor： George A. DUNBAR, III , Jeffrey C. MALING , William J. MURPHY , Anthony K. STAMPER
IPC: B81B3/00
CPC classification number: B81B3/0072 , B81B3/0021 , B81B2201/01 , B81B2201/014 , B81B2203/0118 , B81B2203/0315 , B81B2203/04 , B81C1/0015 , B81C1/00365 , B81C1/00476 , B81C1/00619 , B81C1/00626 , B81C1/00666 , B81C2201/0109 , B81C2201/013 , B81C2201/0167 , B81C2201/017 , B81C2203/0136 , B81C2203/0172 , G06F17/5068 , G06F17/5072 , H01H1/0036 , H01H57/00 , H01H59/0009 , H01H2057/006 , H01L41/1136 , H01L2924/0002 , Y10S438/937 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , Y10T29/49105 , Y10T29/49121 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/5313 , H01L2924/00
Abstract: A Micro-Electro-Mechanical System (MEMS). The MEMS includes a lower chamber with a wiring layer and an upper chamber which is connected to the lower chamber. A MEMS beam is suspended between the upper chamber and the lower chamber. A lid structure encloses the upper chamber, which is devoid of structures that interfere with a MEMS beam. The lid structure has a surface that is conformal to a sacrificial material vented from the upper chamber.
Abstract translation: 微机电系统（MEMS）。 MEMS包括具有布线层的下室和连接到下室的上室。 MEMS梁悬挂在上室和下室之间。 盖结构包围上室，其没有干扰MEMS梁的结构。 盖结构具有与从上室排出的牺牲材料共形的表面。
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