公开(公告)号：US20180288902A1

公开(公告)日：2018-10-04

申请号：US15987972

申请日：2018-05-24

Applicant: International Business Machines Corporation

Inventor： Xiaojin Wei ,  Allan C. VanDeventer

IPC: H05K7/20

CPC classification number: H05K7/20336 ,  H01L21/4882 ,  H01L23/3672 ,  H01L23/427 ,  H05K7/20309 ,  H05K7/20418

Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

公开(公告)号：US20200084917A1

公开(公告)日：2020-03-12

申请号：US16681958

申请日：2019-11-13

Applicant: International Business Machines Corporation

Inventor： Xiaojin Wei ,  Allan C. VanDeventer

IPC: H05K7/20 ,  H01L23/427

Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

公开(公告)号：US10575440B2

公开(公告)日：2020-02-25

申请号：US15987972

申请日：2018-05-24

Applicant: International Business Machines Corporation

Inventor： Xiaojin Wei ,  Allan C. VanDeventer

IPC: H05K7/20 ,  H01L23/427 ,  H01L23/367 ,  H01L21/48

Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

公开(公告)号：US20190296402A1

公开(公告)日：2019-09-26

申请号：US16439906

申请日：2019-06-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Noah Singer ,  John Torok ,  Robert B. Schlak ,  Xiaojin Wei ,  Mitchell Zapotoski

IPC: H01M10/42 ,  H01M10/6556 ,  H01M10/6561

Abstract: An air plenum assembly includes a first plenum for cooling, where the first plenum includes an inlet for air intake located at a first side of the first plenum. The air plenum assembly further includes a second plenum for exhausting heated air, where the second plenum includes an outlet for exhausting air located at a first side of the second plenum. The air plenum assembly further includes a first aperture located on a first side of the first plenum for directing air from the inlet at the first side of the first plenum to a first compartment and includes a first vent located on a first side of the second plenum for exhausting air away from the first compartment towards the outlet at the first side of the second plenum. The first compartment is isolated from surrounding battery compartments by at least two thermal separators.

公开(公告)号：US10374264B2

公开(公告)日：2019-08-06

申请号：US15800303

申请日：2017-11-01

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Noah Singer ,  John Torok ,  Robert B. Schlak ,  Xiaojin Wei ,  Mitchell Zapotoski

IPC: H01M10/42 ,  H01M10/6556 ,  H01M10/6561

Abstract: An air plenum assembly includes a first plenum for cooling, where the first plenum includes an inlet for air intake located at a first side of the first plenum. The air plenum assembly further includes a second plenum for exhausting heated air, where the second plenum includes an outlet for exhausting air located at a first side of the second plenum. The air plenum assembly further includes a first aperture located on a first side of the first plenum for directing air from the inlet at the first side of the first plenum to a first compartment and includes a first vent located on a first side of the second plenum for exhausting air away from the first compartment towards the outlet at the first side of the second plenum. The first compartment is isolated from surrounding battery compartments by at least two thermal separators.

公开(公告)号：US10374263B2

公开(公告)日：2019-08-06

申请号：US15682578

申请日：2017-08-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Noah Singer ,  John Torok ,  Robert B. Schlak ,  Xiaojin Wei ,  Mitchell Zapotoski

IPC: H01M10/42 ,  H01M10/6556 ,  H01M10/6561

Abstract: An air plenum assembly includes a first plenum for cooling, where the first plenum includes an inlet for air intake located at a first side of the first plenum. The air plenum assembly further includes a second plenum for exhausting heated air, where the second plenum includes an outlet for exhausting air located at a first side of the second plenum. The air plenum assembly further includes a first aperture located on a first side of the first plenum for directing air from the inlet at the first side of the first plenum to a first compartment and includes a first vent located on a first side of the second plenum for exhausting air away from the first compartment towards the outlet at the first side of the second plenum. The first compartment is isolated from surrounding battery compartments by at least two thermal separators.

公开(公告)号：US20190067749A1

公开(公告)日：2019-02-28

申请号：US15682578

申请日：2017-08-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Noah Singer ,  John Torok ,  Robert B. Schlak ,  Xiaojin Wei ,  Mitchell Zapotoski

IPC: H01M10/42 ,  H01M10/6556 ,  H01M10/6561

CPC classification number: H01M10/4257 ,  H01M10/4207 ,  H01M10/6556 ,  H01M10/6561 ,  H01M2010/4271

Abstract: An air plenum assembly includes a first plenum for cooling, where the first plenum includes an inlet for air intake located at a first side of the first plenum. The air plenum assembly further includes a second plenum for exhausting heated air, where the second plenum includes an outlet for exhausting air located at a first side of the second plenum. The air plenum assembly further includes a first aperture located on a first side of the first plenum for directing air from the inlet at the first side of the first plenum to a first compartment and includes a first vent located on a first side of the second plenum for exhausting air away from the first compartment towards the outlet at the first side of the second plenum. The first compartment is isolated from surrounding battery compartments by at least two thermal separators.

公开(公告)号：US10045464B1

公开(公告)日：2018-08-07

申请号：US15475529

申请日：2017-03-31

Applicant: International Business Machines Corporation

Inventor： Xiaojin Wei ,  Allan C. VanDeventer

IPC: H05K7/20

Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

公开(公告)号：US09501069B2

公开(公告)日：2016-11-22

申请号：US14207862

申请日：2014-03-13

Applicant: International Business Machines Corporation

Inventor： Craig A. Bickelman ,  Edward W. Chencinski ,  Seth R. Greenspan ,  M. Dean Sciacca ,  Xiaojin Wei

IPC: G05D23/13 ,  G06F1/32 ,  G06F1/20

CPC classification number: G06F3/0634 ,  G05D23/1393 ,  G06F1/206 ,  G06F1/3225 ,  G06F1/324 ,  G06F1/3268 ,  G06F3/0616 ,  G06F3/0653 ,  G06F3/0673 ,  Y02D10/126 ,  Y02D10/154 ,  Y02D10/16

Abstract: Embodiments relate to controlling a temperature of a solid state memory device using queue depth management by monitoring an operating temperature of each of a plurality of solid state drives of the solid state memory device. Based on a determination that the operating temperature of one of the plurality of solid state drives exceeds local device threshold values, the method includes receiving an indication that one or more local measures have been taken by the solid state memory device. Based on a determination that the operating temperature of one of the plurality of solid state drives exceeds a secondary global threshold value, the method includes reducing a queue length for the solid state memory device.

公开(公告)号：US11081738B2

公开(公告)日：2021-08-03

申请号：US15912602

申请日：2018-03-06

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Robert B. Schlak ,  Noah Singer ,  John Torok ,  Xiaojin Wei ,  Mitchell Zapotoski

IPC: H01M10/613 ,  H01M50/10 ,  H01M10/6554

Abstract: An apparatus for cooling and containing packaged battery cells includes a first structure disposed on a printed circuit board for encasing a first battery cell, the first battery cell being electrically coupled to the circuit board, the first structure includes an external surface and an internal surface defining a first cavity in which the first battery cell is located. The apparatus further includes a first seal surrounding the first battery cell between the printed circuit board coupled to the first structure. The apparatus further includes a first thermal interface material located in the first cavity, wherein a first portion of the first thermal interface material is thermally coupled to an interior surface and a second portion of the first thermal interface material is thermally coupled to the first battery cell. The apparatus further includes a plurality of heatsink fins located on the external surface of the first structure.