公开(公告)号：US20060290421A1

公开(公告)日：2006-12-28

申请号：US11512471

申请日：2006-08-30

申请人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang ,  Zlatko Filipvic

发明人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang ,  Zlatko Filipvic

IPC分类号： H03F1/00

CPC分类号： H03F3/195 ,  H01L23/66 ,  H01L25/162 ,  H01L25/165 ,  H01L25/18 ,  H01L2223/665 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03F1/34 ,  H03F3/24 ,  H03F2200/294 ,  H03F2200/372 ,  H04B2001/0433 ,  H05K1/0237 ,  H05K1/144 ,  H05K1/16 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/041 ,  H01L2924/00

摘要： A radio frequency (RF) module includes a first substrate adapted to receive passive circuits; and a second substrate adapted to receive active circuits, the first and second substrates electrically coupled through pads positioned on opposing surfaces of the first and second substrate.

摘要翻译： 射频（RF）模块包括适于接收无源电路的第一衬底; 以及适于接收有源电路的第二衬底，所述第一和第二衬底通过定位在所述第一和第二衬底的相对表面上的衬垫电耦合。

公开(公告)号：US20050264352A1

公开(公告)日：2005-12-01

申请号：US11173741

申请日：2005-07-02

申请人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang

发明人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang

IPC分类号： H01L23/66 ,  H03G3/20 ,  H03G3/30

CPC分类号： H01L23/66 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H03F1/0272 ,  H03G3/3042 ,  H01L2924/00

摘要： A power amplifier module for amplifying radio frequency signals includes first, second, third and fourth corner ground pads positioned at each corner of the power amplifier module; one or more radio frequency input pads positioned between the first and second corner ground pads; one or more radio frequency output pads positioned between the third and fourth corner ground pads; and one or more power amplifier circuits centrally positioned on the power amplifier module.

摘要翻译： 用于放大射频信号的功率放大器模块包括位于功率放大器模块的每个角落处的第一，第二，第三和第四角接地焊盘; 位于第一和第二角接地焊盘之间的一个或多个射频输入焊盘; 位于第三和第四角接地垫之间的一个或多个射频输出垫; 以及位于功率放大器模块上的一个或多个功率放大器电路。

公开(公告)号：US20050140436A1

公开(公告)日：2005-06-30

申请号：US11064261

申请日：2005-02-24

申请人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang

发明人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang

IPC分类号： H01L23/66 ,  H03G3/30 ,  H03G3/20

CPC分类号： H01L23/66 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H03F1/0272 ,  H03G3/3042 ,  H01L2924/00

摘要： A power amplifier module for amplifying radio frequency signals includes first and second radio frequency power amplifiers with one or more semiconductor transistors, adapted to receive an input radio frequency signal and a processed power-sensing control signal and to output an amplified radio frequency signal; first and second power-sensing circuits each coupled to said first and second radio frequency power amplifiers and adapted to receive each amplified radio frequency signal and to output the power-sensing control signal; and control logic that receives and processes the power-sensing control signals, and outputs a processed power-sensing control signal in response to each quality or magnitude of each amplified radio frequency signal.

公开(公告)号：US06977551B2

公开(公告)日：2005-12-20

申请号：US11064261

申请日：2005-02-24

申请人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang

发明人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang

IPC分类号： H01L23/66 ,  H03G3/30 ,  H03G3/10

CPC分类号： H01L23/66 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H03F1/0272 ,  H03G3/3042 ,  H01L2924/00

摘要： A power amplifier module for amplifying radio frequency signals includes first and second radio frequency power amplifiers with one or more semiconductor transistors, adapted to receive an input radio frequency signal and a processed power-sensing control signal and to output an amplified radio frequency signal; first and second power-sensing circuits each coupled to said first and second radio frequency power amplifiers and adapted to receive each amplified radio frequency signal and to output the power-sensing control signal; and control logic that receives and processes the power-sensing control signals, and outputs a processed power-sensing control signal in response to each quality or magnitude of each amplified radio frequency signal.

摘要翻译： 用于放大射频信号的功率放大器模块包括具有一个或多个半导体晶体管的第一和第二射频功率放大器，适于接收输入射频信号和经处理的功率检测控制信号并输出​​放大的射频信号; 第一和第二功率感测电路，每个耦合到所述第一和第二射频功率放大器，并且适于接收每个放大的射频信号并输出​​功率感测控制信号; 以及控制逻辑，其接收并处理功率检测控制信号，并且响应于每个放大射频信号的每个质量或幅度输出经处理的功率检测控制信号。

公开(公告)号：US06914482B2

公开(公告)日：2005-07-05

申请号：US10843410

申请日：2004-05-10

申请人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang

发明人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang

IPC分类号： H01L23/66 ,  H03G3/20 ,  H03G3/30

CPC分类号： H01L23/66 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H03F1/0272 ,  H03G3/3042 ,  H01L2924/00

摘要： A power amplifier module for amplifying radio frequency signals includes a radio frequency power amplifier including one or more semiconductor transistors, adapted to receive an input radio frequency signal and power control signals, and to output an amplified radio frequency signal. The power amplifier module is integrated with input and output impedance matching networks and a power sensor that is adapted to receive the amplified radio frequency signal and to output a signal indicating the power output level of the power amplifier module. The power amplifier module also includes control logic in accordance to at least one of the qualities and the power level of the amplified radio frequency signal.

公开(公告)号：US07164314B2

公开(公告)日：2007-01-16

申请号：US11121288

申请日：2005-05-02

申请人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang

发明人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang

IPC分类号： H03G3/20

CPC分类号： H01L23/66 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H03F1/0272 ,  H03G3/3042 ,  H01L2924/00

摘要： A power amplifier module for amplifying radio frequency signals includes a radio frequency power amplifier including one or more semiconductor transistors, adapted to receive an input radio frequency signal and power control signals, and to output an amplified radio frequency signal. The power amplifier module is integrated with input and output impedance matching networks and a power sensor that is adapted to receive the amplified radio frequency signal and to output a signal indicating the power output level of the power amplifier module. The power amplifier module also includes control logic in accordance to at least one of the qualities and the power level of the amplified radio frequency signal.

摘要翻译： 用于放大射频信号的功率放大器模块包括：射频功率放大器，包括一个或多个半导体晶体管，适于接收输入射频信号和功率控制信号，并输出放大的射频信号。 功率放大器模块与输入和输出阻抗匹配网络以及功率传感器集成，其适于接收放大的射频信号并输出​​指示功率放大器模块的功率输出电平的信号。 功率放大器模块还包括根据放大的射频信号的质量和功率电平中的至少一个的控制逻辑。

公开(公告)号：US07148752B2

公开(公告)日：2006-12-12

申请号：US11173741

申请日：2005-07-02

申请人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang

发明人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang

IPC分类号： H03F3/14

CPC分类号： H01L23/66 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H03F1/0272 ,  H03G3/3042 ,  H01L2924/00

摘要： A power amplifier module for amplifying radio frequency signals includes first, second, third and fourth corner ground pads positioned at each corner of the power amplifier module; one or more radio frequency input pads positioned between the first and second corner ground pads; one or more radio frequency output pads positioned between the third and fourth corner ground pads; and one or more power amplifier circuits centrally positioned on the power amplifier module.

摘要翻译： 用于放大射频信号的功率放大器模块包括位于功率放大器模块的每个角落处的第一，第二，第三和第四角接地焊盘; 位于第一和第二角接地焊盘之间的一个或多个射频输入焊盘; 位于第三和第四角接地垫之间的一个或多个射频输出垫; 以及位于功率放大器模块上的一个或多个功率放大器电路。

公开(公告)号：US20060119426A1

公开(公告)日：2006-06-08

申请号：US11173965

申请日：2005-07-02

申请人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang

发明人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang

IPC分类号： H03F3/14 ,  H03F3/68

CPC分类号： H03F1/0233 ,  H03F3/195 ,  H03F2200/111 ,  H03F2200/451 ,  H03F2200/465

摘要： A power amplifier module for amplifying radio frequency signals includes first and second radio frequency power amplifiers each including one or more semiconductor transistors, adapted to receive an input radio frequency signal and a processed power-sensing control signal, and to output an amplified radio frequency signal; first and second power-sensing circuits each coupled to said first and second radio frequency power amplifiers and adapted to receive each amplified radio frequency signal and to output the power-sensing control signal; and control logic that receives and processes the power-sensing control signals, and outputs a processed power-sensing control signal in response to each quality or magnitude of each amplified radio frequency signal.

摘要翻译： 用于放大射频信号的功率放大器模块包括第一和第二射频功率放大器，每个包括一个或多个半导体晶体管，适于接收输入射频信号和经处理的功率检测控制信号，并输出放大的射频信号 ; 第一和第二功率感测电路，每个耦合到所述第一和第二射频功率放大器，并且适于接收每个放大的射频信号并输出​​功率感测控制信号; 以及控制逻辑，其接收并处理功率检测控制信号，并且响应于每个放大射频信号的每个质量或幅度输出经处理的功率检测控制信号。

公开(公告)号：US06847262B2

公开(公告)日：2005-01-25

申请号：US10867902

申请日：2004-06-14

申请人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang

发明人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang

IPC分类号： H01L23/66 ,  H03G3/20 ,  H03G3/30 ,  H03F3/14

CPC分类号： H01L23/66 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H03F1/0272 ,  H03G3/3042 ,  H01L2924/00

摘要： A power amplifier module for amplifying radio frequency signals includes first, second, third and fourth corner ground pads positioned at each corner of the power amplifier module; a radio frequency input pad positioned between the first and second corner ground pads; a radio frequency output pad positioned between the third and fourth corner ground pads; and a power amplifier circuit centrally positioned on the power amplifier module, the power amplifier having an input coupled to the radio frequency input pad and an output coupled to the radio frequency output pad.

摘要翻译： 用于放大射频信号的功率放大器模块包括位于功率放大器模块的每个角落处的第一，第二，第三和第四角接地焊盘; 位于第一和第二角接地焊盘之间的射频输入焊盘; 位于第三和第四角接地垫之间的射频输出垫; 以及位于所述功率放大器模块上的功率放大器电路，所述功率放大器具有耦合到所述射频输入焊盘的输入和耦合到所述射频输出焊盘的输出。

公开(公告)号：US07741710B2

公开(公告)日：2010-06-22

申请号：US11173739

申请日：2005-07-02

申请人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang

发明人： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang

IPC分类号： H01L23/24

CPC分类号： H01L23/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Systems and methods are disclosed for a device having one or more power amplifier and/or LNA circuits positioned on the amplifier module.

摘要翻译： 公开了一种具有位于放大器模块上的一个或多个功率放大器和/或LNA电路的装置的系统和方法。