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公开(公告)号：US08207598B2
公开(公告)日：2012-06-26
申请号：US12498163
申请日：2009-07-06
IPC分类号： H01L23/36
CPC分类号： H01L23/3672 , H01L21/4878 , H01L2224/32225 , H01L2924/15311
摘要： A semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing bend. The channel walls depend from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein. The feet extend from respective channel walls for attachment to a substrate.
摘要翻译： 提供了从一体金属板制成的半导体散热器。 整体金属板形成一个面板，通道壁，至少两个脚和至少一个外部反向弯曲。 通道壁从面板取决于在通道壁和面板之间限定通道，用于在其中接收半导体。 脚从相应的通道壁延伸以附接到基底。
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公开(公告)号：US07575956B2
公开(公告)日：2009-08-18
申请号：US10721916
申请日：2003-11-24
IPC分类号： H01L21/44
CPC分类号： H01L23/3672 , H01L21/4878 , H01L2224/32225 , H01L2924/15311
摘要： A method for fabricating a semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing bend. The channel walls depend from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein. The feet extend from respective channel walls for attachment to a substrate.
摘要翻译： 提供了从一体金属板制造半导体散热器的方法。 整体金属板形成一个面板，通道壁，至少两个脚和至少一个外部反向弯曲。 通道壁从面板取决于在通道壁和面板之间限定通道，用于在其中接收半导体。 脚从相应的通道壁延伸以附接到基底。
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3.发明授权Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor 有权带式制造的倒装芯片封装和倒装芯片系统散热器组件及其制造方法公开(公告)号：US07153725B2
公开(公告)日：2006-12-26
申请号：US10766746
申请日：2004-01-27
IPC分类号： H01L23/31
CPC分类号： H01L23/3128 , H01L23/4334 , H01L24/97 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/97 , H01L2924/01033 , H01L2924/14 , H01L2924/15311 , H01L2224/81 , H01L2924/00
摘要： A method for fabricating a semiconductor package with a substrate in a strip format is provided. Semiconductor devices are attached in a strip format to the substrate, and a thermal interface material is applied to the semiconductor devices. A flat panel heat spreader is attached to each semiconductor device. The semiconductor devices are encapsulated with open encapsulation, leaving the surface of the flat panel heat spreader opposite the substrate externally exposed. Individual semiconductor packages are then singulated from the strip format.
摘要翻译： 提供了一种以条形格式制造具有衬底的半导体封装的方法。 半导体器件以条形格式附接到衬底，并且热界面材料被施加到半导体器件。 平板式散热器安装在每个半导体器件上。 半导体器件用开放封装封装，使平板散热器的表面与外部裸露的衬底相对。 然后单独的半导体封装从条形格式分割。
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公开(公告)号：US07327025B2
公开(公告)日：2008-02-05
申请号：US10836916
申请日：2004-04-30
CPC分类号： H01L23/36 , H01L23/4334 , H01L2224/16 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/19105
摘要： An electronic device having a substrate carrier is provided. A semiconductor connected to the substrate carrier. A heat spreader having upper and lower surfaces and legs recessed below the lower surface is connected to the substrate carrier. The Z-dimension between the heat spreader and the substrate carrier is maintained over substantially the entire area of the substrate carrier.
摘要翻译： 提供具有基板载体的电子装置。 连接到衬底载体的半导体。 具有在下表面下方凹陷的上表面和下表面和腿的散热器连接到基板载体。 散热器和基板载体之间的Z-尺寸维持在基板载体的基本上整个区域上。
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公开(公告)号：US20090273062A1
公开(公告)日：2009-11-05
申请号：US12498163
申请日：2009-07-06
IPC分类号： H01L23/552 , H01L23/36
CPC分类号： H01L23/3672 , H01L21/4878 , H01L2224/32225 , H01L2924/15311
摘要： A semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing bend. The channel walls depend from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein. The feet extend from respective channel walls for attachment to a substrate.
摘要翻译： 提供了从一体金属板制成的半导体散热器。 整体金属板形成一个面板，通道壁，至少两个脚和至少一个外部反向弯曲。 通道壁从面板取决于在通道壁和面板之间限定通道，用于在其中接收半导体。 脚从相应的通道壁延伸以附接到基底。
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6.发明授权Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices 有权散热器，散热器封装以及与倒装芯片半导体器件一起使用的制造方法公开(公告)号：US06775140B2
公开(公告)日：2004-08-10
申请号：US10434256
申请日：2003-05-07
IPC分类号： H05K720
CPC分类号： H01L23/36 , H01L21/4878 , H01L23/3128 , H01L2224/16 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/3025
摘要： A method for fabricating a semiconductor device heat spreader from a unitary piece of metallic material. The metallic material is stamped to form a unitary heat spreader having an upper heat dissipation region, a lower substrate contact region, and supports connecting the upper heat dissipation region and the lower substrate contact region. A recess is formed within the supports and the upper and lower regions for receiving a semiconductor device.
摘要翻译： 一种从整体金属材料制造半导体器件散热器的方法。 金属材料被冲压以形成具有上部散热区域，下部基板接触区域和连接上部散热区域和下部基板接触区域的支撑件的整体散热器。 在支撑件和上部和下部区域中形成凹部以接收半导体器件。
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公开(公告)号：US07242101B2
公开(公告)日：2007-07-10
申请号：US10894561
申请日：2004-07-19
CPC分类号： H01L23/3128 , H01L21/563 , H01L24/45 , H01L24/48 , H01L25/0652 , H01L25/0657 , H01L29/0657 , H01L2224/16 , H01L2224/16145 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32265 , H01L2224/33181 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48195 , H01L2224/48227 , H01L2224/73204 , H01L2224/73215 , H01L2224/73257 , H01L2224/73265 , H01L2225/06506 , H01L2225/06555 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/10158 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/19104 , H01L2924/00015 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： An integrated circuit die is provided having a body portion having a singulation side and a pedestal portion extending from the body portion and having a singulation side coplanar with the singulation side of the body portion.
摘要翻译： 提供一种集成电路管芯，其具有主体部分，该主体部分具有单个侧面和从本体部分延伸的基座部分，并且具有与本体部分的单面侧共面的单面侧。
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公开(公告)号：US07786593B2
公开(公告)日：2010-08-31
申请号：US11760690
申请日：2007-06-08
CPC分类号： H01L23/3128 , H01L21/563 , H01L24/45 , H01L24/48 , H01L25/0652 , H01L25/0657 , H01L29/0657 , H01L2224/16 , H01L2224/16145 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32265 , H01L2224/33181 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48195 , H01L2224/48227 , H01L2224/73204 , H01L2224/73215 , H01L2224/73257 , H01L2224/73265 , H01L2225/06506 , H01L2225/06555 , H01L2924/00011 , H01L2924/00014 , H01L2924/01079 , H01L2924/10158 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/19104 , H01L2924/00015 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： An integrated circuit die is provided having a body portion having a singulation side and a pedestal portion extending from the body portion and having a singulation side coplanar with the singulation side of the body portion.
摘要翻译： 提供一种集成电路管芯，其具有主体部分，该主体部分具有单个侧面和从本体部分延伸的基座部分，并且具有与本体部分的单面侧共面的单面侧。
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公开(公告)号：US07863730B2
公开(公告)日：2011-01-04
申请号：US10921377
申请日：2004-08-18
申请人： Il Kwon Shim , Kambhampati Ramakrishna , Diane Sahakian , Seng Guan Chow , Dario S. Filoteo, Jr. , Virgil Cotoco Ararao
发明人： Il Kwon Shim , Kambhampati Ramakrishna , Diane Sahakian , Seng Guan Chow , Dario S. Filoteo, Jr. , Virgil Cotoco Ararao
IPC分类号： H01L23/367 , H01L21/98
CPC分类号： H01L24/97 , H01L21/565 , H01L23/3128 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01033 , H01L2924/01079 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2924/16251 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2924/00012 , H01L2924/00
摘要： A method for forming a heat spreader, and the heat spreader formed thereby, are disclosed. An array heat spreader having a plurality of connected heat spreader panels is formed. Slots are formed in opposing sides of the heat spreader panels. Legs are formed on and extending downwardly from each of the heat spreader panels in at least an opposing pair of the slots on the heat spreader panels. The legs are integral with the respective heat spreader panels from which they depend.
摘要翻译： 公开了一种形成散热器的方法和由此形成的散热器。 形成具有多个连接的散热板的阵列散热器。 狭槽形成在散热板的相对侧。 在散热器面板上的至少一对相对的槽中，每个散热板上都形成有腿。 腿与它们依赖的相应散热器面板是一体的。
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公开(公告)号：US07381593B2
公开(公告)日：2008-06-03
申请号：US10913806
申请日：2004-08-05
申请人： Virgil Cotoco Ararao , Harvey Kong
发明人： Virgil Cotoco Ararao , Harvey Kong
IPC分类号： H01L21/00
CPC分类号： H01L24/27 , H01L23/3107 , H01L23/49503 , H01L23/49551 , H01L23/49575 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/743 , H01L2224/32145 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2224/73265 , H01L2224/743 , H01L2224/83192 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method and apparatus for stacked die packaging provide a leadframe configured for supporting a lower semiconductor die. At least one pillar is formed on the leadframe for supporting an upper semiconductor die. The pillar is formed integrally with and of the same material as the leadframe, and is sized to have a predetermined height that is higher than the height of such a lower semiconductor die plus the height of bonding wires for such a lower semiconductor die plus a predetermined spacing between such bonding wires and the bottom of an upper semiconductor die to be supported on the at least one pillar.
摘要翻译： 一种用于堆叠模具封装的方法和装置提供了一种用于支撑下半导体管芯的引线框架。 在引线框架上形成至少一个支柱，用于支撑上半导体管芯。 该支柱与引线框一体地形成与其相同的材料，并且其尺寸设计成具有比这样的下半导体管芯的高度高的预定高度加上用于这种下半导体管芯的接合线的高度加上预定的 这种接合线与上半导体管芯的底部之间的间隔被支撑在至少一个支柱上。
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