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1.发明授权Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor 有权带式制造的倒装芯片封装和倒装芯片系统散热器组件及其制造方法公开(公告)号：US07153725B2
公开(公告)日：2006-12-26
申请号：US10766746
申请日：2004-01-27
IPC分类号： H01L23/31
CPC分类号： H01L23/3128 , H01L23/4334 , H01L24/97 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/97 , H01L2924/01033 , H01L2924/14 , H01L2924/15311 , H01L2224/81 , H01L2924/00
摘要： A method for fabricating a semiconductor package with a substrate in a strip format is provided. Semiconductor devices are attached in a strip format to the substrate, and a thermal interface material is applied to the semiconductor devices. A flat panel heat spreader is attached to each semiconductor device. The semiconductor devices are encapsulated with open encapsulation, leaving the surface of the flat panel heat spreader opposite the substrate externally exposed. Individual semiconductor packages are then singulated from the strip format.
摘要翻译： 提供了一种以条形格式制造具有衬底的半导体封装的方法。 半导体器件以条形格式附接到衬底，并且热界面材料被施加到半导体器件。 平板式散热器安装在每个半导体器件上。 半导体器件用开放封装封装，使平板散热器的表面与外部裸露的衬底相对。 然后单独的半导体封装从条形格式分割。
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公开(公告)号：US20090273062A1
公开(公告)日：2009-11-05
申请号：US12498163
申请日：2009-07-06
IPC分类号： H01L23/552 , H01L23/36
CPC分类号： H01L23/3672 , H01L21/4878 , H01L2224/32225 , H01L2924/15311
摘要： A semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing bend. The channel walls depend from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein. The feet extend from respective channel walls for attachment to a substrate.
摘要翻译： 提供了从一体金属板制成的半导体散热器。 整体金属板形成一个面板，通道壁，至少两个脚和至少一个外部反向弯曲。 通道壁从面板取决于在通道壁和面板之间限定通道，用于在其中接收半导体。 脚从相应的通道壁延伸以附接到基底。
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3.发明授权Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices 有权散热器，散热器封装以及与倒装芯片半导体器件一起使用的制造方法公开(公告)号：US06775140B2
公开(公告)日：2004-08-10
申请号：US10434256
申请日：2003-05-07
IPC分类号： H05K720
CPC分类号： H01L23/36 , H01L21/4878 , H01L23/3128 , H01L2224/16 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/3025
摘要： A method for fabricating a semiconductor device heat spreader from a unitary piece of metallic material. The metallic material is stamped to form a unitary heat spreader having an upper heat dissipation region, a lower substrate contact region, and supports connecting the upper heat dissipation region and the lower substrate contact region. A recess is formed within the supports and the upper and lower regions for receiving a semiconductor device.
摘要翻译： 一种从整体金属材料制造半导体器件散热器的方法。 金属材料被冲压以形成具有上部散热区域，下部基板接触区域和连接上部散热区域和下部基板接触区域的支撑件的整体散热器。 在支撑件和上部和下部区域中形成凹部以接收半导体器件。
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公开(公告)号：US07327025B2
公开(公告)日：2008-02-05
申请号：US10836916
申请日：2004-04-30
CPC分类号： H01L23/36 , H01L23/4334 , H01L2224/16 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/19105
摘要： An electronic device having a substrate carrier is provided. A semiconductor connected to the substrate carrier. A heat spreader having upper and lower surfaces and legs recessed below the lower surface is connected to the substrate carrier. The Z-dimension between the heat spreader and the substrate carrier is maintained over substantially the entire area of the substrate carrier.
摘要翻译： 提供具有基板载体的电子装置。 连接到衬底载体的半导体。 具有在下表面下方凹陷的上表面和下表面和腿的散热器连接到基板载体。 散热器和基板载体之间的Z-尺寸维持在基板载体的基本上整个区域上。
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公开(公告)号：US07575956B2
公开(公告)日：2009-08-18
申请号：US10721916
申请日：2003-11-24
IPC分类号： H01L21/44
CPC分类号： H01L23/3672 , H01L21/4878 , H01L2224/32225 , H01L2924/15311
摘要： A method for fabricating a semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing bend. The channel walls depend from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein. The feet extend from respective channel walls for attachment to a substrate.
摘要翻译： 提供了从一体金属板制造半导体散热器的方法。 整体金属板形成一个面板，通道壁，至少两个脚和至少一个外部反向弯曲。 通道壁从面板取决于在通道壁和面板之间限定通道，用于在其中接收半导体。 脚从相应的通道壁延伸以附接到基底。
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公开(公告)号：US08207598B2
公开(公告)日：2012-06-26
申请号：US12498163
申请日：2009-07-06
IPC分类号： H01L23/36
CPC分类号： H01L23/3672 , H01L21/4878 , H01L2224/32225 , H01L2924/15311
摘要： A semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing bend. The channel walls depend from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein. The feet extend from respective channel walls for attachment to a substrate.
摘要翻译： 提供了从一体金属板制成的半导体散热器。 整体金属板形成一个面板，通道壁，至少两个脚和至少一个外部反向弯曲。 通道壁从面板取决于在通道壁和面板之间限定通道，用于在其中接收半导体。 脚从相应的通道壁延伸以附接到基底。
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7.发明授权Semiconductor package with selective underfill and fabrication method therfor 有权具有选择性底部填充的半导体封装及其制造方法公开(公告)号：US07169641B2
公开(公告)日：2007-01-30
申请号：US11121847
申请日：2005-05-03
IPC分类号： H01L21/00
CPC分类号： H01L21/67092 , H01L2224/16245
摘要： A method of manufacturing a semiconductor package includes providing a substrate having a plurality of contacts with solder bump contact areas that are unmasked. A plurality of underfill bumps is formed on the plurality of contacts selectively in the solder bump contact areas. A die having a plurality of solder bumps is positioned on the substrate so the plurality of solder bumps is substantially vertically aligned with the plurality of underfill bumps. The plurality of solder bumps is pressed into the plurality of underfill bumps until the plurality of solder bumps contacts the plurality of contacts. The plurality of solder bumps is reflowed. The die, the plurality of solder bumps, and the plurality of contacts are encapsulated to expose a lower surface of the plurality of contacts.
摘要翻译： 制造半导体封装的方法包括提供具有多个触点的衬底，该触点具有未被掩模的焊料凸块接触区域。 多个底部填充凸块在焊料凸块接触区域中选择性地形成在多个触点上。 具有多个焊料凸块的裸片位于衬底上，使得多个焊料凸块基本上与多个底部填充凸块垂直对齐。 多个焊料凸块被压入多个底部填充凸块中，直到多个焊料凸块接触多个触点。 多个焊料凸块被回流。 模具，多个焊料凸块和多个触点被封装以暴露多个触点的下表面。
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公开(公告)号：US07414318B2
公开(公告)日：2008-08-19
申请号：US11766095
申请日：2007-06-20
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L21/4828 , H01L23/49548 , H01L23/49568 , H01L24/17 , H01L2224/13099 , H01L2224/16245 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/00
摘要： The present invention provides an etched leadframe flipchip package system comprising forming a leadframe comprises forming contact leads and etching a plurality of multiple dotted grooves on the contact leads, and attaching a flipchip integrated circuit having solder interconnects on the contact leads between each of the plurality of the multiple dotted grooves.
摘要翻译： 本发明提供了一种蚀刻引线框倒装芯片封装系统，包括形成引线框架，包括形成接触引线并在接触引线上蚀刻多个多点状沟槽，以及将具有焊料互连的倒装芯片集成电路连接在多个 多点划线。
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公开(公告)号：US20080272487A1
公开(公告)日：2008-11-06
申请号：US12115510
申请日：2008-05-05
CPC分类号： H01L24/85 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/02166 , H01L2224/04042 , H01L2224/05624 , H01L2224/45015 , H01L2224/451 , H01L2224/45147 , H01L2224/4807 , H01L2224/48091 , H01L2224/48227 , H01L2224/48453 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/48479 , H01L2224/4848 , H01L2224/48482 , H01L2224/48499 , H01L2224/48799 , H01L2224/73265 , H01L2224/78301 , H01L2224/85045 , H01L2224/85051 , H01L2224/85181 , H01L2224/85186 , H01L2224/85205 , H01L2224/85986 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/20752 , H01L2924/00 , H01L2224/48824 , H01L2224/45099 , H01L2924/00015
摘要： A wire bond system including providing an integrated circuit die with a bond pad thereon, forming a soft bump on the bond pad, and wire bonding a hard-metal wire on the soft bump.
摘要翻译： 一种引线接合系统，包括在其上提供具有接合焊盘的集成电路管芯，在接合焊盘上形成软凸点，以及将软质凸起上的硬金属线引线接合。
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公开(公告)号：US07352055B2
公开(公告)日：2008-04-01
申请号：US11562957
申请日：2006-11-22
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/4952 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/11 , H01L2224/1132 , H01L2224/1134 , H01L2224/114 , H01L2224/1147 , H01L2224/116 , H01L2224/13 , H01L2224/13012 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2224/16245 , H01L2224/81011 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2924/00011 , H01L2924/00014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor package includes a substrate having a plurality of lead fingers. A plurality of stud bumps is attached to the plurality of lead fingers. A die having a plurality solder bumps is provided. The plurality of solder bumps is attached to the plurality of stud bumps to form a plurality of electrical connections and provide controlled collapse of the plurality of solder bumps. An encapsulant encapsulates the die, the electrical connections, and the plurality of lead fingers to expose a lower surface of the plurality of lead fingers. The plurality of stud bumps may include a plurality of clusters of stud bumps.
摘要翻译： 半导体封装包括具有多个引线指的基板。 多个螺柱凸起附接到多个引线指。 提供具有多个焊料凸块的模具。 多个焊料凸块被附接到多个柱形凸块以形成多个电连接并且提供多个焊料凸块的受控的倒塌。 密封剂封装模具，电连接和多个引线指，以暴露多个引线指的下表面。 多个凸起凸起可以包括多个螺柱凸块。
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