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公开(公告)号：US10214454B2
公开(公告)日：2019-02-26
申请号：US16040785
申请日：2018-07-20
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Ta-Ching Hsiao , Wen-Po Tu , Chu-Pi Jeng , Mu-Hsi Sung
IPC: C04B35/573 , C04B35/628 , C04B35/626 , C30B35/00 , C01B32/956 , C30B23/00 , C30B29/36
Abstract: A method for manufacturing micropowder is provided, which includes (a) mixing a silicon precursor and a carbon precursor to form a mixture, and heating and keeping the mixture at 1600° C. to 1800° C. under a vacuum and non-oxygen condition for 120 to 180 minutes to form a silicon carbide powder; and (b) heating and keeping the silicon carbide powder at 1900° C. to 2100° C. under non-oxygen condition for 5 to 15 minutes, and then cooling and keeping the silicon carbide powder at 1800° C. to 2000° C. under the non-oxygen condition for 5 to 15 minutes to form micropowder, wherein the micropowder includes a silicon carbide core covered by a carbon film.
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公开(公告)号：US11052348B2
公开(公告)日：2021-07-06
申请号：US15854375
申请日：2017-12-26
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Ta-Ching Hsiao , Chu-Pi Jeng , Kuo-Lun Huang , Mu-Hsi Sung , Keng-Yang Chen , Li-Duan Tsai
Abstract: A method for removing boron is provided, which includes (a) mixing a carbon source material and a silicon source material in a chamber to form a solid state mixture, (b) heating the solid state mixture to a temperature of 1000° C. to 1600° C., and adjusting the pressure of the chamber to 1 torr to 100 torr. The method also includes (c) conducting a gas mixture of a first carrier gas and water vapor into the chamber to remove boron from the solid state mixture, and (d) conducting a second carrier gas into the chamber.
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3.发明授权Metal foil with microcracks, method of manufacturing the same, and sound-absorbing structure having the same 有权具有微裂纹的金属箔，其制造方法和具有该金属箔的吸音结构公开(公告)号：US09251778B2
公开(公告)日：2016-02-02
申请号：US14583204
申请日：2014-12-26
Applicant: Industrial Technology Research Institute
Inventor： Shang-Chih Wang , Shen Tsao , Yu-Tsung Chiu , Chun-Ti Chen , Yu-Yang Su , Mu-Hsi Sung
CPC classification number: B32B3/26 , B32B3/06 , B32B7/005 , B32B15/043 , B32B15/18 , B32B15/20 , B32B2307/102 , C22C9/00 , C22C14/00 , C22C21/00 , C22C38/00 , G10K11/162 , Y10T428/12361
Abstract: A method of manufacturing a metal foil with microcracks includes placing a metal foil between a first material sheet and a second material sheet and then rolling them to form a plurality of microcracks in the metal foil. The microcracks are penetrating, and a sidewall of each of the microcracks is an irregular rough surface. Two ends of each of the microcracks are acute angles. A sound-absorbing structure includes at least one metal foil and a base plate kept at a distance from the metal foil, wherein at least one resonant cavity air layer is formed between the metal foil and the base plate by the distance, and the metal foil has microcracks.
Abstract translation: 制造具有微裂纹的金属箔的方法包括将金属箔放置在第一材料片和第二材料片之间，然后滚动它们以在金属箔中形成多个微裂纹。 微裂纹是穿透的，每个微裂纹的侧壁是不规则的粗糙表面。 每个微裂纹的两端是锐角。 吸声结构包括至少一个金属箔和保持与金属箔一定距离的基板，其中至少一个谐振腔空气层在金属箔和基板之间形成一定距离，金属箔 有微裂纹。
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Patent Agency Ranking
公开(公告)号：US11811357B2
公开(公告)日：2023-11-07
申请号：US17134807
申请日：2020-12-28
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Teng-Yu Wang , Chih-Lung Lin , Mu-Hsi Sung , Neng-Wen Hsieh , Chin-Yueh Li
Abstract: The disclosed embodiments relate to a dismantling device configured for a frame of a PV module. The dismantling device includes a connection portion, a first holding portion, and a second holding portion. The first holding portion is connected to the connection portion and configured to press against one of an inner wall and outer wall of the frame. The second holding portion is slidably disposed on the connection portion and movably closer to or away from the first holding portion along a sliding direction. The second holding portion is configured to press against the other one of the inner wall and the outer wall so as to clamp the frame with the first holding portion and to distort the frame.
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公开(公告)号：US11046582B2
公开(公告)日：2021-06-29
申请号：US16729065
申请日：2019-12-27
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Ta-Ching Hsiao , Chu-Pi Jeng , Mu-Hsi Sung , Kuo-Lun Huang
IPC: C01B32/05 , C01B32/963 , C01B32/97
Abstract: A method of purifying silicon carbide powder includes: providing a container with a surface coated by a nitrogen-removal metal layer, wherein the nitrogen-removal metal layer is tantalum, niobium, tungsten, or a combination thereof; putting a silicon carbide powder into the container to contact the nitrogen-removal metal layer; and heating the silicon carbide powder under an inert gas at a pressure of 400 torr to 760 torr at 1700° C. to 2300° C. for 2 to 10 hours, thereby reducing the nitrogen content of the silicon carbide powder.
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公开(公告)号：US11541351B2
公开(公告)日：2023-01-03
申请号：US17327131
申请日：2021-05-21
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Ta-Ching Hsiao , Chu-Pi Jeng , Kuo-Lun Huang , Mu-Hsi Sung , Keng-Yang Chen , Li-Duan Tsai
Abstract: A method for removing boron is provided, which includes (a) mixing a carbon source material and a silicon source material in a chamber to form a solid state mixture, (b) heating the solid state mixture to a temperature of 1000° C. to 1600° C., and adjusting the pressure of the chamber to 1 torr to 100 torr. The method also includes (c) conducting a gas mixture of a first carrier gas and water vapor into the chamber to remove boron from the solid state mixture, and (d) conducting a second carrier gas into the chamber.
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公开(公告)号：US10059631B2
公开(公告)日：2018-08-28
申请号：US15386749
申请日：2016-12-21
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Ta-Ching Hsiao , Wen-Po Tu , Chu-Pi Jeng , Mu-Hsi Sung
IPC: C04B35/573 , C04B35/628 , C04B35/626 , C01B31/36 , C30B23/00 , C30B29/36
CPC classification number: C04B35/573 , C01B32/956 , C04B35/6267 , C04B35/62675 , C04B35/6268 , C04B35/62839 , C04B35/62897 , C04B2235/3418 , C04B2235/3826 , C04B2235/422 , C04B2235/424 , C04B2235/428 , C04B2235/441 , C04B2235/48 , C04B2235/5427 , C04B2235/5436 , C04B2235/656 , C04B2235/6567 , C04B2235/6584 , C30B23/00 , C30B29/36 , C30B35/007
Abstract: A method for manufacturing micropowder is provided, which includes (a) mixing a silicon precursor and a carbon precursor to form a mixture, and heating and keeping the mixture at 1600° C. to 1800° C. under a vacuum and non-oxygen condition for 120 to 180 minutes to form a silicon carbide powder; and (b) heating and keeping the silicon carbide powder at 1900° C. to 2100° C. under non-oxygen condition for 5 to 15 minutes, and then cooling and keeping the silicon carbide powder at 1800° C. to 2000° C. under the non-oxygen condition for 5 to 15 minutes to form micropowder, wherein the micropowder includes a silicon carbide core covered by a carbon film.
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8.发明申请METAL FOIL WITH MICROCRACKS, METHOD OF MANUFACTURING THE SAME, AND SOUND-ABSORBING STRUCTURE HAVING THE SAME 有权具有微裂纹的金属箔，其制造方法以及具有相同吸收结构的吸收结构公开(公告)号：US20150356962A1
公开(公告)日：2015-12-10
申请号：US14583204
申请日：2014-12-26
Applicant: Industrial Technology Research Institute
Inventor： Shang-Chih Wang , Shen Tsao , Yu-Tsung Chiu , Chun-Ti Chen , Yu-Yang Su , Mu-Hsi Sung
IPC: G10K11/00
CPC classification number: B32B3/26 , B32B3/06 , B32B7/005 , B32B15/043 , B32B15/18 , B32B15/20 , B32B2307/102 , C22C9/00 , C22C14/00 , C22C21/00 , C22C38/00 , G10K11/162 , Y10T428/12361
Abstract: A method of manufacturing a metal foil with microcracks includes placing a metal foil between a first material sheet and a second material sheet and then rolling them to form a plurality of microcracks in the metal foil. The microcracks are penetrating, and a sidewall of each of the microcracks is an irregular rough surface. Two ends of each of the microcracks are acute angles. A sound-absorbing structure includes at least one metal foil and a base plate kept at a distance from the metal foil, wherein at least one resonant cavity air layer is formed between the metal foil and the base plate by the distance, and the metal foil has microcracks.
Abstract translation: 制造具有微裂纹的金属箔的方法包括将金属箔放置在第一材料片和第二材料片之间，然后滚动它们以在金属箔中形成多个微裂纹。 微裂纹是穿透的，每个微裂纹的侧壁是不规则的粗糙表面。 每个微裂纹的两端是锐角。 吸声结构包括至少一个金属箔和保持与金属箔一定距离的基板，其中至少一个谐振腔空气层在金属箔和基板之间形成一定距离，金属箔 有微裂纹。
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