公开(公告)号：US20140117531A1

公开(公告)日：2014-05-01

申请号：US13664418

申请日：2012-10-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Joachim MAHLER ,  Edward FUERGUT ,  Khalil HOSSEINI ,  Georg MEYER-BERG

IPC: H01L23/29 ,  H01L21/56

CPC classification number: H01L23/291 ,  H01L21/561 ,  H01L21/568 ,  H01L23/296 ,  H01L23/562 ,  H01L23/564 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Described are techniques related to semiconductor devices that make use of encapsulant. In one implementation, a semiconductor device may be manufactured to include at least an encapsulant that includes at least glass particles.

Abstract translation: 描述了与使用密封剂的半导体器件有关的技术。 在一个实施方案中，可以制造半导体器件以至少包括至少包括玻璃颗粒的密封剂。

公开(公告)号：US20150035170A1

公开(公告)日：2015-02-05

申请号：US13959712

申请日：2013-08-05

Applicant: Infineon Technologies AG

Inventor： Ivan NIKITIN ,  Joachim MAHLER ,  Khalil HOSSEINI

IPC: H01L25/07 ,  H01L23/367

CPC classification number: H01L25/074 ,  H01L23/3121 ,  H01L23/367 ,  H01L23/3735 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49827 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/071 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/06181 ,  H01L2224/08168 ,  H01L2224/32225 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/3716 ,  H01L2224/40101 ,  H01L2224/40137 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8382 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/141 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076

Abstract: A device includes a substrate including an electrically insulating core, a first electrically conductive material arranged over a first main surface of the substrate, and a second electrically conductive material arranged over a second main surface of the substrate opposite to the first main surface. The device further includes an electrically conductive connection extending from the first main surface to the second main surface and electrically coupling the first electrically conductive material and the second electrically conductive material, a first semiconductor chip arranged over the first main surface and electrically coupled to the first electrically conductive material, and a second semiconductor chip arranged over the second main surface and electrically coupled to the second electrically conductive material.

Abstract translation: 一种器件包括：衬底，其包括电绝缘芯，布置在衬底的第一主表面上的第一导电材料和布置在与第一主表面相对的衬底的第二主表面上的第二导电材料。 该装置还包括从第一主表面延伸到第二主表面并且电耦合第一导电材料和第二导电材料的导电连接，第一半导体芯片，布置在第一主表面上并电耦合到第一导电材料 导电材料和布置在第二主表面上并电耦合到第二导电材料的第二半导体芯片。