公开(公告)号：US09282650B2

公开(公告)日：2016-03-08

申请号：US14132883

申请日：2013-12-18

Applicant: Intel Corporation

Inventor： Hemanth Dhavaleswarapu ,  Zhihua Li ,  Joseph Petrini ,  Steven B. Roach ,  Shankar Devasenathipathy ,  George Kostiew ,  Amram Eitan

IPC: B23K37/00 ,  H05K3/34 ,  B23K1/00 ,  B23K3/04 ,  H01L23/00 ,  B23K3/08 ,  B23K20/02

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K3/04 ,  B23K3/08 ,  B23K3/085 ,  B23K20/002 ,  B23K20/023 ,  B23K20/026 ,  B23K20/26 ,  B23K35/0244 ,  B23K37/003 ,  B23K2101/42 ,  B33Y80/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/75102 ,  H01L2224/75252 ,  H01L2224/75266 ,  H01L2224/75301 ,  H01L2224/75502 ,  H01L2224/7555 ,  H01L2224/81097 ,  H01L2224/81098 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/81948 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2203/04 ,  H05K2203/1121 ,  H01L2924/014 ,  H01L2924/00012

Abstract: Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.

Abstract translation: 公开了热压接（TCB）工艺冷却歧管，TCB工艺系统和使用冷却歧管的TCB方法的实施例。 在一些实施例中，冷却歧管包括通过挡板与混合室分离的预混合室。 挡板可以包括通过挡板形成的至少一个同心图案，使得预混合室中的主要冷却流体基本均匀地分布到混合室。 预混合室可以连接到主冷却流体源。 混合室可以具有被配置为接受主冷却流体的输入和输出以输出主冷却流体的输入。

公开(公告)号：US09748199B2

公开(公告)日：2017-08-29

申请号：US15062298

申请日：2016-03-07

Applicant: Intel Corporation

Inventor： Hemanth Dhavaleswarapu ,  Zhihua Li ,  Joseph Petrini ,  Steven B. Roach ,  Shankar Devasenathipathy ,  George Kostiew ,  Amram Eitan

IPC: B23K31/02 ,  H01L23/00 ,  H05K3/34 ,  B23K1/00 ,  B23K3/04 ,  B23K37/00 ,  B23K3/08 ,  B23K20/02 ,  B23K20/00 ,  B23K20/26 ,  B23K35/02 ,  B23K101/42 ,  B33Y80/00

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K3/04 ,  B23K3/08 ,  B23K3/085 ,  B23K20/002 ,  B23K20/023 ,  B23K20/026 ,  B23K20/26 ,  B23K35/0244 ,  B23K37/003 ,  B23K2101/42 ,  B33Y80/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/75102 ,  H01L2224/75252 ,  H01L2224/75266 ,  H01L2224/75301 ,  H01L2224/75502 ,  H01L2224/7555 ,  H01L2224/81097 ,  H01L2224/81098 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/81948 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2203/04 ,  H05K2203/1121 ,  H01L2924/014 ,  H01L2924/00012

Abstract: Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.