公开(公告)号：US08772924B2

公开(公告)日：2014-07-08

申请号：US13852277

申请日：2013-03-28

Applicant: Intel Corporation

Inventor： Ravi Nalla ,  Mathew J. Manusharow

IPC: H01L21/02

CPC classification number: H01L24/20 ,  H01L21/568 ,  H01L21/768 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/12105 ,  H01L2224/13021 ,  H01L2224/2101 ,  H01L2224/221 ,  H01L2224/24227 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H05K1/0209 ,  H05K1/185 ,  H05K3/4682

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a die to a carrier material, forming dielectric material surrounding the die, forming buildup layers in the dielectric material to form a coreless bumpless buildup package structure, and patterning the carrier material to form microchannel structures on the package structure.

Abstract translation: 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法可以包括将管芯附接到载体材料，形成围绕管芯的电介质材料，在电介质材料中形成堆积层，以形成无芯无阻堆积的封装结构，以及图案化载体材料以在封装结构上形成微通道结构。

公开(公告)号：US09040842B2

公开(公告)日：2015-05-26

申请号：US13867851

申请日：2013-04-22

Applicant: Intel Corporation

Inventor： Ravi Nalla ,  Omar Bchir ,  Houssam Jomaa

IPC: H01L23/00 ,  H05K3/38 ,  H05K3/46 ,  H05K1/02 ,  H05K3/18

CPC classification number: H01L23/53238 ,  C08J5/18 ,  C08J2363/00 ,  H01L24/26 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0298 ,  H05K3/181 ,  H05K3/381 ,  H05K3/4661 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/0773 ,  H05K2203/0796 ,  Y10T156/1052 ,  Y10T428/249921 ,  Y10T428/254 ,  Y10T428/268 ,  H01L2924/00

Abstract: In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.

Abstract translation: 在一些实施方案中，提出了铜金属化与具有部分固化的环氧树脂填料的电介质的改进的机械粘附。 在这方面，引入具有环氧树脂材料和多个环氧微球的衬底累积膜，其中微球的内部未完全固化。 还公开并要求保护其他实施例。