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公开(公告)号:US20140273309A1
公开(公告)日:2014-09-18
申请号:US14051287
申请日:2013-10-10
Applicant: Intermolecular, Inc.
Inventor: Sandip Niyogi , Sean Barstow , Jay Dedontney , Chi-I Lang , Ratsamee Limdulpaiboon , Martin Romero , Sunil Shanker , James Tsung , J. Watanabe
CPC classification number: H01L21/30 , B01J19/0046 , B01J2219/00283 , B01J2219/00286 , B01J2219/00301 , B01J2219/00313 , B01J2219/0038 , B01J2219/00382 , B01J2219/00416 , B01J2219/00418 , B01J2219/00527 , B01J2219/00585 , B08B3/04 , C23C14/08 , C23C14/22 , C23C14/34 , C23C18/1619 , C23C18/1682 , C25D17/02 , G11C13/0004 , H01L21/02104 , H01L21/30604 , H01L21/67051 , H01L21/67057 , H01L21/6719 , H01L22/10 , H01L22/12 , H01L22/14 , H01L27/2463 , H01L45/1608
Abstract: Remote-plasma treatments of surfaces, for example in semiconductor manufacture, can be improved by preferentially exposing the surface to only a selected subset of the plasma species generated by the plasma source. The probability that a selected species reaches the surface, or that an unselected species is quenched or otherwise converted or diverted before reaching the surface, can be manipulated by introducing additional gases with selected properties either at the plasma source or in the process chamber, varying chamber pressure or flow rate to increase or decrease collisions, or changing the dimensions or geometry of the injection ports, conduits and other passages traversed by the species. Some example processes treat surfaces preferentially with relatively low-energy radicals, vary the concentration of radicals at the surface in real time, or clean and passivate in the same unit process.
Abstract translation: 可以通过优选地将表面暴露于由等离子体源产生的等离子体物质的选定子集中来改善表面的远程等离子体处理,例如在半导体制造中。 所选择的物种到达表面的可能性,或未被选择的物质在到达表面之前被淬灭或以其他方式转化或转移的可能性可以通过在等离子体源或处理室,变化室中引入具有选定性质的附加气体来操纵 压力或流量以增加或减少碰撞,或改变注射口,管道和由物种穿过的其它通道的尺寸或几何形状。 一些示例性过程优先用相对低能量的基团处理表面,实时地改变表面处的自由基的浓度,或者在相同的单元过程中清洁和钝化。
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公开(公告)号:US20140174910A1
公开(公告)日:2014-06-26
申请号:US13725760
申请日:2012-12-21
Applicant: INTERMOLECULAR, INC.
Inventor: Jay Dedontney
IPC: C23C14/34
CPC classification number: C23C14/34 , B01J19/0046 , B01J2219/0043 , B01J2219/00527 , B01J2219/00754 , B01J2219/00756 , H01J37/32082 , H01J37/3244 , H01J37/34 , H01J37/3411 , H01J37/3417 , H01J37/3435 , H01J37/3497
Abstract: A shielding component and a sputter gun are described. The sputter gun has a housing. The housing has a region configured to expose a target surface. The shielding component extends around an inward facing periphery of the region. The shielding component comprises metal foam. The shielding component is configured to provide a fluid proximate to the target surface. An annular channel may be arranged to provide a gas through pores of the metal foam of the shielding component, to the region proximate to the target.
Abstract translation: 描述了屏蔽部件和溅射枪。 溅射枪具有外壳。 壳体具有被配置为暴露目标表面的区域。 屏蔽部件围绕该区域的面向内的周边延伸。 屏蔽部件包括金属泡沫。 屏蔽部件被配置为提供靠近目标表面的流体。 可以布置环形通道以将气体通过屏蔽部件的金属泡沫的孔提供到靠近靶的区域。
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