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    TRANSIENT THERMAL MANAGEMENT SYSTEMS FOR SEMICONDUCTOR DEVICES
    3.
    发明申请
    TRANSIENT THERMAL MANAGEMENT SYSTEMS FOR SEMICONDUCTOR DEVICES 有权
    用于半导体器件的瞬态热管理系统

    公开(公告)号：US20130329358A1

    公开(公告)日：2013-12-12

    申请号：US13977402

    申请日：2011-12-27

    申请人： Sandeep Ahuja ,  Ioan Sauciuc ,  Susan F. Smith

    发明人： Sandeep Ahuja ,  Ioan Sauciuc ,  Susan F. Smith

    IPC分类号： H01L23/473 ,  G06F1/20

    CPC分类号： H01L23/473 ,  G06F1/206 ,  H01L23/34 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Thermal management systems for semiconductor devices are provided. Embodiments of the invention provide two or more liquid cooling subsystems that are each capable of providing active cooling to one or more semiconductor devices, such as packaged processors. In operation, a first liquid cooling subsystem can provide active cooling to the semiconductor device(s) while the second cooling subsystem is circulating a heat transfer fluid within its own subsystem. The second liquid cooling subsystem can be then switched into operation and provides active cooling to the semiconductor device(s) while the first cooling subsystem is circulating heat transfer fluid within its own subsystem. In alternate embodiments, the heat transfer fluid remains in the subsystem, but does not circulate within the subsystem when the subsystem is not providing cooling to the semiconductor device(s). The subsystems comprise heat dissipation units. The switching between cooling systems allows the semiconductor device(s) to be maintained at a lower operating temperature than if switching between cooling subsystems were not employed.

    摘要翻译： 提供半导体器件的热管理系统。 本发明的实施例提供两个或更多个液体冷却子系统，每个液体冷却子系统能够向一个或多个半导体器件（例如封装的处理器）提供主动冷却。 在操作中，第一液体冷却子系统可以向半导体器件提供主动冷却，而第二冷却子系统在其自身子系统内循环传热流体。 然后可以将第二液体冷却子系统切换到操作中，并且在第一冷却子系统在其自己的子系统内循环传热流体时，向半导体装置提供主动冷却。 在替代实施例中，传热流体保留在子系统中，但是当子系统不向半导体器件提供冷却时，该子系统不会在子系统内循环。 子系统包括散热单元。 冷却系统之间的切换允许半导体器件保持在比不使用冷却子系统之间切换的较低的工作温度。

    Cooling arrangement to cool components on circuit board
    4.
    发明授权
    Cooling arrangement to cool components on circuit board 失效
    冷却电路板组件冷却

    公开(公告)号：US07751189B2

    公开(公告)日：2010-07-06

    申请号：US11852158

    申请日：2007-09-07

    申请人： Sandeep Ahuja ,  Ioan Sauciuc

    发明人： Sandeep Ahuja ,  Ioan Sauciuc

    IPC分类号： H05K7/20

    CPC分类号： G06F1/20 ,  H05K7/20727

    摘要： A circuit board including a blower thereon to cool a heat generating arrangement. The circuit board includes a board substrate; a blower disposed on the board substrate, the blower having an inlet adapted to take in coolant in a inlet direction, and an outlet adapted to blow out coolant in a first outlet direction extending at an angle with respect to the inlet direction; and a heat-generating arrangement disposed on the board substrate such that the blower is adapted to blow out coolant in the first outlet direction to cool the heat generating arrangement.

    摘要翻译： 一种电路板，包括用于冷却发热装置的鼓风机。 电路板包括板基板; 鼓风机，其布置在所述板基板上，所述鼓风机具有适于沿入口方向吸入冷却剂的入口，以及适于沿相对于所述入口方向以一定角度延伸的第一出口方向吹出冷却剂的出口; 以及设置在所述板基板上的发热装置，使得所述鼓风机适于在所述第一出口方向上吹出冷却剂以冷却所述发热装置。

    Cooling Arrangement to Cool Components on Circuit Board
    5.
    发明申请
    Cooling Arrangement to Cool Components on Circuit Board 失效
    冷却布置以冷却电路板上的组件

    公开(公告)号：US20090080156A1

    公开(公告)日：2009-03-26

    申请号：US11852158

    申请日：2007-09-07

    申请人： Sandeep Ahuja ,  Ioan Sauciuc

    发明人： Sandeep Ahuja ,  Ioan Sauciuc

    IPC分类号： H05K7/20

    CPC分类号： G06F1/20 ,  H05K7/20727

    摘要： A circuit board including a blower thereon to cool a heat generating arrangement. The circuit board includes a board substrate; a blower disposed on the board substrate, the blower having an inlet adapted to take in coolant in a inlet direction, and an outlet adapted to blow out coolant in a first outlet direction extending at an angle with respect to the inlet direction; and a heat-generating arrangement disposed on the board substrate such that the blower is adapted to blow out coolant in the first outlet direction to cool the heat generating arrangement.

    摘要翻译： 一种电路板，包括用于冷却发热装置的鼓风机。 电路板包括板基板; 鼓风机，其布置在所述板基板上，所述鼓风机具有适于沿入口方向吸入冷却剂的入口，以及适于沿相对于所述入口方向以一定角度延伸的第一出口方向吹出冷却剂的出口; 以及设置在所述板基板上的发热装置，使得所述鼓风机适于在所述第一出口方向上吹出冷却剂以冷却所述发热装置。

    Transient thermal management systems for semiconductor devices
    6.
    发明授权
    Transient thermal management systems for semiconductor devices 有权
    半导体器件瞬态热管理系统

    公开(公告)号：US09142482B2

    公开(公告)日：2015-09-22

    申请号：US13977402

    申请日：2011-12-27

    申请人： Sandeep Ahuja ,  Ioan Sauciuc ,  Susan F. Smith

    发明人： Sandeep Ahuja ,  Ioan Sauciuc ,  Susan F. Smith

    IPC分类号： H05K7/20 ,  H01L23/473 ,  H01L23/34 ,  G06F1/20

    CPC分类号： H01L23/473 ,  G06F1/206 ,  H01L23/34 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Thermal management systems for semiconductor devices are provided. Embodiments of the invention provide two or more liquid cooling subsystems that are each capable of providing active cooling to one or more semiconductor devices, such as packaged processors. In operation, a first liquid cooling subsystem can provide active cooling to the semiconductor device(s) while the second cooling subsystem is circulating a heat transfer fluid within its own subsystem. The second liquid cooling subsystem can be then switched into operation and provides active cooling to the semiconductor device(s) while the first cooling subsystem is circulating heat transfer fluid within its own subsystem. In alternate embodiments, the heat transfer fluid remains in the subsystem, but does not circulate within the subsystem when the subsystem is not providing cooling to the semiconductor device(s). The subsystems comprise heat dissipation units. The switching between cooling systems allows the semiconductor device(s) to be maintained at a lower operating temperature than if switching between cooling subsystems were not employed.

    摘要翻译： 提供半导体器件的热管理系统。 本发明的实施例提供两个或更多个液体冷却子系统，每个液体冷却子系统能够向一个或多个半导体器件（例如封装的处理器）提供主动冷却。 在操作中，第一液体冷却子系统可以向半导体器件提供主动冷却，而第二冷却子系统在其自身子系统内循环传热流体。 然后可以将第二液体冷却子系统切换到操作中，并且在第一冷却子系统在其自己的子系统内循环传热流体时，向半导体装置提供主动冷却。 在替代实施例中，传热流体保留在子系统中，但是当子系统不向半导体器件提供冷却时，该子系统不会在子系统内循环。 子系统包括散热单元。 冷却系统之间的切换允许半导体器件保持在比不使用冷却子系统之间切换的较低的工作温度。

    Integrated heat sink assembly
    10.
    发明申请
    Integrated heat sink assembly 审中-公开
    集成散热器总成

    公开(公告)号：US20050117305A1

    公开(公告)日：2005-06-02

    申请号：US10725825

    申请日：2003-12-01

    申请人： Neal Ulen ,  David Shia ,  Sandeep Ahuja

    发明人： Neal Ulen ,  David Shia ,  Sandeep Ahuja

    IPC分类号： H01L23/40 ,  H05K7/20

    CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Some disclosed embodiments include an integrated heat sink assembly having a standoff press disposed through the bottom of a bore in a support base of the heat sink, a screw disposed through the top of the bore in the support base of the heat sink, a spring adapted to bias the screw against the heat sink, wherein the screw and spring engage the standoff to attach the heat sink to the support base. The integrated heat sink assembly may be used to maintain contact between a heat sink and a processor on a motherboard. Other embodiments are disclosed and claimed.

    摘要翻译： 一些公开的实施例包括集成散热器组件，其具有穿过散热器的支撑底座中的孔的底部设置的支架压盖，穿过散热器的支撑基座中的孔的顶部设置的螺钉，适于 以将所述螺钉偏置抵靠所述散热器，其中所述螺钉和弹簧接合所述支座以将所述散热器附接到所述支撑基座。 集成散热器组件可用于保持散热器与主板上的处理器之间的接触。 公开和要求保护其他实施例。