公开(公告)号：US06672779B2

公开(公告)日：2004-01-06

申请号：US10244755

申请日：2002-09-17

申请人： Issei Ueda ,  Shinichi Hayashi ,  Naruaki Iida ,  Yuji Matsuyama ,  Yoichi Deguchi

发明人： Issei Ueda ,  Shinichi Hayashi ,  Naruaki Iida ,  Yuji Matsuyama ,  Yoichi Deguchi

IPC分类号： G03D500

CPC分类号： H01L21/67161 ,  G07C9/00103 ,  G07C9/00111 ,  G08G3/00 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67754 ,  Y10S134/902 ,  Y10S414/14

摘要： Thermal processing unit sections each with ten tiers and coating processing unit sections each with five tiers are disposed around a first main wafer transfer section and a second main wafer transfer section, and in the thermal processing unit section, the influence of the time required for substrate temperature regulation processing on a drop in throughput can be reduced greatly by transferring the wafer W while the temperature of the wafer W is being regulated by a temperature regulation and transfer device.

摘要翻译： 在第一主晶片传送部和第二主晶片传送部的周围配置具有10层的热处理单元部和各层的涂布处理单元部，并且在热处理单元部中，对基板所需的时间的影响 通过在晶片W的温度由温度调节和转移装置调节的同时转移晶片W可以大大降低生产率下降的温度调节处理。

公开(公告)号：US06471422B2

公开(公告)日：2002-10-29

申请号：US10122333

申请日：2002-04-16

申请人： Issei Ueda ,  Shinichi Hayashi ,  Naruaki Iida ,  Yuji Matsuyama ,  Yoichi Deguchi

发明人： Issei Ueda ,  Shinichi Hayashi ,  Naruaki Iida ,  Yuji Matsuyama ,  Yoichi Deguchi

IPC分类号： G03D500

CPC分类号： H01L21/67161 ,  G07C9/00103 ,  G07C9/00111 ,  G08G3/00 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67754 ,  Y10S134/902 ,  Y10S414/14

摘要： Thermal processing unit sections each with ten tiers and coating processing unit sections each with five tiers are disposed around a first main wafer transfer section and a second main wafer transfer section, and in the thermal processing unit section, the influence of the time required for substrate temperature regulation processing on a drop in throughput can be reduced greatly by transferring the wafer W while the temperature of the wafer W is being regulated by a temperature regulation and transfer device.

公开(公告)号：US06402401B1

公开(公告)日：2002-06-11

申请号：US09688140

申请日：2000-10-16

申请人： Issei Ueda ,  Shinichi Hayashi ,  Naruaki Iida ,  Yuji Matsuyama ,  Yoichi Deguchi

发明人： Issei Ueda ,  Shinichi Hayashi ,  Naruaki Iida ,  Yuji Matsuyama ,  Yoichi Deguchi

IPC分类号： G03D500

CPC分类号： H01L21/67161 ,  G07C9/00103 ,  G07C9/00111 ,  G08G3/00 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67754 ,  Y10S134/902 ,  Y10S414/14

摘要： Thermal processing unit sections each with ten tiers and coating processing unit sections each with five tiers are disposed around a first main wafer transfer section and a second main wafer transfer section, and in the thermal processing unit section, the influence of the time required for substrate temperature regulation processing on a drop in throughput can be reduced greatly by transferring the wafer W while the temperature of the wafer W is being regulated by a temperature regulation and transfer device.

摘要翻译： 在第一主晶片传送部和第二主晶片传送部的周围配置具有10层的热处理单元部和各层的涂布处理单元部，并且在热处理单元部中，对基板所需的时间的影响 通过在晶片W的温度由温度调节和转移装置调节的同时转移晶片W可以大大降低生产率下降的温度调节处理。

公开(公告)号：US5826129A

公开(公告)日：1998-10-20

申请号：US496319

申请日：1995-06-29

申请人： Keizo Hasebe ,  Shinji Nagashima ,  Norio Semba ,  Masami Akimoto ,  Yoshio Kimura ,  Naruaki Iida ,  Kouji Harada ,  Issei Ueda ,  Nobuo Konishi

发明人： Keizo Hasebe ,  Shinji Nagashima ,  Norio Semba ,  Masami Akimoto ,  Yoshio Kimura ,  Naruaki Iida ,  Kouji Harada ,  Issei Ueda ,  Nobuo Konishi

IPC分类号： H01L21/00 ,  G03D5/00

CPC分类号： H01L21/67173 ,  H01L21/67178 ,  H01L21/67184

摘要： This invention provides a substrate processing system including a cassette station on which at least one cassette containing a plurality of objects is placed, a process station including a plurality of process chambers for performing processing for the objects, and an object conveying unit for loading the objects into the process chambers and unloading the objects from the process chambers, a first object transfer unit for transferring the objects between the cassette station and the process station, and an interface section including an object waiting region where the objects wait, and a second object transfer unit for transferring the objects to the process station, wherein the process chambers in the process station are arranged around the object conveying unit, and the object conveying unit has a rotating shaft almost parallel to the vertical direction and can move up and down in the vertical direction along the rotating shaft and rotate about the rotating shaft.

摘要翻译： 本发明提供了一种基板处理系统，其包括：盒站，其上放置有至少一个包含多个物体的盒;处理站，包括用于对物体进行处理的多个处理室;以及物体传送单元，用于装载物体 进入处理室并从处理室卸载物体，第一物体传送单元，用于在物体站和处理站之间传送物体，以及接口部分，其包括物体等待的对象等待区域，以及第二物体传送 用于将物体传送到处理站的单元，其中处理站中的处理室围绕物体传送单元布置，物体传送单元具有几乎平行于垂直方向的旋转轴，并且可以在竖直方向上上下移动 沿着旋转轴的方向旋转并围绕旋转轴旋转。

公开(公告)号：US20070127916A1

公开(公告)日：2007-06-07

申请号：US11673257

申请日：2007-02-09

申请人： Junichi Kitano ,  Yuji Matsuyama ,  Takahiro Kitano ,  Takayuki Katano ,  Hidefumi Matsui ,  Yo Suzuki ,  Masami Yamashita ,  Toru Aoyama ,  Hiroyuki Iwaki ,  Satoru Shimura ,  Masatoshi Deguchi ,  Kousuke Yoshihara ,  Naruaki Iida

发明人： Junichi Kitano ,  Yuji Matsuyama ,  Takahiro Kitano ,  Takayuki Katano ,  Hidefumi Matsui ,  Yo Suzuki ,  Masami Yamashita ,  Toru Aoyama ,  Hiroyuki Iwaki ,  Satoru Shimura ,  Masatoshi Deguchi ,  Kousuke Yoshihara ,  Naruaki Iida

IPC分类号： G03D5/00

CPC分类号： H01L21/67178 ,  G03F7/70991 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67184 ,  H01L21/67742 ,  H01L21/67778 ,  Y10T29/41

摘要： On top of respective areas divided by partition plates, that is, a cassette station, a processing station, and an interface section in a coating and developing processing system, gas supply sections for supplying an inert gas into the respective areas are provided. Exhaust pipes for exhausting atmospheres in the respective areas are provided at the bottom of the respective areas. The atmospheres in the respective areas are maintained in a clean condition by supplying the inert gas not containing impurities such as oxygen and fine particles from the respective gas supply sections into the respective areas and exhausting the atmospheres in the respective areas from the exhaust pipes.

摘要翻译： 在涂覆和显影处理系统中由分隔板，即盒式磁带站，加工站和界面部分划分的各个区域之上，提供用于向各个区域供应惰性气体的气体供应部分。 在各个区域的底部设置用于各区域的排气的排气管。 通过将不含杂质的惰性气体（例如氧气和细颗粒）从各个气体供应区域供应到各个区域中并且从排气管排出各个区域中的气氛，将各个区域中的气氛保持在清洁状态。

公开(公告)号：US07208066B2

公开(公告)日：2007-04-24

申请号：US10649780

申请日：2003-08-28

申请人： Junichi Kitano ,  Yuji Matsuyama ,  Takahiro Kitano ,  Takayuki Katano ,  Hidefumi Matsui ,  Yo Suzuki ,  Masami Yamashita ,  Toru Aoyama ,  Hiroyuki Iwaki ,  Satoru Shimura ,  Masatoshi Deguchi ,  Kousuke Yoshihara ,  Naruaki Iida

发明人： Junichi Kitano ,  Yuji Matsuyama ,  Takahiro Kitano ,  Takayuki Katano ,  Hidefumi Matsui ,  Yo Suzuki ,  Masami Yamashita ,  Toru Aoyama ,  Hiroyuki Iwaki ,  Satoru Shimura ,  Masatoshi Deguchi ,  Kousuke Yoshihara ,  Naruaki Iida

IPC分类号： C23F1/00 ,  H01L21/306 ,  B05C11/00

CPC分类号： H01L21/67178 ,  G03F7/70991 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67184 ,  H01L21/67742 ,  H01L21/67778 ,  Y10T29/41

摘要： On top of respective areas divided by partition plates, that is, a cassette station, a processing station, and an interface section in a coating and developing processing system, gas supply sections for supplying an inert gas into the respective areas are provided. Exhaust pipes for exhausting atmospheres in the respective areas are provided at the bottom of the respective areas. The atmospheres in the respective areas are maintained in a clean condition by supplying the inert gas not containing impurities such as oxygen and fine particles from the respective gas supply sections into the respective areas and exhausting the atmospheres in the respective areas from the exhaust pipes.

摘要翻译： 在涂覆和显影处理系统中由分隔板，即盒式磁带站，加工站和界面部分划分的各个区域之上，提供用于向各个区域供应惰性气体的气体供应部分。 在各个区域的底部设置用于各区域的排气的排气管。 通过将不含杂质的惰性气体（例如氧气和细颗粒）从各个气体供应区域供应到各个区域中并且从排气管排出各个区域中的气氛，将各个区域中的气氛保持在清洁状态。

公开(公告)号：US20070128356A1

公开(公告)日：2007-06-07

申请号：US11673299

申请日：2007-02-09

申请人： Yuji Matsuyama ,  Takahiro Kitano ,  Masatoshi Deguchi ,  Kousuke Yoshihara ,  Naruaki Iida

发明人： Yuji Matsuyama ,  Takahiro Kitano ,  Masatoshi Deguchi ,  Kousuke Yoshihara ,  Naruaki Iida

IPC分类号： B05D3/12 ,  B05D1/40

CPC分类号： H01L21/67178 ,  G03F7/70991 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67184 ,  H01L21/67742 ,  H01L21/67778

摘要： On top of respective areas divided by partition plates, that is, a cassette station, a processing station, and an interface section in a coating and developing processing system, gas supply sections for supplying an inert gas into the respective areas are provided. Exhaust pipes for exhausting atmospheres in the respective areas are provided at the bottom of the respective areas. The atmospheres in the respective areas are maintained in a clean condition by supplying the inert gas not containing impurities such as oxygen and fine particles from the respective gas supply sections into the respective areas and exhausting the atmospheres in the respective areas from the exhaust pipes.

公开(公告)号：US08720873B2

公开(公告)日：2014-05-13

申请号：US13418731

申请日：2012-03-13

申请人： Shinichi Hayashi ,  Suguru Enokida ,  Naruaki Iida ,  Hideki Kajiwara

发明人： Shinichi Hayashi ,  Suguru Enokida ,  Naruaki Iida ,  Hideki Kajiwara

IPC分类号： B25B1/00 ,  B24B5/00 ,  B24B29/00 ,  A47J45/00 ,  H01L21/683

CPC分类号： H01L21/6838

摘要： A substrate holding device including: a transfer arm body having a suction path; a pad body including a suction part having a suction surface and a suction port for holding the substrate by vacuum suction, and a cylindrical attachment part in which a suction hole communicating with the suction port is formed; a pad holding member provided with an insertion hole into which the attachment part of the pad body is loosely insertable and a communication path communicating with the suction hole and the suction path, and fixed to the transfer arm body; and an elastically deformable annular airtightness maintaining member with a circular cross-section interposed between an outer peripheral groove in an arc shape formed in the attachment part of the pad body and an inner peripheral groove in an arc shape formed at the insertion hole of the pad holding member.

摘要翻译： 一种基板保持装置，包括：具有吸入路径的传送臂主体; 包括具有吸入面的吸引部和通过真空吸附保持基板的吸入口的垫体，以及形成有与吸入口连通的吸入孔的圆筒状的安装部， 衬垫保持构件，其具有插入孔，所述垫体的安装部可松动地插入该插入孔中;以及连通路，其与所述吸入孔和所述吸入路径连通，并且固定到所述传送臂本体; 以及形成在所述垫主体的安装部分中的弧形外周槽和形成在所述垫的插入孔中的弧形的内周槽之间的具有圆形横截面的可弹性变形的环形气密保持构件 控股成员

公开(公告)号：US07758340B2

公开(公告)日：2010-07-20

申请号：US11617319

申请日：2006-12-28

申请人： Masami Akimoto ,  Shinichi Hayashi ,  Naruaki Iida ,  Hiroaki Inadomi

发明人： Masami Akimoto ,  Shinichi Hayashi ,  Naruaki Iida ,  Hiroaki Inadomi

IPC分类号： F27D3/00

CPC分类号： F27B17/0025 ,  F27B5/04 ,  F27D5/0037 ,  F27D15/02 ,  H01L21/67109 ,  H01L21/67748 ,  H01L21/67784 ,  Y10S414/139

摘要： A heating device provided with a cooling plate and a heating plate is formed in a low height, and floats a substrate above the cooling plate and the heating plate and moves the substrate horizontally between the cooling plate and the heating plate by the pressure of a gas. A heating device 2 includes a cooling plate 3 provided with flotation gas spouting ports 3a, and a heating plate provided with flotation gas spouting ports. The flotation gas spouting ports 3a and 3b are arranged along a wafer moving passage and are formed so as to spout the gas obliquely upward toward a first end of the wafer moving passage on the side of the cooling plate. A pushing member 51 is brought into contact with a back part of a wafer W with respect to a direction in which the wafer W is moved to move the wafer W in a direction toward the heating plate 6 opposite a direction in which the flotation gas is spouted. The pushing member 51 is brought into contact with a back part of a wafer W with respect to a direction in which the wafer W is moved to move the wafer W in a direction toward the cooling plate 3 in which the flotation gas is spouted.

摘要翻译： 设置有冷却板和加热板的加热装置形成为低高度，并且浮动冷却板和加热板上方的基板，并且通过气体的压力将基板水平地移动到冷却板和加热板之间 。 加热装置2包括具有浮选气体吐出口3a的冷却板3和设置有浮选气体吐出口的加热板。 浮选气体喷出口3a，3b沿着晶片移动通道排列，形成为向冷却板侧的晶片移动通道的第一端倾斜向上喷出气体。 推动构件51相对于晶片W移动的方向与晶片W的后部接触，以使晶片W朝向加热板6的方向移动，该方向与浮选气体的方向相反 喷出 推动构件51相对于晶片W移动的方向与晶片W的后部接触，以朝向其中喷出浮选气体的冷却板3的方向移动晶片W.

公开(公告)号：US20120235335A1

公开(公告)日：2012-09-20

申请号：US13418731

申请日：2012-03-13

申请人： Shinichi Hayashi ,  Suguru Enokida ,  Naruaki Iida ,  Hideki Kajiwara

发明人： Shinichi Hayashi ,  Suguru Enokida ,  Naruaki Iida ,  Hideki Kajiwara

IPC分类号： H01L21/683 ,  B25B11/00

CPC分类号： H01L21/6838

摘要： The present invention is a substrate holding device including: a transfer arm body having a suction path; a pad body including a suction part having a suction surface and a suction port for holding the substrate by vacuum suction, and a cylindrical attachment part in which a suction hole communicating with the suction port is formed; a pad holding member provided with an insertion hole into which the attachment part of the pad body is loosely insertable and a communication path communicating with the suction hole and the suction path, and fixed to the transfer arm body; and an elastically deformable annular airtightness maintaining member with a circular cross-section interposed between an outer peripheral groove in an arc shape formed in the attachment part of the pad body and an inner peripheral groove in an arc shape formed at the insertion hole of the pad holding member.

摘要翻译： 本发明是一种基板保持装置，包括：具有吸入路径的传送臂主体; 包括具有吸入面的吸引部和通过真空吸附保持基板的吸入口的垫体，以及形成有与吸入口连通的吸入孔的圆筒状的安装部， 衬垫保持构件，其具有插入孔，所述垫体的安装部可松动地插入该插入孔中;以及连通路，其与所述吸入孔和所述吸入路径连通，并且固定到所述传送臂本体; 以及形成在所述垫主体的安装部分中的弧形外周槽和形成在所述垫的插入孔中的弧形的内周槽之间的具有圆形横截面的可弹性变形的环形气密保持构件 控股成员