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    Electrolytic processing apparatus and electrolytic processing method
    1.
    发明申请
    Electrolytic processing apparatus and electrolytic processing method 失效
    电解处理装置及电解处理方法

    公开(公告)号：US20050155868A1

    公开(公告)日：2005-07-21

    申请号：US11035373

    申请日：2005-01-14

    申请人： Itsuki Kobata ,  Yutaka Wada ,  Hirokuni Hiyama ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Akira Kodera

    发明人： Itsuki Kobata ,  Yutaka Wada ,  Hirokuni Hiyama ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Akira Kodera

    IPC分类号： B23H5/08 ,  B24B37/04 ,  C25F1/00 ,  C25F3/00 ,  H01L21/321 ,  H01L21/768 ,  B23H3/00

    CPC分类号： H01L21/32115 ,  B23H5/08 ,  B24B37/042 ,  B24B37/046 ,  C25F1/00 ,  C25F3/00 ,  H01L21/7684

    摘要： An electrolytic processing apparatus can increase the efficiency of the dissociation reaction of water and efficiently perform electrolytic processing, and can eliminate the need for an operation for a change of ion exchanger. The electrolytic processing apparatus includes: a processing electrode and a feeding electrode; a liquid supply section for supplying a liquid containing an ion-exchange material between the workpiece and at least one of the processing electrode and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a drive section for moving the workpiece and at least one of the processing electrode and the feeding electrode relative to each other; wherein electrolytic processing of the workpiece is carried out while keeping the workpiece not in contact with and close to the processing electrode at a distance of not more than 10 μm.

    摘要翻译： 电解处理装置可以提高水的解离反应的效率，并且有效地进行电解处理，并且可以消除对于改变离子交换剂的操作的需要。 电解处理装置包括：处理电极和馈电电极; 液体供应部分，用于在工件和处理电极和馈电电极中的至少一个之间提供含有离子交换材料的液体; 用于在处理电极和馈电电极之间施加电压的电源; 以及用于相对于彼此移动所述工件和所述处理电极和所述馈送电极中的至少一个的驱动部分; 其中进行工件的电解处理，同时保持工件不超过10um的距离与处理电极接触并靠近处理电极。

    Electrolytic processing apparatus and electrolytic processing method
    2.
    发明授权
    Electrolytic processing apparatus and electrolytic processing method 失效
    电解处理装置及电解处理方法

    公开(公告)号：US07527723B2

    公开(公告)日：2009-05-05

    申请号：US11035373

    申请日：2005-01-14

    申请人： Itsuki Kobata ,  Yutaka Wada ,  Hirokuni Hiyama ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Akira Kodera

    发明人： Itsuki Kobata ,  Yutaka Wada ,  Hirokuni Hiyama ,  Takayuki Saito ,  Yasushi Toma ,  Tsukuru Suzuki ,  Akira Kodera

    IPC分类号： B23H7/36 ,  B23H1/10 ,  B23H3/10

    CPC分类号： H01L21/32115 ,  B23H5/08 ,  B24B37/042 ,  B24B37/046 ,  C25F1/00 ,  C25F3/00 ,  H01L21/7684

    摘要： An electrolytic processing apparatus can increase the efficiency of the dissociation reaction of water and efficiently perform electrolytic processing, and can eliminate the need for an operation of a change of ion exchanger. The electrolytic processing apparatus includes: a processing electrode and a feeding electrode; a liquid supply section for supplying a liquid containing an ion-exchange material between the workpiece and at least one of the processing electrode and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a drive section for moving the workpiece and at least one of the processing electrode and the feeding electrode relative to each other; wherein electrolytic processing of the workpiece is carried out while keeping the workpiece not in contact with but close to the processing electrode at a distance of not more than 10 μm.

    摘要翻译： 电解处理装置可以提高水的解离反应的效率，并且有效地进行电解处理，并且可以消除对离子交换剂的变化操作的需要。 电解处理装置包括：处理电极和馈电电极; 液体供应部分，用于在工件和处理电极和馈电电极中的至少一个之间提供含有离子交换材料的液体; 用于在处理电极和馈电电极之间施加电压的电源; 以及用于相对于彼此移动所述工件和所述处理电极和所述馈送电极中的至少一个的驱动部分; 其中，对工件的电解处理在不超过10um的距离保持工件不与处理电极接触而靠近处理电极的同时进行。

    Electrochemical mechanical polishing method and electrochemical mechanical polishing apparatus
    3.
    发明申请
    Electrochemical mechanical polishing method and electrochemical mechanical polishing apparatus 审中-公开
    电化学机械抛光方法和电化学机械抛光装置

    公开(公告)号：US20090078583A1

    公开(公告)日：2009-03-26

    申请号：US12007956

    申请日：2008-01-17

    申请人： Itsuki Kobata ,  Akira Kodera ,  Yasushi Toma ,  Tsukuru Suzuki ,  Takayuki Saito ,  Yuji Makita ,  Hirokuni Hiyama

    发明人： Itsuki Kobata ,  Akira Kodera ,  Yasushi Toma ,  Tsukuru Suzuki ,  Takayuki Saito ,  Yuji Makita ,  Hirokuni Hiyama

    IPC分类号： B23H5/06 ,  B23H11/00 ,  C25F3/16 ,  C25F7/00

    CPC分类号： C25F3/00 ,  B23H5/08 ,  B24B37/013 ,  B24B49/105 ,  H01L21/32125

    摘要： A composite electrolytic processing method makes it possible to remove a conductive film without leaving it in an electrically-insulated state on an underlying barrier film, thereby exposing the barrier film. The electrochemical mechanical polishing method includes: applying a voltage between a first electrode connected to one pole of a power source and a second electrode, connected to the other pole of the power source, for feeding electricity to a conductive film of a polishing object; filling an electrolytic liquid into a space between the first electrode and the conductive film of the polishing object; and pressing and rubbing the conductive film against a polishing surface of a polishing pad to polish the conductive film in such a manner that a barrier film underlying the conductive film becomes gradually exposed from the center toward the periphery of the polishing object.

    摘要翻译： 复合电解处理方法使得可以在导电膜上去除导电膜而不会使其在下面的阻挡膜上处于电绝缘状态，从而暴露阻挡膜。 电化学机械抛光方法包括：在连接到电源的一个极的第一电极和连接到电源的另一个极的第二电极之间施加电压，用于向抛光对象的导电膜供电; 将电解液体填充到研磨对象物的第一电极和导电膜之间的空间内; 并且将导电膜按压并摩擦抛光垫的抛光表面以使导电膜抛光，使得导电膜下面的阻挡膜从研磨对象的中心逐渐露出。

    Electrolytic liquid for electrolytic polishing and electrolytic polishing method
    4.
    发明申请
    Electrolytic liquid for electrolytic polishing and electrolytic polishing method 审中-公开
    电解液用于电解抛光和电解抛光法

    公开(公告)号：US20080067077A1

    公开(公告)日：2008-03-20

    申请号：US11896251

    申请日：2007-08-30

    申请人： Akira Kodera ,  Yasushi Toma ,  Tsukuru Suzuki ,  Takayuki Saito ,  Itsuki Kobata

    发明人： Akira Kodera ,  Yasushi Toma ,  Tsukuru Suzuki ,  Takayuki Saito ,  Itsuki Kobata

    IPC分类号： C25F3/16 ,  B23H3/00

    CPC分类号： B23H5/08 ,  B23H5/12 ,  C25F3/16 ,  C25F3/22

    摘要： An electrolytic liquid is used for electrolytic polishing which can provide a processed surface having high flattening characteristics with a low voltage applied while ensuring a higher processing rate for an conductive material, and can remove an unnecessary conductive material and expose a barrier film without causing dishing, erosion, or etching at the interface between the barrier film and a metal (conductive material). The electrolytic liquid for use in electrolytic polishing of a surface conductive material of a workpiece comprises an aqueous solution containing at least one organic acid or its salt, at least one strong acid having a sulfonic acid group, a corrosion inhibitor and a water-soluble polymeric compound.

    摘要翻译： 一种电解液用于电解抛光，其可以在确保更高的导电材料的加工速率的同时，提供具有高平坦化特性的加工表面，同时确保更高的导电材料的加工速率，并且可以去除不必要的导电材料并暴露阻挡膜而不引起凹陷， 侵蚀或蚀刻在阻挡膜和金属（导电材料）之间的界面处。 用于工件表面导电材料的电解抛光的电解液包括含有至少一种有机酸或其盐的水溶液，至少一种具有磺酸基的强酸，缓蚀剂和水溶性聚合物 复合。

    Electrochemical mechanical polishing apparatus conditioning method, and conditioning solution
    6.
    发明申请
    Electrochemical mechanical polishing apparatus conditioning method, and conditioning solution 审中-公开
    电化学机械抛光装置调理方法，调理溶液

    公开(公告)号：US20080188162A1

    公开(公告)日：2008-08-07

    申请号：US12068300

    申请日：2008-02-05

    申请人： Itsuki Kobata ,  Yasushi Toma ,  Akira Kodera ,  Tsukuru Suzuki ,  Yuji Makita ,  Takayuki Saito

    发明人： Itsuki Kobata ,  Yasushi Toma ,  Akira Kodera ,  Tsukuru Suzuki ,  Yuji Makita ,  Takayuki Saito

    IPC分类号： B24B49/00

    CPC分类号： B24B53/017 ,  B23H5/08 ,  B24B37/042 ,  B24B37/046 ,  B24B49/10 ,  H01L21/32125 ,  H01L21/7684

    摘要： An electrochemical mechanical polishing apparatus is for use in polishing of a conductive material (e.g., metal) on a surface of a substrate by combination of electrochemical action and mechanical action. This apparatus includes a polishing table having divided electrodes and adapted to hold a polishing pad having a polishing surface, a polishing head adapted to hold a workpiece having a conductive film and to press the workpiece against the polishing surface, a second electrode for supplying an electric current to the conductive film, an electrolytic-solution supply section for supplying an electrolytic solution to the polishing surface, a detecting section adapted to detect a signal corresponding to a thickness of the conductive film, a variable resistance unit having the same number of variable resistors as the number of divided electrodes, a moving mechanism for providing relative movement between the workpiece and the polishing surface, and a control section adapted to control each of the variable resistors based on the signal from the detecting section.

    摘要翻译： 电化学机械抛光装置用于通过电化学作用和机械作用的组合在基底表面上抛光导电材料（例如金属）。 该装置包括具有分割电极并且适于保持具有抛光表面的抛光垫的抛光台，用于保持具有导电膜的工件并将工件压靠抛光表面的抛光头，用于提供电 电流至导电膜的电解液供应部分，用于向研磨表面供应电解液的电解溶液供应部分，用于检测对应于导电膜厚度的信号的检测部分，具有相同数目的可变电阻器的可变电阻单元 作为分割电极的数量，用于在工件和抛光表面之间提供相对移动的移动机构，以及适于基于来自检测部分的信号来控制每个可变电阻器的控制部分。

    SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
    8.
    发明申请
    SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS 审中-公开
    基板加工方法和基板加工装置

    公开(公告)号：US20100325913A1

    公开(公告)日：2010-12-30

    申请号：US12821456

    申请日：2010-06-23

    申请人： Xinming WANG ,  Kazuo Yamauchi ,  Akira Kodera ,  Tsukuru Suzuki ,  Yasushi Toma ,  Takayuki Saito ,  Hirokuni Hiyama

    发明人： Xinming WANG ,  Kazuo Yamauchi ,  Akira Kodera ,  Tsukuru Suzuki ,  Yasushi Toma ,  Takayuki Saito ,  Hirokuni Hiyama

    IPC分类号： F26B7/00

    CPC分类号： F26B5/12 ,  F26B21/004 ,  H01L21/67028

    摘要： A substrate processing method dose not use or only use the least possible amount of an organic solvent, and can quickly and completely remove a liquid from a wet substrate surface without allowing the liquid to remain on the substrate surface. The substrate processing method for drying a substrate surface which is wet with a liquid, includes: removing the liquid from the substrate surface and sucking the liquid together with its surrounding gas into a gas/liquid suction nozzle, disposed opposite the substrate surface, while relatively moving the gas/liquid suction nozzle and the substrate parallel to each other; and blowing a dry gas from a dry gas supply nozzle, disposed opposite the substrate surface, toward that area of the substrate surface from which the liquid has been removed while relatively moving the dry gas supply nozzle and the substrate parallel to each other.

    摘要翻译： 不使用或仅使用尽可能少量有机溶剂的底物处理方法，并且可以快速且完全地从湿底物表面除去液体，而不会使液体残留在基材表面上。 用于干燥被液体湿润的基板表面的基板处理方法包括：从基板表面去除液体并将其周围的气体与其一起吸入与基板表面相对设置的气/液吸嘴中，同时相对 使气体/液体吸嘴和基板彼此平行移动; 并且将相对于基板表面设置的干燥气体供给喷嘴的干燥气体吹向基板表面的已被除去液体的区域，同时使干燥气体供给喷嘴和基板彼此平行地相对移动。