Method of fabricating a flash memory cell
    6.
    发明授权
    Method of fabricating a flash memory cell 有权
    制造闪存单元的方法

    公开(公告)号:US07205194B2

    公开(公告)日:2007-04-17

    申请号:US10874579

    申请日:2004-06-24

    IPC分类号: H01L21/336

    摘要: A method of fabricating a flash memory cell having a split gate structure. A sacrificial layer is formed on a floating gate layer formed on a semiconductor substrate. The sacrificial layer is etched to form an opening exposing a portion of the floating gate layer. A gate interlayer insulating layer pattern is formed inside the opening. After removing the sacrificial layer pattern and etching the floating gate layer (using the gate interlayer insulating layer pattern as an etch mask), a floating gate is formed under the gate interlayer insulating layer pattern. A control gate is formed overlapping a portion of the floating gate.

    摘要翻译: 一种制造具有分裂栅极结构的闪存单元的方法。 牺牲层形成在形成在半导体衬底上的浮栅上。 牺牲层被蚀刻以形成暴露浮动栅极层的一部分的开口。 在开口内部形成栅极层间绝缘层图案。 在去除牺牲层图案并蚀刻浮栅(使用栅极层间绝缘层图案作为蚀刻掩模)之后,在栅极层间绝缘层图案下方形成浮栅。 控制栅极形成为与浮置栅极的一部分重叠。

    Semiconductor device with split gate electrode structure and method for manufacturing the semiconductor device
    7.
    发明申请
    Semiconductor device with split gate electrode structure and method for manufacturing the semiconductor device 失效
    具有分裂栅电极结构的半导体器件和用于制造半导体器件的方法

    公开(公告)号:US20060027858A1

    公开(公告)日:2006-02-09

    申请号:US11246590

    申请日:2005-10-11

    IPC分类号: H01L29/788

    摘要: A semiconductor device includes a substrate divided into a memory cell region and a logic region. A split gate electrode structure is formed in a memory cell region of a substrate. A silicon oxide layer is formed on a sidewall of the split gate electrode structure and a surface of the substrate. A word line is formed on the silicon oxide layer that is positioned on the sidewall of the split gate electrode structure. The word line has an upper width and a lower width. The lower width is greater than the upper width. A logic gate pattern is formed on a logic region of the substrate. The logic gate pattern has a thickness thinner than the lower width of the word line.

    摘要翻译: 半导体器件包括分为存储单元区域和逻辑区域的衬底。 在基板的存储单元区域中形成分割栅电极结构。 在分离栅电极结构的侧壁和基板的表面上形成氧化硅层。 在位于分离栅电极结构的侧壁上的氧化硅层上形成字线。 字线具有上宽度和下宽度。 较低的宽度大于上部宽度。 在基板的逻辑区域上形成逻辑门图案。 逻辑门图案具有比字线的较低宽度更薄的厚度。

    Nonvolatile memory device and method for manufacturing the same
    9.
    发明申请
    Nonvolatile memory device and method for manufacturing the same 审中-公开
    非易失性存储器件及其制造方法

    公开(公告)号:US20070252190A1

    公开(公告)日:2007-11-01

    申请号:US11653962

    申请日:2007-01-17

    IPC分类号: H01L29/788 H01L21/336

    摘要: Provided are a nonvolatile memory device and a method for manufacturing the same. The nonvolatile memory device may include a semiconductor substrate, a floating gate, a second insulation layer, a third insulation layer, a control gate, and a common source line. The semiconductor substrate may have an active region limited by a device isolation region. The floating gate may be formed on the active region with a first insulation layer between the floating gate and the active region. The second insulation layer covers one side of the floating gate, and the third insulation layer covers the floating gate and the second insulation layer. The control gate may be formed on the other side of the floating gate with a fourth insulation layer between the control gate and the floating gate. The common source line may be formed in a portion of the substrate that is located under the second insulation layer.

    摘要翻译: 提供一种非易失性存储器件及其制造方法。 非易失性存储器件可以包括半导体衬底,浮置栅极,第二绝缘层,第三绝缘层,控制栅极和公共源极线。 半导体衬底可以具有被器件隔离区限制的有源区。 浮置栅极可以在有源区上形成在浮置栅极和有源区域之间的第一绝缘层。 第二绝缘层覆盖浮栅的一侧,第三绝缘层覆盖浮栅和第二绝缘层。 控制栅极可以在浮动栅极的另一侧上形成在控制栅极和浮动栅极之间的第四绝缘层。 公共源极线可以形成在位于第二绝缘层下方的衬底的一部分中。