公开(公告)号：US09219623B2

公开(公告)日：2015-12-22

申请号：US10956426

申请日：2004-09-30

申请人： James A. McCall ,  Klaus Ruff ,  David Shykind ,  Santanu Chaudhuri

发明人： James A. McCall ,  Klaus Ruff ,  David Shykind ,  Santanu Chaudhuri

IPC分类号： H04L25/02 ,  H04L7/00 ,  H04L25/03

CPC分类号： H04L25/0224 ,  H04L7/0008 ,  H04L25/03878 ,  H04L2025/03751

摘要： A method, system and apparatus to self-determine equalization parameters for a channel. An initiator sends an equalization insensitive signal (EIS) to a responder on channel to be equalized and begins a count. A responder responds with an EIS. When the initiator receives the response EIS the count is terminated. The count, which constitutes a measure of delay in the channel, may be used to determine desirable equalization parameters for the channel.

摘要翻译： 用于自定义信道的均衡参数的方法，系统和装置。 发起者向均衡敏感信号（EIS）发送信道上的响应者以进行均衡并开始计数。 响应者回应EIS。 当启动器接收到响应EIS时，计数结束。 构成通道中的延迟量的计数可用于确定通道的期望的均衡参数。

公开(公告)号：US20060067398A1

公开(公告)日：2006-03-30

申请号：US10956426

申请日：2004-09-30

申请人： James McCall ,  Klaus Ruff ,  David Shykind ,  Santanu Chaudhuri

发明人： James McCall ,  Klaus Ruff ,  David Shykind ,  Santanu Chaudhuri

IPC分类号： H03K5/159

CPC分类号： H04L25/0224 ,  H04L7/0008 ,  H04L25/03878 ,  H04L2025/03751

摘要： A method, system and apparatus to self-determine equalization parameters for a channel. An initiator sends an equalization insensitive signal (EIS) to a responder on channel to be equalized and begins a count. A responder responds with an EIS. When the initiator receives the response EIS the count is terminated. The count, which constitutes a measure of delay in the channel, may be used to determine desirable equalization parameters for the channel.

公开(公告)号：US07246022B2

公开(公告)日：2007-07-17

申请号：US11156837

申请日：2005-06-20

申请人： James A. McCall ,  Klaus Ruff ,  David Shykind

发明人： James A. McCall ,  Klaus Ruff ,  David Shykind

IPC分类号： G01K1/20

CPC分类号： G11C7/22 ,  G06F13/1694 ,  G11C7/04 ,  G11C2207/2254

摘要： A method includes detecting a change in temperature in an integrated circuit that is coupled to a differential communication link, and responding to the detected change in temperature by initiating a retraining process for the differential communication link.

摘要翻译： 一种方法包括检测耦合到差分通信链路的集成电路中的温度变化，以及通过启动用于差分通信链路的再培训处理来响应于检测到的温度变化。

公开(公告)号：US08415002B2

公开(公告)日：2013-04-09

申请号：US12723949

申请日：2010-03-15

申请人： James A. McCall ,  David Shykind

发明人： James A. McCall ,  David Shykind

IPC分类号： B32B3/00 ,  H05K1/00

CPC分类号： H05K3/10 ,  H05K1/0216 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/0366 ,  H05K3/0052 ,  H05K2201/0187 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/09972 ,  H05K2203/1554 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49798 ,  Y10T428/24058 ,  Y10T428/24917 ,  Y10T428/249935 ,  Y10T428/24994 ,  Y10T428/249943 ,  Y10T428/249946 ,  Y10T442/2926 ,  Y10T442/2992 ,  Y10T442/3065

摘要： A method of manufacturing a circuit board which may include the steps of forming a circuit board with horizontal and vertical fiberglass fibers, rotating the circuit board, and cutting the circuit board so that the horizontal and vertical fiberglass fibers form a non-right angle with a cut line of the circuit board. The circuit board may have a plurality of conductive traces located thereon which pass by areas of higher fiberglass-to-resin material and lower fiberglass-to-resin material to assist in reducing differential to common mode conversion between signals in the plurality of conducive traces.

摘要翻译： 一种制造电路板的方法，其可以包括以下步骤：形成具有水平和垂直玻璃纤维的电路板，旋转电路板和切割电路板，使得水平和垂直玻璃纤维与...形成非直角 切割电路板的线。 电路板可以具有位于其上的多个导电迹线，其通过较高玻璃纤维 - 树脂材料的区域和较低的玻璃纤维 - 树脂材料，以帮助减少在多个导电迹线中的信号之间的共模转换的差异。

公开(公告)号：US20060284733A1

公开(公告)日：2006-12-21

申请号：US11156837

申请日：2005-06-20

申请人： James McCall ,  Klaus Ruff ,  David Shykind

发明人： James McCall ,  Klaus Ruff ,  David Shykind

IPC分类号： G08B17/00

CPC分类号： G11C7/22 ,  G06F13/1694 ,  G11C7/04 ,  G11C2207/2254

摘要： A method includes detecting a change in temperature in an integrated circuit that is coupled to a differential communication link, and responding to the detected change in temperature by initiating a retraining process for the differential communication link.

摘要翻译： 一种方法包括检测耦合到差分通信链路的集成电路中的温度变化，以及通过启动用于差分通信链路的再培训处理来响应于检测到的温度变化。

公开(公告)号：US07676917B2

公开(公告)日：2010-03-16

申请号：US11727279

申请日：2007-03-26

申请人： James A. McCall ,  David Shykind

发明人： James A. McCall ,  David Shykind

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H05K3/10 ,  H05K1/0216 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/0366 ,  H05K3/0052 ,  H05K2201/0187 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/09972 ,  H05K2203/1554 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49798 ,  Y10T428/24058 ,  Y10T428/24917 ,  Y10T428/249935 ,  Y10T428/24994 ,  Y10T428/249943 ,  Y10T428/249946 ,  Y10T442/2926 ,  Y10T442/2992 ,  Y10T442/3065

摘要： A method of manufacturing a circuit board which may include the steps of forming a circuit board with horizontal and vertical fiberglass fibers, rotating the circuit board, and cutting the circuit board so that the horizontal and vertical fiberglass fibers form a non-right angle with a cut line of the circuit board. The circuit board may have a plurality of conductive traces located thereon which pass by areas of higher fiberglass-to-resin material and lower fiberglass-to-resin material to assist in reducing differential to common mode conversion between signals in the plurality of conducive traces.

摘要翻译： 一种制造电路板的方法，其可以包括以下步骤：形成具有水平和垂直玻璃纤维的电路板，旋转电路板和切割电路板，使得水平和垂直玻璃纤维与...形成非直角 切割电路板的线。 电路板可以具有位于其上的多个导电迹线，其通过较高玻璃纤维 - 树脂材料的区域和较低的玻璃纤维 - 树脂材料，以帮助减少在多个导电迹线中的信号之间的共模转换的差异。

公开(公告)号：US08673391B2

公开(公告)日：2014-03-18

申请号：US13859421

申请日：2013-04-09

申请人： David Shykind ,  James A. McCall

发明人： David Shykind ,  James A. McCall

IPC分类号： B05D5/12 ,  B32B17/02 ,  H01R43/00

CPC分类号： H05K3/10 ,  H05K1/0216 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/0366 ,  H05K3/0052 ,  H05K2201/0187 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/09972 ,  H05K2203/1554 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49798 ,  Y10T428/24058 ,  Y10T428/24917 ,  Y10T428/249935 ,  Y10T428/24994 ,  Y10T428/249943 ,  Y10T428/249946 ,  Y10T442/2926 ,  Y10T442/2992 ,  Y10T442/3065

摘要： A method of manufacturing a circuit board is described herein. The method may include adding a resin, forming first and second fiberglass fibers, and forming first and second signal line traces capable of transmitting electrical signals. In some examples, a ratio between fiberglass and resin material near the first signal line trace is similar to a ratio between fiberglass and resin material near the second signal line trace. In some examples, the first and second fiberglass fibers diagonally cross near the first and second signal line traces. In some examples, the first and second fiberglass fibers cross near the first and second signal line traces in a zig-zag pattern.

摘要翻译： 这里描述了制造电路板的方法。 该方法可以包括添加树脂，形成第一和第二玻璃纤维纤维，以及形成能够传输电信号的第一和第二信号线迹线。 在一些实例中，第一信号线迹线附近的玻璃纤维和树脂材料之间的比率类似于第二信号线迹线附近的玻璃纤维和树脂材料之间的比率。 在一些示例中，第一和第二玻璃纤维光纤在第一和第二信号线迹线附近对角地交叉。 在一些示例中，第一和第二玻璃纤维纤维以锯齿形图案在第一和第二信号线迹线附近交叉。

公开(公告)号：US20100170087A1

公开(公告)日：2010-07-08

申请号：US12723949

申请日：2010-03-15

申请人： James A. McCALL ,  David Shykind

发明人： James A. McCALL ,  David Shykind

IPC分类号： H05K3/10

CPC分类号： H05K3/10 ,  H05K1/0216 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/0366 ,  H05K3/0052 ,  H05K2201/0187 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/09972 ,  H05K2203/1554 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49798 ,  Y10T428/24058 ,  Y10T428/24917 ,  Y10T428/249935 ,  Y10T428/24994 ,  Y10T428/249943 ,  Y10T428/249946 ,  Y10T442/2926 ,  Y10T442/2992 ,  Y10T442/3065

摘要： A method of manufacturing a circuit board which may include the steps of forming a circuit board with horizontal and vertical fiberglass fibers, rotating the circuit board, and cutting the circuit board so that the horizontal and vertical fiberglass fibers form a non-right angle with a cut line of the circuit board. The circuit board may have a plurality of conductive traces located thereon which pass by areas of higher fiberglass-to-resin material and lower fiberglass-to-resin material to assist in reducing differential to common mode conversion between signals in the plurality of conducive traces.

公开(公告)号：US07459200B2

公开(公告)日：2008-12-02

申请号：US10641070

申请日：2003-08-15

申请人： James A. McCall ,  David Shykind

发明人： James A. McCall ,  David Shykind

IPC分类号： B32B3/00 ,  H05K1/00

CPC分类号： H05K3/10 ,  H05K1/0216 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/0366 ,  H05K3/0052 ,  H05K2201/0187 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/09972 ,  H05K2203/1554 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49798 ,  Y10T428/24058 ,  Y10T428/24917 ,  Y10T428/249935 ,  Y10T428/24994 ,  Y10T428/249943 ,  Y10T428/249946 ,  Y10T442/2926 ,  Y10T442/2992 ,  Y10T442/3065

摘要： A circuit board is described where the fiberglass fiber pattern as been modified than what is found in conventional FR4 circuit boards. In one embodiment, the sets of fiberglass fibers are disposed in a zig-zag or herringbone manner. In one use, when a pair of conductors are disposed onto or into the board, the material surrounding a first conductor tends to be similar to the material surrounding a second conductor. Doing so may reduce differential to common mode conversion between the conductors.

摘要翻译： 描述了电路板，其中比常规FR4电路板中发现的玻璃纤维模式被修改。 在一个实施例中，玻璃纤维组织以锯齿形或人字形方式设置。 在一种用途中，当一对导体设置在板上或其中时，围绕第一导体的材料倾向于类似于围绕第二导体的材料。 这样做可能会降低导体间的共模转换。

公开(公告)号：US08551555B2

公开(公告)日：2013-10-08

申请号：US11964428

申请日：2007-12-26

申请人： John Burghard ,  Carmen Campbell ,  Todd R. Younkin ,  Markus Kuhn ,  David Shykind ,  Jose Maiz

发明人： John Burghard ,  Carmen Campbell ,  Todd R. Younkin ,  Markus Kuhn ,  David Shykind ,  Jose Maiz

IPC分类号： A61L33/00

CPC分类号： B82Y30/00 ,  A61L27/34 ,  A61L31/10 ,  A61L2420/02 ,  B05D1/185 ,  B05D1/22 ,  B05D3/044 ,  B05D3/142 ,  B05D7/52 ,  B82Y40/00 ,  C08L89/04

摘要： Biocompatible coatings for implantable medical devices are disclosed. Embodiments of the invention provide methods for coating an object with a biocompatible coating wherein the device is suspended using a flowing gas during the coating process. Embodiments of the invention provide tropoelastin coatings and methods of creating tropoelastin coatings for implantable medical devices. Optionally, the biocompatible coating can be a drug eluting coating.

摘要翻译： 公开了用于可植入医疗装置的生物相容性涂层。 本发明的实施例提供了用生物相容性涂层涂覆物体的方法，其中在涂覆过程中使用流动的气体悬挂该装置。 本发明的实施方案提供托普拉斯他汀涂层和用于可植入医疗装置的创伤弹力蛋白涂层的方法。 任选地，生物相容性涂层可以是药物洗脱涂层。