摘要:
In a system for laser welding upper and lower work pieces along a weld interface, the upper work piece being transparent to laser light and having a non-uniformly thick dimension, compensation plates and compliant members are taught that mate or otherwise contact the upper work piece such that a combined thickness of the upper work piece and the compensation plate or compliant member is substantially uniform in a region at least above the weld interface. In this manner, substantially consistent amounts of laser light reach the weld interface. The upper work piece may include positive projections, negative voids, contoured profiles, surface imperfections or other that cause the non-uniformity. In one embodiment, the compensation plate is fashioned together with a compliant member. In another embodiment, the upper and lower work pieces comprise inkjet printhead lids and bodies, respectively.
摘要:
In a system for laser welding upper and lower work pieces along a weld interface, the upper work piece being transparent to laser light and having a non-uniformly thick dimension, compensation plates and compliant members are taught that mate or otherwise contact the upper work piece such that a combined thickness of the upper work piece and the compensation plate or compliant member is substantially uniform in a region at least above the weld interface. In this manner, substantially consistent amounts of laser light reach the weld interface. The upper work piece may include positive projections, negative voids, contoured profiles, surface imperfections or other that cause the non-uniformity. In one embodiment, the compensation plate is fashioned together with a compliant member. In another embodiment, the upper and lower work pieces comprise inkjet printhead lids and bodies, respectively.
摘要:
A method for manufacturing an inkjet print cartridge and an inkjet cartridge produced thereby are disclosed. An inkjet print cartridge in accordance with one aspect includes a component of the inkjet print cartridge and an applied adhesive on at least a portion of the component, wherein the applied adhesive is formed from an adhesive having a rheology viscosity ratio ηi/ηmin of from 1.0 to less than 2.1. The method in accordance with one aspect includes applying an adhesive onto at least a portion of a component of an inkjet print cartridge at an application temperature, Tα, and heating the adhesive from an initial temperature, Ti, to a cure temperature for the adhesive, Tc. The adhesive has a rheology cure profile characterized by at least one of the following parameters: a) a rheology viscosity ratio ηi/ηmin of from 1.0 to less than 2.1, b) a temperature of the adhesive is approximately equal to a minimum viscosity temperature for the adhesive, Tηmin, within less than about 10 minutes from the start of the cure cycle, and c) viscosity of the adhesive increases within less than about 5 minutes from the start of the cure cycle.
摘要:
This invention addresses how an end user can create an electroluminescent device (1, 31) using basic components obtained by the end user as retail items. The layers or subassemblies (15, 17) are created first. Then the layers are assembled to form a completed device customized as selected by the end user. The subassemblies may be created layer-by-layer by thermal inkjet. Elements used typically will be made by manufacturers and sold commercially separately. This encompasses the printing of conductive patterns for electroluminescence on paper. In one aspect a display has a main body that may be permanent and useful indefinitely, while a part carrying the conductive pattern defining the display is readily removed and is replaced by another such part on which a new conductive pattern is printed. For tight contact with the main body, the display provides releasable pressure. Air pockets are minimized with a thin layer of highly viscous dielectric liquid.
摘要:
An aqueous composition for forming a micro-fluid jet printable dielectric film layer, methods for forming dielectric film layers, and dielectric film layers formed by the method. The aqueous composition includes from about 5 to about 20 percent by 65 weight of a polymeric binder emulsion, from about 10 to about 30 percent by weight of a humectant, from about 0 to about 3 percent by weight of a surfactant, and an aqueous carrier fluid. The aqueous composition has a viscosity ranging from about 2 to about 6 centipoise at a temperature of about 23° C.
摘要:
A method of bonding a chip to a wafer at precise alignment suitable for fabricating a heater chip in an ink jet printhead is provided. The method includes spray coating an adhesive composition on a surface of a substrate, aligning and tacking at least one chip to the substrate coated with the adhesive composition, exposing the substrate tacked with at least one chip coated with the adhesive composition to radiation and heat, and performing thermal compression bonding. The method uses a spray coatable adhesive composition comprising a thermally activated adhesive and a photoacid generator.
摘要:
An ink jetting structure includes a substrate that has a first surface and a second surface. A heater chip is mounted to the second surface of the substrate, and includes a first set of electrical contacts. A printhead circuit member has a third surface, a fourth surface, and an opening configured to receive the heater chip with the first set of electrical contacts of the heater chip being exposed through the opening. The third surface is mounted to the second surface of the substrate. The fourth surface has a second set of electrical contacts attached by wire bonds to the first set of electrical contacts. The third surface has a third set of electrical contacts electrically coupled to the second set of electrical contacts, and electrically connected to a flexible cable for coupling to corresponding contacts on a printer.
摘要:
A composite ceramic substrate for receiving an ejection head chip for a micro-fluid ejection head and a method for making the composite ceramic substrate. The substrate includes a high temperature previously fired ceramic base having a substantially planarized first surface and at least one fluid supply slot therethrough. A low temperature co-fired ceramic (LTCC) tape layer bundle having at least two LTCC tape layers is attached to the ceramic base at an interface between the LTCC tape layer bundle and the first surface of the ceramic base. The LTCC tape layer bundle has at least one chip pocket therein and at least one of the LTCC tape layers includes a plurality of conductors.
摘要:
Methods for improving adherence of conductive traces, such as in a printed circuit, and circuits having conductive traces formed in accordance with such methods. One such method includes depositing a fluid composition receiving layer adjacent to a substrate, and depositing a gradient layer adjacent to the fluid composition receiving layer. The gradient layer is comprised of a fluid composition providing the fluid composition receiving layer and a fluid composition providing a conductive layer. A conductive layer composition is deposited adjacent to the gradient layer to provide the conductive layer.
摘要:
The invention relates to a method for attaching microelectronic devices, circuit boards and the like to a surface, and is particularly suitable for attaching a plurality of a semiconductor chips to an ink jet pen body. The method includes the steps of (a) providing a sheet of a thin film adhesive material having a first surface and a second surface opposite the first surface, the second surface being releasably attached to a carrier web; (b) simultaneously making a plurality of cuts in the sheet of thin film adhesive material, the cuts extending from the first surface to an interface between the second surface and the carrier web without significantly extending into the carrier web to provide one or more cut portions of adhesive film; (c) removing each cut portion of adhesive film from the carrier web; (d) engaging the second surface of each of the cut portions with predetermined locations on a receiving surface; and (e) providing one or more semiconductor chips in a desirably aligned configuration with respect to the predetermined locations and contacting each semiconductor chip with first surface of each of the cut portions. Use of the method and apparatus of the invention provides significant improvement in the application of adhesive films to surfaces in electronic component assembly.