Inkjet print cartridge having an adhesive with improved dimensional control
    3.
    发明授权
    Inkjet print cartridge having an adhesive with improved dimensional control 有权
    具有改进的尺寸控制的粘合剂的喷墨打印盒

    公开(公告)号:US07404613B2

    公开(公告)日:2008-07-29

    申请号:US11169905

    申请日:2005-06-29

    IPC分类号: B41J2/015 B41J2/175

    CPC分类号: B41J2/17559

    摘要: A method for manufacturing an inkjet print cartridge and an inkjet cartridge produced thereby are disclosed. An inkjet print cartridge in accordance with one aspect includes a component of the inkjet print cartridge and an applied adhesive on at least a portion of the component, wherein the applied adhesive is formed from an adhesive having a rheology viscosity ratio ηi/ηmin of from 1.0 to less than 2.1. The method in accordance with one aspect includes applying an adhesive onto at least a portion of a component of an inkjet print cartridge at an application temperature, Tα, and heating the adhesive from an initial temperature, Ti, to a cure temperature for the adhesive, Tc. The adhesive has a rheology cure profile characterized by at least one of the following parameters: a) a rheology viscosity ratio ηi/ηmin of from 1.0 to less than 2.1, b) a temperature of the adhesive is approximately equal to a minimum viscosity temperature for the adhesive, Tηmin, within less than about 10 minutes from the start of the cure cycle, and c) viscosity of the adhesive increases within less than about 5 minutes from the start of the cure cycle.

    摘要翻译: 公开了一种用于制造由此制造的喷墨打印墨盒和喷墨墨盒的方法。 根据一个方面的喷墨打印墨盒包括喷墨打印墨盒的组件和在组件的至少一部分上的涂布的粘合剂,其中涂布的粘合剂由具有流变粘度比η的粘合剂形成, /小于/小于2.1。 根据一个方面的方法包括在施加温度Tαα下将粘合剂施加到喷墨打印盒的部件的至少一部分上,并从初始温度T 1加热粘合剂, 将粘合剂的固化温度提高到粘合剂的固化温度。 粘合剂具有流变学固化分布,其特征在于以下参数中的至少一个:a)1.0至小于2.1的流变粘度比ηη/ηmin / b)粘合剂的温度近似等于粘合剂T et et在从固化循环开始后不到约10分钟内的最低粘度温度,c)粘合剂的粘度 在治愈周期开始后不到5分钟内就会增加。

    Customizable electroluminescent displays
    4.
    发明授权
    Customizable electroluminescent displays 有权
    可定制的电致发光显示器

    公开(公告)号:US07425795B2

    公开(公告)日:2008-09-16

    申请号:US11209468

    申请日:2005-08-23

    IPC分类号: H01J1/62 H01J63/04

    摘要: This invention addresses how an end user can create an electroluminescent device (1, 31) using basic components obtained by the end user as retail items. The layers or subassemblies (15, 17) are created first. Then the layers are assembled to form a completed device customized as selected by the end user. The subassemblies may be created layer-by-layer by thermal inkjet. Elements used typically will be made by manufacturers and sold commercially separately. This encompasses the printing of conductive patterns for electroluminescence on paper. In one aspect a display has a main body that may be permanent and useful indefinitely, while a part carrying the conductive pattern defining the display is readily removed and is replaced by another such part on which a new conductive pattern is printed. For tight contact with the main body, the display provides releasable pressure. Air pockets are minimized with a thin layer of highly viscous dielectric liquid.

    摘要翻译: 本发明解决了最终用户如何使用由最终用户获得的基本组件来创建电致发光器件(1,31)作为零售商品。 首先创建层或子组件(15,17)。 然后,层被组装以形成由最终用户选择的定制的完成的设备。 子组件可以通过热喷墨逐层地形成。 所使用的元件通常由制造商制造并单独出售。 这包括在纸上印刷电致发光的导电图案。 在一个方面,显示器具有主体,其可以是无限期地永久且有用的,而承载限定显示器的导电图案的部件容易地被移除,并被另一个在其上印刷新的导电图案的部件所代替。 为了与主体紧密接触,显示屏提供可释放的压力。 使用薄层高粘度的介电液体将气穴最小化。

    Ink jetting structure having protected connections
    7.
    发明授权
    Ink jetting structure having protected connections 有权
    具有受保护连接的喷墨结构

    公开(公告)号:US07784909B2

    公开(公告)日:2010-08-31

    申请号:US12021375

    申请日:2008-01-29

    IPC分类号: B41J2/14

    CPC分类号: B41J2/17553 B41J2/17526

    摘要: An ink jetting structure includes a substrate that has a first surface and a second surface. A heater chip is mounted to the second surface of the substrate, and includes a first set of electrical contacts. A printhead circuit member has a third surface, a fourth surface, and an opening configured to receive the heater chip with the first set of electrical contacts of the heater chip being exposed through the opening. The third surface is mounted to the second surface of the substrate. The fourth surface has a second set of electrical contacts attached by wire bonds to the first set of electrical contacts. The third surface has a third set of electrical contacts electrically coupled to the second set of electrical contacts, and electrically connected to a flexible cable for coupling to corresponding contacts on a printer.

    摘要翻译: 喷墨结构包括具有第一表面和第二表面的基底。 加热器芯片安装到基板的第二表面,并且包括第一组电触头。 打印头电路构件具有第三表面,第四表面和开口,其构造成接收加热器芯片,加热器芯片的第一组电触点通过开口露出。 第三表面安装到基板的第二表面。 第四表面具有通过引线键合连接到第一组电触点的第二组电触头。 第三表面具有电耦合到第二组电触头的第三组电触点,并且电连接到柔性电缆,用于耦合到打印机上的相应触点。

    Method and apparatus for adhesively securing ink jet pen components using thin film adhesives
    10.
    发明授权
    Method and apparatus for adhesively securing ink jet pen components using thin film adhesives 有权
    使用薄膜粘合剂粘合地固定喷墨笔组件的方法和装置

    公开(公告)号:US06758934B2

    公开(公告)日:2004-07-06

    申请号:US10305636

    申请日:2002-11-27

    IPC分类号: B32B3118

    摘要: The invention relates to a method for attaching microelectronic devices, circuit boards and the like to a surface, and is particularly suitable for attaching a plurality of a semiconductor chips to an ink jet pen body. The method includes the steps of (a) providing a sheet of a thin film adhesive material having a first surface and a second surface opposite the first surface, the second surface being releasably attached to a carrier web; (b) simultaneously making a plurality of cuts in the sheet of thin film adhesive material, the cuts extending from the first surface to an interface between the second surface and the carrier web without significantly extending into the carrier web to provide one or more cut portions of adhesive film; (c) removing each cut portion of adhesive film from the carrier web; (d) engaging the second surface of each of the cut portions with predetermined locations on a receiving surface; and (e) providing one or more semiconductor chips in a desirably aligned configuration with respect to the predetermined locations and contacting each semiconductor chip with first surface of each of the cut portions. Use of the method and apparatus of the invention provides significant improvement in the application of adhesive films to surfaces in electronic component assembly.

    摘要翻译: 本发明涉及一种将微电子器件,电路板等附着在表面上的方法,特别适用于将多个半导体芯片附着到喷墨笔体上。 该方法包括以下步骤:(a)提供具有第一表面和与第一表面相对的第二表面的薄膜粘合材料片,所述第二表面可释放地附接到载体网; (b)同时在薄膜粘合剂材料片上进行多个切口,切口从第一表面延伸到第二表面和载体网之间的界面,而不会显着延伸到载体网中以提供一个或多个切割部分 的胶膜; (c)从载体网上去除粘合膜的每个切割部分; (d)将每个切割部分的第二表面与接收表面上的预定位置接合; 和(e)相对于预定位置提供期望对准的一个或多个半导体芯片,并使每个半导体芯片与每个切割部分的第一表面接触。 使用本发明的方法和装置提供了在电子部件组件中将粘合剂膜应用于表面方面的显着改进。