公开(公告)号：US07941201B2

公开(公告)日：2011-05-10

申请号：US11599303

申请日：2006-11-15

申请人： Jin-Chern Chiou ,  Chen-Chun Hung ,  Chih-Wei Chang

发明人： Jin-Chern Chiou ,  Chen-Chun Hung ,  Chih-Wei Chang

IPC分类号： A61B5/04

CPC分类号： A61B5/0408 ,  A61B5/0478 ,  A61B5/14514 ,  A61B5/685

摘要： A microprobe array structure with self-stabilization capability and a method for manufacturing the same are proposed. The microprobe array structure is used to sense various biopotential signals, and is characterized in that the etching parameters are controlled during etching to manufacture a microprobe structure with a reduced bottom cross section so that the microprobe can be firmly stabilized in the skin tissue. Moreover, a conducting layer is formed on the microprobe to sense signals. A design of electric isolation between microprobes is also proposed. The microprobe array can therefore be used for the measurement of various biopotential signals, and can also be used as a stimulus.

摘要翻译： 提出了具有自稳定能力的微探针阵列结构及其制造方法。 微探针阵列结构用于感测各种生物电位信号，其特征在于在蚀刻期间控制蚀刻参数以制造具有减小的底部横截面的微探针结构，使得微探针能够牢固地稳定在皮肤组织中。 此外，在微探针上形成导电层以感测信号。 还提出了微型笔之间的电隔离设计。 因此，微探针阵列可以用于各种生物电位信号的测量，并且也可以用作刺激。

公开(公告)号：US07429333B2

公开(公告)日：2008-09-30

申请号：US11691573

申请日：2007-03-27

申请人： Jin-Chern Chiou ,  Chen-Chun Hung ,  Chih-Wei Chang

发明人： Jin-Chern Chiou ,  Chen-Chun Hung ,  Chih-Wei Chang

IPC分类号： B44C1/22 ,  C25F3/00

CPC分类号： B29C33/40 ,  B29C33/3878

摘要： The present invention discloses a method for fast fabricating microneedle arrays with an embossing process and a method for fabricating an embossing mold of a microneedle array, wherein a master pattern of a high aspect ratio silicon microneedle array is fabricated with a microelectromechanical technology, and the master pattern is used to fabricate an embossing mold; a thermosetting material is filled into the embossing mold; then, baking, pressing and mold-stripping are undertaken; thereby, disposable solid polymer microneedle arrays can be batch-fabricated.

摘要翻译： 本发明公开了一种用压花工艺快速制造微针阵列的方法和一种用于制造微针阵列的压花模具的方法，其中利用微机电技术制造高纵横比硅微针阵列的母模， 图案用于制造压花模具; 将热固性材料填充到压花模具中; 然后进行烘烤，压制和脱模; 从而可以批量制造一次性固体聚合物微针阵列。

公开(公告)号：US20080009763A1

公开(公告)日：2008-01-10

申请号：US11599303

申请日：2006-11-15

申请人： Jin-Chern Chiou ,  Chih-Wei Chang ,  Chen-Chun Hung

发明人： Jin-Chern Chiou ,  Chih-Wei Chang ,  Chen-Chun Hung

IPC分类号： A61B5/04

CPC分类号： A61B5/0408 ,  A61B5/0478 ,  A61B5/14514 ,  A61B5/685

摘要： A microprobe array structure with self-stabilization capability and a method for manufacturing the same are proposed. The microprobe array structure is used to sense various biopotential signals, and is characterized in that the etching parameters are controlled during etching to manufacture a microprobe structure with a reduced bottom cross section so that the microprobe can be firmly stabilized in the skin tissue. Moreover, a conducting layer is formed on the microprobe to sense signals. A design of electric isolation between microprobes is also proposed. The microprobe array can therefore be used for the measurement of various biopotential signals, and can also be used as a stimulus.

摘要翻译： 提出了具有自稳定能力的微探针阵列结构及其制造方法。 微探针阵列结构用于感测各种生物电位信号，其特征在于在蚀刻期间控制蚀刻参数以制造具有减小的底部横截面的微探针结构，使得微探针能够牢固地稳定在皮肤组织中。 此外，在微探针上形成导电层以感测信号。 还提出了微型笔之间的电隔离设计。 因此，微探针阵列可以用于各种生物电位信号的测量，并且也可以用作刺激。

公开(公告)号：US20090120216A1

公开(公告)日：2009-05-14

申请号：US12128804

申请日：2008-05-29

申请人： Jin-Chern Chiou ,  Chih-Wei Chang

发明人： Jin-Chern Chiou ,  Chih-Wei Chang

IPC分类号： G01D21/00

CPC分类号： G01R1/07321 ,  G01R31/2891

摘要： The present invention discloses a three-dimensional microprobe array assembly structure, wherein spacers are used in assembling edge-type microprobe arrays to form a three-dimensional structure, and the spacers reveal conductive pads of the edge-type microprobe arrays to benefit wire bonding. The present invention detects depths and angles and thus increases detection reliability. Besides, in the present invention, the related IC is integrated with the spacer to achieve circuit integration and reduce cost.

摘要翻译： 本发明公开了一种三维微探针阵列组合结构，其中使用间隔件来组装边缘型微探针阵列以形成三维结构，并且间隔物显示边缘型微探针阵列的导电焊盘以有益于引线接合。 本发明检测深度和角度，从而提高检测可靠性。 此外，在本发明中，相关IC与间隔器集成以实现电路集成并降低成本。

公开(公告)号：US07946050B2

公开(公告)日：2011-05-24

申请号：US12128804

申请日：2008-05-29

申请人： Jin-Chern Chiou ,  Chih-Wei Chang

发明人： Jin-Chern Chiou ,  Chih-Wei Chang

IPC分类号： G01D13/00 ,  G01R31/00

CPC分类号： G01R1/07321 ,  G01R31/2891

摘要： The present invention discloses a three-dimensional microprobe array assembly structure, wherein spacers are used in assembling edge-type microprobe arrays to form a three-dimensional structure, and the spacers reveal conductive pads of the edge-type microprobe arrays to benefit wire bonding. The present invention detects depths and angles and thus increases detection reliability. Besides, in the present invention, the related IC is integrated with the spacer to achieve circuit integration and reduce cost.

摘要翻译： 本发明公开了一种三维微探针阵列组合结构，其中使用间隔件来组装边缘型微探针阵列以形成三维结构，并且间隔物显示边缘型微探针阵列的导电焊盘以有益于引线接合。 本发明检测深度和角度，从而提高检测可靠性。 此外，在本发明中，相关IC与间隔器集成以实现电路集成并降低成本。

公开(公告)号：US07875479B2

公开(公告)日：2011-01-25

申请号：US12382587

申请日：2009-03-19

申请人： Jin-Chern Chiou ,  Chih-Wei Chang

发明人： Jin-Chern Chiou ,  Chih-Wei Chang

IPC分类号： H01L21/00 ,  H01L23/48 ,  H01L23/52

CPC分类号： A61B5/685 ,  A61B2562/0209 ,  A61B2562/046 ,  A61B2562/125 ,  H01L23/481 ,  H01L2224/1613 ,  H01L2924/1461 ,  H01L2924/00

摘要： The present invention discloses an integration structure of a semiconductor circuit and microprobe sensing elements and a method for fabricating the same. In the method of the present invention, a semiconductor circuit is fabricated on one surface of a semiconductor substrate, and the other surface of the semiconductor substrate is etched to form a microprobe structure for detect physiological signals. Next, a deposition method is used to sequentially form an electrical isolated layer and an electrical conductive layer on the microprobes. Then, an electrical conductive material is used to electrically connect the electrical conductive layer with the electrical pads of the semiconductor circuit. Thus is achieved the integration of a semiconductor circuit and microprobe sensing elements in an identical semiconductor substrate with the problem of electric electrical isolated being solved simultaneously. Thereby, the voltage level detected by the microprobes will not interfere with the operation of the semiconductor circuit.

摘要翻译： 本发明公开了一种半导体电路和微探针感测元件的集成结构及其制造方法。 在本发明的方法中，在半导体衬底的一个表面上制造半导体电路，蚀刻半导体衬底的另一个表面以形成用于检测生理信号的微探针结构。 接下来，使用沉积方法在微探针上依次形成电隔离层和导电层。 然后，使用导电材料将导电层与半导体电路的电焊盘电连接。 从而实现半导体电路和微探针感测元件在相同的半导体衬底中的集成，同时解决了电隔离的问题。 由此，微探针检测的电压电平不会干扰半导体电路的动作。

公开(公告)号：US20150173225A1

公开(公告)日：2015-06-18

申请号：US14108339

申请日：2013-12-17

申请人： Cheng-Chao Peng ,  Ke-Sheng Huang ,  Yung-Chih Kuo ,  Chih-Wei Chang ,  Wen-Hua Yu ,  Yu-Yi Wu ,  Yu-Yuan Lin

发明人： Cheng-Chao Peng ,  Ke-Sheng Huang ,  Yung-Chih Kuo ,  Chih-Wei Chang ,  Wen-Hua Yu ,  Yu-Yi Wu ,  Yu-Yuan Lin

IPC分类号： H05K5/03 ,  H05K5/00 ,  H05K13/00 ,  H05K5/02

CPC分类号： G06F1/16 ,  G02F1/133308 ,  G02F2001/133317 ,  G02F2001/133322 ,  G02F2001/133325 ,  G06F1/1616 ,  G06F1/1637 ,  Y10T29/49826

摘要： A display device comprises a cover and a display module. The cover includes a bottom plate and at least one cover limit element. The cover limit element projects inwardly from an inner surface of the bottom of the cover. A space is formed between the bottom plate and the cover limit element. The display module includes a frame with at least one frame limit element disposed at an end of the frame and projecting at a position between the cover limit element and the bottom plate. The frame limit element is configured to be disposed in the space and between the cover limit element and the bottom plate to retain the display module with the cover.

摘要翻译： 显示装置包括盖和显示模块。 盖包括底板和至少一个盖限制元件。 盖限制元件从盖的底部的内表面向内突出。 在底板和盖限位元件之间形成空间。 显示模块包括框架，框架具有至少一个框架限制元件，该框架限定元件设置在框架的端部处，并且在覆盖限制元件和底板之间的位置处突出。 框架限制元件被配置为设置在空间中并且在盖限制元件和底板之间以将盖子保持在显示模块上。

公开(公告)号：US08541697B2

公开(公告)日：2013-09-24

申请号：US13031710

申请日：2011-02-22

申请人： Chih-Wei Chang

发明人： Chih-Wei Chang

IPC分类号： H05K5/06 ,  H04M1/00

CPC分类号： H04M1/0266

摘要： A dustproof structure is used in an electronic device, which includes a housing and a display panel. The dustproof structure includes a dustproof section and a first adhesive section. The dustproof section is located and received in the housing. The first adhesive section is fixed on the one side of the dustproof section, and the display panel is fixed on the dustproof structure by the first adhesive section and is assembled to the housing. The dustproof structure fills gaps between the housing and the display panel.

摘要翻译： 在电子设备中使用防尘结构，其包括壳体和显示面板。 防尘结构包括防尘部和第一粘合部。 防尘部分定位并接收在外壳中。 第一粘合部固定在防尘部的一侧，显示面板通过第一粘合部固定在防尘结构上，并组装到壳体。 防尘结构填充外壳和显示面板之间的间隙。

公开(公告)号：US20120092593A1

公开(公告)日：2012-04-19

申请号：US12970967

申请日：2010-12-17

申请人： Chih-Wei Chang ,  Po-Chun Hsu ,  Kun-Hung Hsieh

发明人： Chih-Wei Chang ,  Po-Chun Hsu ,  Kun-Hung Hsieh

IPC分类号： G02F1/1335 ,  H05K5/02 ,  F21V7/22

CPC分类号： G02B6/0085 ,  G02B6/0088 ,  G02B6/009

摘要： A frame formed by cutting and bending a plate base is provided. The maximum thickness of the frame is T, the thickness of the plate base is t, and 1.5t≦T≦2.5t. The frame includes a first plate element, a second plate element, and a bending portion. The second plate element is directly contacted to the first plate element, and the first plate element is substantially parallel to the second plate element. The bending portion is connected between the first plate element and the second plate element. A backlight module using the above-mentioned frame and a liquid crystal display (LCD) module using the backlight module are also provided.

摘要翻译： 提供了通过切割和弯曲板底座形成的框架。 框架的最大厚度为T，板底的厚度为t，1.5t＆nlE; T＆nlE; 2.5t。 框架包括第一板元件，第二板元件和弯曲部分。 第二板元件直接接触第一板元件，第一板元件基本上平行于第二板元件。 弯曲部分连接在第一板元件和第二板元件之间。 还提供了使用上述框架的背光模块和使用背光模块的液晶显示器（LCD）模块。

公开(公告)号：US20110090141A1

公开(公告)日：2011-04-21

申请号：US12684128

申请日：2010-01-08

申请人： Super Liao ,  Po-Chun Hsu ,  Chih-Wei Chang

发明人： Super Liao ,  Po-Chun Hsu ,  Chih-Wei Chang

IPC分类号： G09G3/36 ,  G02F1/13357

CPC分类号： G09G3/3426 ,  G02B6/0046 ,  G02B6/005 ,  G02B6/0068 ,  G02B6/008 ,  G02B6/0083 ,  G09G2300/0426 ,  G09G2320/0233

摘要： A backlight module including a light guide plate, light source sets, and controlling circuits is provided. The light guide plate has a plurality of regions, and each region of the light guide plate has a light incident surface correspondingly. Each light source set is disposed at the light incident surface of one of the regions of the light guide plate, and each light source set has at least one middle light source and at least one edge light source. The middle light source is disposed in a middle region of the light source set and the edge light source is disposed at an edge of the light source set. Each controlling circuit is electrically connected to the middle light source of one of the light source sets, and the edge light source of each light source set is electrically connected to the controlling circuit of the adjacent light source set.

摘要翻译： 提供了包括导光板，光源组和控制电路的背光模块。 导光板具有多个区域，导光板的各个区域相应地具有光入射面。 每个光源组设置在导光板的一个区域的光入射表面处，并且每个光源组具有至少一个中间光源和至少一个边缘光源。 中间光源设置在光源组的中间区域中，并且边缘光源设置在光源组的边缘。 每个控制电路电连接到一个光源组的中间光源，并且每个光源组的边缘光源电连接到相邻光源组的控制电路。