公开(公告)号：US20100276766A1

公开(公告)日：2010-11-04

申请号：US12432289

申请日：2009-04-29

申请人： Jinbang Tang ,  Lianjun Liu

发明人： Jinbang Tang ,  Lianjun Liu

IPC分类号： H01L29/84 ,  H01L23/498 ,  H01L21/50 ,  H01L21/60

CPC分类号： B81B7/0064 ,  B81B2201/0257 ,  B81B2207/017 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H04R19/005 ,  H04R19/04 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A device comprises a conductive substrate, a micro electromechanical systems (MEMS) structure, and a plurality of bond pads. The conductive substrate has a first side and a second side, the second side opposite the first side. The MEMS structure is formed over the first side of the conductive substrate. The plurality of bond pads are formed over the first side of the conductive substrate and electrically coupled to the first side of the conductive substrate. The conductive substrate and plurality of bond pads function to provide electrostatic shielding to the MEMS structure.

摘要翻译： 一种器件包括导电衬底，微机电系统（MEMS）结构和多个接合焊盘。 导电基板具有第一侧和第二侧，第二侧与第一侧相对。 MEMS结构形成在导电衬底的第一侧上。 多个接合焊盘形成在导电衬底的第一侧上并电耦合到导电衬底的第一侧。 导电衬底和多个接合焊盘用于向MEMS结构提供静电屏蔽。

公开(公告)号：US08330239B2

公开(公告)日：2012-12-11

申请号：US12432289

申请日：2009-04-29

申请人： Jinbang Tang ,  Lianjun Liu

发明人： Jinbang Tang ,  Lianjun Liu

IPC分类号： G01L9/00

CPC分类号： B81B7/0064 ,  B81B2201/0257 ,  B81B2207/017 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H04R19/005 ,  H04R19/04 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A device comprises a conductive substrate, a micro electromechanical systems (MEMS) structure, and a plurality of bond pads. The conductive substrate has a first side and a second side, the second side opposite the first side. The MEMS structure is formed over the first side of the conductive substrate. The plurality of bond pads are formed over the first side of the conductive substrate and electrically coupled to the first side of the conductive substrate. The conductive substrate and plurality of bond pads function to provide electrostatic shielding to the MEMS structure.

摘要翻译： 一种器件包括导电衬底，微机电系统（MEMS）结构和多个接合焊盘。 导电基板具有第一侧和第二侧，第二侧与第一侧相对。 MEMS结构形成在导电衬底的第一侧上。 多个接合焊盘形成在导电衬底的第一侧上并电耦合到导电衬底的第一侧。 导电衬底和多个接合焊盘用于向MEMS结构提供静电屏蔽。

公开(公告)号：US08461657B2

公开(公告)日：2013-06-11

申请号：US13550722

申请日：2012-07-17

申请人： Jinbang Tang ,  Lianjun Liu

发明人： Jinbang Tang ,  Lianjun Liu

IPC分类号： G01L9/00

CPC分类号： B81B7/0064 ,  B81B2201/0257 ,  B81B2207/017 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H04R19/005 ,  H04R19/04 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Embodiments include methods for forming a device comprising a conductive substrate, a micro electro-mechanical systems (MEMS) structure, and a plurality of bond pads. The conductive substrate has a first side and a second side, the second side opposite the first side. The MEMS structure is formed over the first side of the conductive substrate. The plurality of bond pads are formed over the first side of the conductive substrate and electrically coupled to the first side of the conductive substrate. The conductive substrate and plurality of bond pads function to provide electrostatic shielding to the MEMS structure.

摘要翻译： 实施例包括用于形成包括导电衬底，微机电系统（MEMS）结构和多个接合焊盘的器件的方法。 导电基板具有第一侧和第二侧，第二侧与第一侧相对。 MEMS结构形成在导电衬底的第一侧上。 多个接合焊盘形成在导电衬底的第一侧上并电耦合到导电衬底的第一侧。 导电衬底和多个接合焊盘用于向MEMS结构提供静电屏蔽。

公开(公告)号：US08290736B2

公开(公告)日：2012-10-16

申请号：US12710497

申请日：2010-02-23

申请人： Jinbang Tang

发明人： Jinbang Tang

IPC分类号： G01R31/02

CPC分类号： G01R35/007 ,  G01R27/28 ,  H01L22/34 ,  H01L2924/14

摘要： An embodiment of a calibration standard includes a substrate, a set of conductive structures fabricated on the substrate, and a conductive end structure fabricated on the substrate. The set of conductive structures include an inner conductive structure, a first outer conductive structure positioned to one side of the inner conductive structure, and a second outer conductive structure positioned to an opposite side of the inner conductive structure. The inner and outer conductive structures are aligned in parallel with each other along offset principal axes of the inner and outer conductive structures. The conductive end structure is electrically connected between an end of the first outer conductive structure and an end of the second outer conductive structure, and the conductive end structure is spatially separated from an end of the inner conductive structure at the surface of the substrate.

摘要翻译： 校准标准的实施例包括衬底，在衬底上制造的一组导电结构以及在衬底上制造的导电端结构。 该组导电结构包括内导电结构，位于内导电结构一侧的第一外导电结构和位于内导电结构相对侧的第二外导电结构。 内部和外部导电结构沿着内部和外部导电结构的偏移主轴线彼此平行排列。 导电端部结构电连接在第一外部导电结构的端部和第二外部导电结构的端部之间，并且导电端部结构在衬底的表面处与内部导电结构的端部在空间上分离。

公开(公告)号：US20100224969A1

公开(公告)日：2010-09-09

申请号：US12398603

申请日：2009-03-05

申请人： Jinbang Tang

发明人： Jinbang Tang

IPC分类号： H01L23/552 ,  H01L23/48 ,  H01L21/98

CPC分类号： H01L24/82 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/24 ,  H01L2223/6627 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/96 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/1903 ,  H01L2924/3025

摘要： An electronic device and a method of packaging an electronic device are disclosed. In one embodiment, the electronic device can include a first die. The electronic device can also include a dielectric layer defining a first opening. The first die can be disposed within the first opening. Further, the electronic device can include an encapsulating material disposed adjacent to the first die. The encapsulating material can have a different composition as compared to the dielectric layer. In a particular embodiment, the electronic device can also include an electrically conductive carrier contacting the dielectric layer and the encapsulating material.

摘要翻译： 公开了电子设备和包装电子设备的方法。 在一个实施例中，电子设备可以包括第一管芯。 电子设备还可以包括限定第一开口的介电层。 第一模具可以设置在第一开口内。 此外，电子设备可以包括邻近第一管芯设置的封装材料。 与介电层相比，封装材料可以具有不同的组成。 在特定实施例中，电子器件还可以包括接触电介质层和封装材料的导电载体。

公开(公告)号：US20090072357A1

公开(公告)日：2009-03-19

申请号：US11854776

申请日：2007-09-13

申请人： Jinbang Tang ,  Darrel R. Frear ,  Jong-Kai Lin

发明人： Jinbang Tang ,  Darrel R. Frear ,  Jong-Kai Lin

IPC分类号： H01L23/552 ,  H01L21/56

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00

摘要： An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules (30-33) to a process carrier (10) using a double side adhesive tape (12) before encapsulating the modules with a molding compound (16), and then forming shielding via ring structures (51-54) in the molding compound (16) to surround and shield each module. After removing the adhesive tape (12) to expose a surface of the encapsulated modules, a multi-layer circuit substrate (101) is formed over the exposed surface, where the circuit substrate includes shielding via structures (121-124) that are aligned with and electrically connected to the shielding via ring structures (51-54), thereby encircling and shielding the circuit module(s).

摘要翻译： 在多个封装的模块之间通过使用双面胶带（12）将多个模块（30-33）附接到处理载体（10）上而形成电磁干扰（EMI）和/或电磁辐射屏蔽， 具有模制化合物（16）的模块，然后通过模制化合物（16）中的环形结构（51-54）形成屏蔽以围绕和屏蔽每个模块。 在去除粘合带（12）以暴露封装模块的表面之后，在暴露表面上形成多层电路基板（101），其中电路基板包括屏蔽通孔结构（121-124），其与 并且电连接到屏蔽通孔环结构（51-54），从而环绕和屏蔽电路模块。

公开(公告)号：US20090057849A1

公开(公告)日：2009-03-05

申请号：US11846874

申请日：2007-08-29

申请人： Jinbang Tang ,  Darrel R. Frear ,  William H. Lytle

发明人： Jinbang Tang ,  Darrel R. Frear ,  William H. Lytle

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/645 ,  H01L23/66 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/16 ,  H01L2221/68359 ,  H01L2223/6622 ,  H01L2223/6677 ,  H01L2224/24227 ,  H01L2224/2518 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19105

摘要： A packaged semiconductor device includes an interconnect layer over a first side of a polymer layer, a semiconductor device surrounded on at least three sides by the polymer layer and coupled to the interconnect layer, a first conductive element over a second side of the polymer layer, wherein the second side is opposite the first side, and a connector block within the polymer layer. The connector block has at least one electrical path extending from a first surface of the connector block to a second surface of the connector block. The at least one electrical path electrically couples the interconnect layer to the first conductive element. A method of forming the packaged semiconductor device is also described.

摘要翻译： 封装的半导体器件包括在聚合物层的第一侧上的互连层，在聚合物层的至少三个侧面上被耦合到互连层的半导体器件，在聚合物层的第二侧上的第一导电元件， 其中所述第二侧与所述第一侧相对，以及所述聚合物层内的连接器块。 连接器块具有从连接器块的第一表面延伸到连接器块的第二表面的至少一个电路径。 所述至少一个电路将所述互连层电耦合到所述第一导电元件。 还描述了形成封装半导体器件的方法。

公开(公告)号：US09172143B2

公开(公告)日：2015-10-27

申请号：US13751318

申请日：2013-01-28

申请人： Jinbang Tang

发明人： Jinbang Tang

IPC分类号： H01L25/00 ,  H01Q9/04 ,  H01Q1/22

CPC分类号： H01Q9/0407 ,  H01L21/568 ,  H01L24/96 ,  H01L2223/6677 ,  H01Q1/2283 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49171

摘要： An electronic device module as described herein includes an electronic device package having device contacts. The electronic device package is fixed within encapsulating material, along with an electrically conductive ground layer. The ground layer has a device opening in which the electronic device package resides, and the ground layer also has an antenna opening spaced apart from the device opening. The device contacts and one side of the ground layer correspond to a first surface, and a patch antenna element overlies the first surface. The antenna element is coupled to the electronic device package, and a projection of the patch antenna element onto the first surface resides within the antenna opening. Also provided are methods for manufacturing such an electronic device module.

摘要翻译： 如本文所述的电子设备模块包括具有设备触点的电子设备封装。 电子器件封装件与导电接地层一起固定在封装材料内。 接地层具有电子器件封装所在的器件开口，接地层还具有与器件开口间隔开的天线开口。 器件触点和接地层的一侧对应于第一表面，并且贴片天线元件覆盖在第一表面上。 天线元件耦合到电子设备封装，并且贴片天线元件在第一表面上的投影位于天线开口内。 还提供了用于制造这种电子设备模块的方法。

公开(公告)号：US20130135152A1

公开(公告)日：2013-05-30

申请号：US13751318

申请日：2013-01-28

申请人： Jinbang Tang

发明人： Jinbang Tang

IPC分类号： H01Q9/04

CPC分类号： H01Q9/0407 ,  H01L21/568 ,  H01L24/96 ,  H01L2223/6677 ,  H01Q1/2283 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49171

摘要： An electronic device module as described herein includes an electronic device package having device contacts. The electronic device package is fixed within encapsulating material, along with an electrically conductive ground layer. The ground layer has a device opening in which the electronic device package resides, and the ground layer also has an antenna opening spaced apart from the device opening. The device contacts and one side of the ground layer correspond to a first surface, and a patch antenna element overlies the first surface. The antenna element is coupled to the electronic device package, and a projection of the patch antenna element onto the first surface resides within the antenna opening. Also provided are methods for manufacturing such an electronic device module.

摘要翻译： 如本文所述的电子设备模块包括具有设备触点的电子设备封装。 电子器件封装件与导电接地层一起固定在封装材料内。 接地层具有电子器件封装所在的器件开口，接地层还具有与器件开口间隔开的天线开口。 器件触点和接地层的一侧对应于第一表面，并且贴片天线元件覆盖在第一表面上。 天线元件耦合到电子设备封装，并且贴片天线元件在第一表面上的投影位于天线开口内。 还提供了用于制造这种电子设备模块的方法。

公开(公告)号：US08407890B2

公开(公告)日：2013-04-02

申请号：US12692996

申请日：2010-01-25

申请人： Jinbang Tang

发明人： Jinbang Tang

IPC分类号： H05K3/30

CPC分类号： H01Q9/0407 ,  H01L21/568 ,  H01L24/96 ,  H01L2223/6677 ,  H01Q1/2283 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49171

摘要： An electronic device module as described herein includes an electronic device package having device contacts. The electronic device module can be manufactured by providing an electrically conductive ground plane having a device opening for an electronic device package, and having an antenna ground section. The manufacturing method continues by embedding the ground plane and the electronic device package in encapsulating material such that device contacts of the electronic device package and a first side of the ground plane reside at a device mounting surface. Thereafter, an antenna circuit structure is formed overlying the device mounting surface. The antenna circuit structure includes an antenna signal element that cooperates with the antenna ground section to form an integrated antenna for the electronic device module.

摘要翻译： 如本文所述的电子设备模块包括具有设备触点的电子设备封装。 可以通过提供具有用于电子设备封装的器件开口并具有天线接地部分的导电接地平面来制造电子器件模块。 该制造方法通过将接地平面和电子器件封装嵌入到封装材料中而继续，使得电子器件封装的器件触点和接地平面的第一侧驻留在器件安装表面。 此后，在装置安装表面上形成天线电路结构。 天线电路结构包括与天线接地部分配合以形成用于电子设备模块的集成天线的天线信号元件。