Process for producing polyimide film
    1.
    发明授权
    Process for producing polyimide film 有权
    聚酰亚胺薄膜的制造方法

    公开(公告)号:US07871554B2

    公开(公告)日:2011-01-18

    申请号:US11911260

    申请日:2006-04-10

    IPC分类号: B29C55/02 D02J1/22

    摘要: The invention is directed to a process for producing polyimide film, including stretching, at 150° C. to 380° C. and a stretch ratio of 1.2 to 4.0, an unstretched polyimide film which is formed from a polyimide having a repeating unit represented by formula (1): (wherein R represents a tetravalent group derived from cyclohexane; and Φ represents a divalent aliphatic, alicyclic, or aromatic group, or a combination thereof that has a total number of carbon atoms of 2 to 39 and may have at least one connecting group selected from the group consisting of —O—, —SO2—, —CO—, —CH2—, —C(CH3)2—, —OSi(CH3)2—, —C2H4O—, and —S—) and which has an organic solvent content of 0.5 wt. % or more and less than 30 wt. %. The produced polyimide film exhibits transparency, excellent heat resistance, and reduced dimensional changes.

    摘要翻译: 本发明涉及一种制备聚酰亚胺膜的方法,包括在150℃至380℃拉伸和拉伸比为1.2至4.0的拉伸倍数,由具有重复单元的聚酰亚胺形成的未拉伸聚酰亚胺膜,所述聚酰亚胺膜具有由 式(1)表示:(式中,R表示环己烷衍生的四价基团,Φ表示碳原子数为2〜39的二价脂肪族,脂环族或芳香族基团或其组合, 一个选自-O - , - SO 2 - , - CO - , - CH 2 - , - C(CH 3)2 - , - O(CH 3)2 - , - C 2 H 4 O-和-S-的连接基团) 并且其有机溶剂含量为0.5wt。 %以上且小于30重量% %。 所生产的聚酰亚胺膜具有透明性,优异的耐热性和尺寸变化的降低。

    Process for Producing Polyimide Film
    2.
    发明申请
    Process for Producing Polyimide Film 有权
    生产聚酰亚胺薄膜的方法

    公开(公告)号:US20090160089A1

    公开(公告)日:2009-06-25

    申请号:US11911260

    申请日:2006-04-10

    IPC分类号: B29C55/02 C08G73/10

    摘要: The invention is directed to a process for producing polyimide film, including stretching, at 150° C. to 380° C. and a stretch ratio of 1.2 to 4.0, an unstretched polyimide film which is formed from a polyimide having a repeating unit represented by formula (1): (wherein R represents a tetravalent group derived from cyclohexane; and Φ represents a divalent aliphatic, alicyclic, or aromatic group, or a combination thereof that has a total number of carbon atoms of 2 to 39 and may have at least one connecting group selected from the group consisting of —O—, —SO2—, —CO—, —CH2—, —C(CH3)2—, —OSi(CH3)2—, —C2H4O—, and —S—) and which has an organic solvent content of 0.5 wt. % or more and less than 30 wt. %. The produced polyimide film exhibits transparency, excellent heat resistance, and reduced dimensional changes.

    摘要翻译: 本发明涉及一种制备聚酰亚胺膜的方法,包括在150℃至380℃拉伸和拉伸比为1.2至4.0的拉伸倍数,由具有重复单元的聚酰亚胺形成的未拉伸聚酰亚胺膜,所述聚酰亚胺膜具有由 式(1)表示:(式中,R表示来自环己烷的四价基团,Phi表示碳原子数为2〜39的二价脂肪族,脂环族或芳香族基团或其组合, 一个选自-O - , - SO 2 - , - CO - , - CH 2 - , - C(CH 3)2 - , - O(CH 3)2 - , - C 2 H 4 O-和-S-的连接基团) 并且其有机溶剂含量为0.5wt。 %以上且小于30重量% %。 所生产的聚酰亚胺膜具有透明性,优异的耐热性和尺寸变化的降低。

    Metal foil-clad laminate
    5.
    发明授权
    Metal foil-clad laminate 有权
    金属箔覆层压板

    公开(公告)号:US07217462B2

    公开(公告)日:2007-05-15

    申请号:US10841432

    申请日:2004-05-10

    申请人: Shuta Kihara Ko Kedo

    发明人: Shuta Kihara Ko Kedo

    IPC分类号: B32B15/08

    摘要: The metal foil-clad laminate of the present invention comprises at least one polyimide layer made of a polyimide having repeating units represented by the following formula I: wherein R and Φ are as defined in the specification, at least one insulating substrate, and at least one metal foil layer. The polyimide is excellent in thermopress-bonding property, solubility in solvents and heat resistance, and exhibits a low dielectric constant. The metal foil-clad laminate having the polyimide layer is suitably applicable to high-frequency printed wiring boards, etc.

    摘要翻译: 本发明的覆金属箔的层压体包含至少一层由聚酰亚胺构成的聚酰亚胺层,该聚酰亚胺具有由下式I表示的重复单元:其中R和Phi如说明书中所定义,至少一个绝缘基材,至少 一个金属箔层。 聚酰亚胺具有优异的耐热粘合性,在溶剂中的溶解性和耐热性,并且表现出低的介电常数。 具有聚酰亚胺层的金属箔覆层压板适用于高频印刷线路板等

    Transparent electrically-conductive film and its use
    6.
    发明授权
    Transparent electrically-conductive film and its use 有权
    透明导电膜及其用途

    公开(公告)号:US06962756B2

    公开(公告)日:2005-11-08

    申请号:US10284370

    申请日:2002-10-31

    摘要: A transparent electrically-conductive film comprising a substrate made of an aliphatic polyimide having a repeating unit of the formula [I] and a transparent electrically-conductive thin film layer, the transparent electrically-conductive thin film layer being provided on the substrate, wherein R is a tetravalent aliphatic group having 4 to 39 carbon atoms and Φ is a divalent aliphatic group having 1 to 39 carbon atoms or a divalent aromatic group having 6 to 39 carbon atoms; an organic EL element using the above film; a thin-film transistor substrate comprising a substrate formed of a film of a polyimide having a repeating unit of the formula [I] and, provided thereon, a thin-film transistor; and an organic EL element using the above transistor substrate.

    摘要翻译: 一种透明导电膜,其包含由具有式[I]的重复单元的脂族聚酰亚胺和透明导电薄膜层构成的基板,所述透明导电薄膜层设置在所述基板上,其中R 是具有4〜39个碳原子的四价脂肪族基团,Phi是碳原子数1〜39的2价脂肪族基团或碳原子数6〜39的2价芳香族基团。 使用上述膜的有机EL元件; 薄膜晶体管基板,包括由具有式[I]的重复单元的聚酰亚胺膜形成的基板,并且在其上设置有薄膜晶体管; 以及使用上述晶体管基板的有机EL元件。

    Metal-clad laminate
    7.
    发明授权
    Metal-clad laminate 有权
    覆金属层压板

    公开(公告)号:US07858199B2

    公开(公告)日:2010-12-28

    申请号:US10839282

    申请日:2004-05-06

    申请人: Shuta Kihara Ko Kedo

    发明人: Shuta Kihara Ko Kedo

    IPC分类号: B32B15/08 B32B27/08

    摘要: The flexible metal-clad laminate of the present invention comprises at least one polyimide layer made of a polyimide having repeating units represented by the following formula I: wherein R and Φ are as defined in the specification, and at least one metal layer. The polyimide is soluble in solvents and excellent in heat resistance and adhesion property, and shows a low dielectric constant even in a high frequency range.

    摘要翻译: 本发明的柔性覆金属层压板包括至少一个由聚酰亚胺制成的聚酰亚胺层,该聚酰亚胺具有由下式I表示的重复单元:其中R和Φ如说明书中所定义,和至少一个金属层。 聚酰亚胺可溶于溶剂,耐热性和粘合性优异,即使在高频范围内也显示出低的介电常数。

    THERMOSETTING POLYIMIDE RESIN COMPOSITION AND CURED PRODUCT THEREOF
    9.
    发明申请
    THERMOSETTING POLYIMIDE RESIN COMPOSITION AND CURED PRODUCT THEREOF 审中-公开
    热固性聚酰胺树脂组合物及其固化产品

    公开(公告)号:US20090306306A1

    公开(公告)日:2009-12-10

    申请号:US12297518

    申请日:2007-04-17

    IPC分类号: C08G63/91

    摘要: Disclosed is a highly heat-resistant thermosetting polyimide resin composition having long pot life, which enables to obtain a cured product having flexibility and adhesiveness. The thermosetting polyimide resin composition can be obtained through the following steps (1)-(3). Step (1): A step wherein a polyimide (A) is synthesized by a thermal reaction by blending a tetracarboxylic acid component, which is composed of a tetracarboxylic acid dianhydride represented by the formula (1) and one or more compounds selected from tetracarboxylic acids represented by the formula (2) and derivatives of such tetracarboxylic acids, with an aliphatic diamine represented by the formula (3) in such a ratio that the mole number of the tetracarboxylic acid component is higher than the mole number of the aliphatic diamine. Step (2): A step wherein a polyimide (B) is synthesized by a thermal reaction by blending the polyimide (A) obtained in the step (1) with an aromatic diamine represented by the formula (4). Step (3): A step wherein the polyimide (B) obtained in the step (2) is blended and mixed with a bismaleimide compound represented by the formula (5).

    摘要翻译: 公开了一种具有长使用期的高耐热性热固性聚酰亚胺树脂组合物,其能够获得具有柔软性和粘合性的固化产物。 热固性聚酰亚胺树脂组合物可以通过以下步骤(1) - (3)获得。 步骤(1):通过将由式(1)表示的四羧酸二酐和选自四羧酸的一种或多种化合物组成的四羧酸组分,通过热反应合成聚酰亚胺(A) 由式(2)表示的这些四羧酸的衍生物和这样的四羧酸的衍生物与由式(3)表示的脂肪族二胺的比例使得四羧酸成分的摩尔数高于脂肪族二胺的摩尔数。 工序(2):通过将由工序(1)得到的聚酰亚胺(A)与式(4)所示的芳香族二胺混合而通过热反应合成聚酰亚胺(B)的工序。 步骤(3):将步骤(2)中得到的聚酰亚胺(B)与由式(5)表示的双马来酰亚胺化合物混合并混合的步骤。

    Polyimide resin
    10.
    发明授权
    Polyimide resin 有权
    聚酰亚胺树脂

    公开(公告)号:US08110652B2

    公开(公告)日:2012-02-07

    申请号:US12374110

    申请日:2007-07-17

    摘要: A polyimide resin which is soluble in an organic solvent and which has a low coefficient of water absorption, thermosetting properties, high heat resistance and excellent adhesive properties, a method for manufacturing the same, an adhesive and a film each containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided.The polyimide resin is a polyimide resin containing a repeating unit represented by the following formula (1) and a repeating unit represented by the following formula (2), with a proportion of a group presented by the following formula (3) being 50% by mole or more of the whole of X.

    摘要翻译: 可溶于有机溶剂并具有低吸水系数,热固性,高耐热性和优异粘合性的聚酰亚胺树脂,其制造方法,粘合剂和各自含有聚酰亚胺树脂的薄膜和 提供了包含由聚酰亚胺树脂构成的粘合剂层的覆金属层压板。 聚酰亚胺树脂是含有下述式(1)表示的重复单元和下述式(2)表示的重复单元的聚酰亚胺树脂,下述式(3)表示的基团的比例为50质量% 摩尔或更多的整个X.