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公开(公告)号：US5277725A
公开(公告)日：1994-01-11
申请号：US881448
申请日：1992-05-11
申请人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
发明人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
IPC分类号： H05K1/03 , C04B41/48 , C04B41/49 , H01L21/48 , H01L23/08 , H01L23/538 , H05K3/40 , C04B37/00 , B05D5/12
CPC分类号： H01L21/4857 , C04B41/488 , C04B41/4961 , H01L23/5383 , H05K3/4061 , C04B2111/00672 , C04B2111/00844 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K1/0306 , H05K2201/09581 , H05K2203/1147 , H05K2203/308
摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.
摘要翻译： 在金属的热循环过程中经历的裂纹：电介质半导体封装是由热膨胀系数不匹配引起的。 与这种开裂相关的非气密性可以通过用柔性材料回填可渗透裂缝来解决。 金属和电介质材料之间的均匀间隙可以类似地填充柔性材料，以提供应力消除，体积可压缩性和包装的强度。 此外，可渗透的骨架电介质可以被制造为具有烧结冶金的烧结多层结构，并随后注入柔性的温度稳定的材料以提供气密性和强度。
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公开(公告)号：US5135595A
公开(公告)日：1992-08-04
申请号：US503495
申请日：1990-03-30
申请人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
发明人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
CPC分类号： H01L21/4857 , C04B41/488 , C04B41/4961 , H01L23/5383 , H05K3/4061 , C04B2111/00672 , C04B2111/00844 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K1/0306 , H05K2201/09581 , H05K2203/1147 , H05K2203/308
摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.
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公开(公告)号：US5139852A
公开(公告)日：1992-08-18
申请号：US503492
申请日：1990-03-30
申请人： Arnold I. Baise , Ray M. Bryant , Jon A. Casey , Allen J. Dam , Werner E. Dunkel , James N. Humenik , Anthony Mastreani , Robert W. Nufer , Charles H. Perry , Salvatore J. Scilla
发明人： Arnold I. Baise , Ray M. Bryant , Jon A. Casey , Allen J. Dam , Werner E. Dunkel , James N. Humenik , Anthony Mastreani , Robert W. Nufer , Charles H. Perry , Salvatore J. Scilla
CPC分类号： H01L23/5383 , C04B41/488 , C04B41/4961 , H01L21/4857 , H05K3/4061 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2201/09581 , H05K2203/1147 , H05K2203/308 , Y10S428/901 , Y10T428/24917 , Y10T428/24926
摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.
摘要翻译： 在金属的热循环过程中经历的裂纹：电介质半导体封装是由热膨胀系数不匹配引起的。 与这种开裂相关的非气密性可以通过用柔性材料回填可渗透裂缝来解决。 金属和电介质材料之间的均匀间隙可以类似地填充柔性材料，以提供应力消除，体积可压缩性和包装的强度。 此外，可渗透的骨架电介质可以被制造为具有烧结冶金的烧结多层结构，并随后注入柔性的温度稳定的材料以提供气密性和强度。
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