公开(公告)号：US20060170079A1

公开(公告)日：2006-08-03

申请号：US11048968

申请日：2005-02-02

申请人： John Brennan ,  Patrick Carberry ,  Joseph Freund ,  George Libricz ,  Ralph Moyer

发明人： John Brennan ,  Patrick Carberry ,  Joseph Freund ,  George Libricz ,  Ralph Moyer

IPC分类号： H01L23/495

CPC分类号： H01L23/047 ,  H01L23/24 ,  H01L23/49861 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2223/6611 ,  H01L2223/6644 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/78313 ,  H01L2224/85181 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00

摘要： An integrated circuit device is provided having a substrate, at least one integrated circuit element and a leadframe. The integrated circuit element and the leadframe are disposed on the substrate. The leadframe has at least one lead and at least one encapsulant dam disposed on the at least one lead. The encapsulant dam has at least one chamfered edge to provide clearance for a wire feed during a wire-bonding process.

摘要翻译： 提供了具有基板，至少一个集成电路元件和引线框架的集成电路器件。 集成电路元件和引线框架设置在基板上。 引线框具有至少一个引线和至少一个密封剂坝，其设置在至少一个引线上。 密封剂坝具有至少一个倒角边缘，以在引线接合过程期间为焊丝进给提供间隙。

公开(公告)号：US20060145317A1

公开(公告)日：2006-07-06

申请号：US11029254

申请日：2004-12-31

申请人： John Brennan ,  Patrick Carberry ,  Jeffery Gilbert ,  George Libricz ,  Ralph Moyer ,  John Osenbach

发明人： John Brennan ,  Patrick Carberry ,  Jeffery Gilbert ,  George Libricz ,  Ralph Moyer ,  John Osenbach

IPC分类号： H01L21/44 ,  H01L23/495

CPC分类号： H01L23/49861 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The specification describes a plastic cavity package for semiconductor devices that provides additional mechanical integrity for leads that extend from the plastic housing. Portions of the leads that are within the plastic housing are provided with cutouts. When the plastic housing is formed, or when the cavity is filled with polymer, plastic material fills the cutout, and joins to the mass of plastic on either side of the cutout, thus forming a continuous integral mass of plastic. The end result is that the plastic in the cutout, coupled to the main plastic mass, and to the rigid package sidewall, forms an effective anchor against pulling and bending forces the leads may encounter in manufacture or use.

摘要翻译： 本说明书描述了一种用于半导体器件的塑料腔封装，为从塑料外壳延伸的引线提供额外的机械完整性。 在塑料外壳内的引线部分设有切口。 当塑料壳体形成时，或者当空腔填充聚合物时，塑料材料填充切口，并且连接到切口两侧的塑料块，从而形成连续的整体塑料块。 最终的结果是，连接到主塑料块的切口中的塑料和刚性的包装侧壁形成了有效的锚固件，以防止引线在制造或使用中遇到的拉力和弯曲力。

公开(公告)号：US20070241433A1

公开(公告)日：2007-10-18

申请号：US11788346

申请日：2007-04-19

申请人： Patrick Carberry ,  Jeffery Gilbert ,  George Libricz ,  Ralph Moyer ,  John Osenbach ,  Hugo Safar ,  Thomas Shilling

发明人： Patrick Carberry ,  Jeffery Gilbert ,  George Libricz ,  Ralph Moyer ,  John Osenbach ,  Hugo Safar ,  Thomas Shilling

IPC分类号： H01L23/495

CPC分类号： H01L23/49548 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of the sidewalls. A portion of the lead frame within the sidewall has at least one aperture penetrating into the lead frame. The sidewall material extends into the aperture, thereby forming a strong interfacial bond that provides a low leakage, sidewall-lead-frame interface. The base has a reentrant feature that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby forming a low leakage base-sidewall interface. The top surface of the base has a groove that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby enhancing the low leakage base-sidewall interface.

摘要翻译： 半导体器件封装包括包括基底和侧壁的容器。 基座被配置为支撑半导体器件芯片，并且引线框架延伸穿过至少一个侧壁。 引导框架在侧壁内的一部分具有穿透引线框架的至少一个孔。 侧壁材料延伸到孔中，从而形成强界面结合，其提供低泄漏侧壁引线框架界面。 底座具有位于至少一个侧壁的厚度内并与至少一个侧壁接合的折入特征，从而形成低泄漏的底壁 - 侧壁界面。 基座的顶表面具有凹槽，该凹槽位于至少一个侧壁的厚度内并与至少一个侧壁接合，由此增强了低泄漏的底壁 - 侧壁界面。

公开(公告)号：US20060131707A1

公开(公告)日：2006-06-22

申请号：US11015534

申请日：2004-12-18

申请人： Patrick Carberry ,  Jeffery Gilbert ,  George Libricz ,  Ralph Moyer ,  John Osenbach ,  Hugo Safar ,  Thomas Shilling

发明人： Patrick Carberry ,  Jeffery Gilbert ,  George Libricz ,  Ralph Moyer ,  John Osenbach ,  Hugo Safar ,  Thomas Shilling

IPC分类号： H01L23/495

CPC分类号： H01L23/49548 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of the sidewalls. A portion of the lead frame within the sidewall has at least one aperture penetrating into the lead frame. The sidewall material extends into the aperture, thereby forming a strong interfacial bond that provides a low leakage, sidewall-lead-frame interface. The base has a reentrant feature that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby forming a low leakage-base-sidewall interface. The top surface of the base has a groove that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby enhancing the low leakage base-sidewall interface.

摘要翻译： 半导体器件封装包括包括基底和侧壁的容器。 基座被配置为支撑半导体器件芯片，并且引线框架延伸穿过至少一个侧壁。 引导框架在侧壁内的一部分具有穿透引线框架的至少一个孔。 侧壁材料延伸到孔中，从而形成强界面结合，其提供低泄漏侧壁引线框架界面。 底座具有位于至少一个侧壁的厚度内的折入特征，并与至少一个侧壁接合，从而形成低泄漏基底 - 侧壁界面。 基座的顶表面具有凹槽，该凹槽位于至少一个侧壁的厚度内并与至少一个侧壁接合，由此增强了低泄漏的底壁 - 侧壁界面。

公开(公告)号：US20060131704A1

公开(公告)日：2006-06-22

申请号：US11015535

申请日：2004-12-18

申请人： Patrick Carberry ,  Jeffery Gilbert ,  George Libricz ,  Ralph Moyer

发明人： Patrick Carberry ,  Jeffery Gilbert ,  George Libricz ,  Ralph Moyer

IPC分类号： H01L23/495

CPC分类号： H01L23/057 ,  H01L23/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01079 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device package comprises a container having a base and side walls of an electrically insulating material. A semiconductor device chip is disposed on the base, and a lead frame extends through the side walls. At least one electrical conductor couples the lead frame to the chip. A first layer of an electrically insulating cured gel covers the chip and the lead frame, and a second layer of an electrically insulating cured gel covers at least the portion of the first layer that covers the chip, but does not extend to the side walls. In one embodiment, the second layer has the shape of a dome. In a preferred embodiment the gel comprises silicone. In another embodiment a third layer of conformal insulating material is disposed on the second layer and essentially fills the container. Also is described is a method of making the package for use with RFLDMOS chips.

摘要翻译： 半导体器件封装包括具有电绝缘材料的基底和侧壁的容器。 半导体器件芯片设置在基座上，引线框架延伸穿过侧壁。 至少一个电导体将引线框架连接到芯片。 电绝缘固化凝胶的第一层覆盖芯片和引线框架，并且电绝缘固化凝胶的第二层至少覆盖覆盖芯片的第一层的部分，但不延伸到侧壁。 在一个实施例中，第二层具有圆顶的形状。 在优选的实施方案中，凝胶包含硅树脂。 在另一个实施例中，第三层共形绝缘材料设置在第二层上并基本上填充容器。 还描述了制造用于RFLDMOS芯片的封装的方法。

公开(公告)号：US20050224926A1

公开(公告)日：2005-10-13

申请号：US10816060

申请日：2004-04-01

申请人： Timothy Bambridge ,  Jeffery Gilbert ,  Juan Herbsommer ,  Jeffrey Klemovage ,  George Libricz

发明人： Timothy Bambridge ,  Jeffery Gilbert ,  Juan Herbsommer ,  Jeffrey Klemovage ,  George Libricz

IPC分类号： H01L23/047 ,  H01L23/34 ,  H01L23/36 ,  H01L23/538 ,  H01L25/16

CPC分类号： H01L23/36 ,  H01L23/047 ,  H01L23/5387 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an integrated circuit device comprises a heat spreader having a top surface and a bottom surface. At least one integrated circuit die is attached to the top surface of the heat spreader. A flexible leadframe is also attached to the top surface of the heat spreader. The flexible leadframe has one or more flexible layers, including at least one flexible insulating layer. A plurality of electrically conductive traces are defined on the at least one flexible insulating layer.

摘要翻译： 提供了一种具有柔性引线框架的集成电路器件，以及用于制造柔性引线框和集成电路器件的技术。 在本发明的一个方面，集成电路装置包括具有顶表面和底表面的散热器。 至少一个集成电路管芯连接到散热器的顶表面。 柔性引线框架也附接到散热器的顶表面。 柔性引线框具有一个或多个柔性层，包括至少一个柔性绝缘层。 多个导电迹线限定在至少一个柔性绝缘层上。

公开(公告)号：US20060097367A1

公开(公告)日：2006-05-11

申请号：US11302690

申请日：2005-12-14

申请人： Timothy Bambridge ,  Jeffery Gilbert ,  Juan Herbsommer ,  Jeffrey Klemovage ,  George Libricz

发明人： Timothy Bambridge ,  Jeffery Gilbert ,  Juan Herbsommer ,  Jeffrey Klemovage ,  George Libricz

IPC分类号： H01L23/495

CPC分类号： H01L23/36 ,  H01L23/047 ,  H01L23/5387 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an integrated circuit device comprises a heat spreader having a top surface and a bottom surface. At least one integrated circuit die is attached to the top surface of the heat spreader. A flexible leadframe is also attached to the top surface of the heat spreader. The flexible leadframe has one or more flexible layers, including at least one flexible insulating layer. A plurality of electrically conductive traces are defined on the at least one flexible insulating layer.