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公开(公告)号：US20070241433A1
公开(公告)日：2007-10-18
申请号：US11788346
申请日：2007-04-19
申请人： Patrick Carberry , Jeffery Gilbert , George Libricz , Ralph Moyer , John Osenbach , Hugo Safar , Thomas Shilling
发明人： Patrick Carberry , Jeffery Gilbert , George Libricz , Ralph Moyer , John Osenbach , Hugo Safar , Thomas Shilling
IPC分类号： H01L23/495
CPC分类号： H01L23/49548 , H01L23/4334 , H01L23/49541 , H01L23/49861 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01322 , H01L2924/13091 , H01L2924/14 , H01L2924/16195 , H01L2924/19041 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of the sidewalls. A portion of the lead frame within the sidewall has at least one aperture penetrating into the lead frame. The sidewall material extends into the aperture, thereby forming a strong interfacial bond that provides a low leakage, sidewall-lead-frame interface. The base has a reentrant feature that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby forming a low leakage base-sidewall interface. The top surface of the base has a groove that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby enhancing the low leakage base-sidewall interface.
摘要翻译： 半导体器件封装包括包括基底和侧壁的容器。 基座被配置为支撑半导体器件芯片，并且引线框架延伸穿过至少一个侧壁。 引导框架在侧壁内的一部分具有穿透引线框架的至少一个孔。 侧壁材料延伸到孔中，从而形成强界面结合，其提供低泄漏侧壁引线框架界面。 底座具有位于至少一个侧壁的厚度内并与至少一个侧壁接合的折入特征，从而形成低泄漏的底壁 - 侧壁界面。 基座的顶表面具有凹槽，该凹槽位于至少一个侧壁的厚度内并与至少一个侧壁接合，由此增强了低泄漏的底壁 - 侧壁界面。
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公开(公告)号：US20060131707A1
公开(公告)日：2006-06-22
申请号：US11015534
申请日：2004-12-18
申请人： Patrick Carberry , Jeffery Gilbert , George Libricz , Ralph Moyer , John Osenbach , Hugo Safar , Thomas Shilling
发明人： Patrick Carberry , Jeffery Gilbert , George Libricz , Ralph Moyer , John Osenbach , Hugo Safar , Thomas Shilling
IPC分类号： H01L23/495
CPC分类号： H01L23/49548 , H01L23/4334 , H01L23/49541 , H01L23/49861 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01322 , H01L2924/13091 , H01L2924/14 , H01L2924/16195 , H01L2924/19041 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device package comprises a container including a base and sidewalls. The base is configured to support a semiconductor device chip, and a lead frame extends through at least one of the sidewalls. A portion of the lead frame within the sidewall has at least one aperture penetrating into the lead frame. The sidewall material extends into the aperture, thereby forming a strong interfacial bond that provides a low leakage, sidewall-lead-frame interface. The base has a reentrant feature that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby forming a low leakage-base-sidewall interface. The top surface of the base has a groove that is positioned within the thickness of at least one of the sidewalls and engages the at least one sidewall, thereby enhancing the low leakage base-sidewall interface.
摘要翻译： 半导体器件封装包括包括基底和侧壁的容器。 基座被配置为支撑半导体器件芯片，并且引线框架延伸穿过至少一个侧壁。 引导框架在侧壁内的一部分具有穿透引线框架的至少一个孔。 侧壁材料延伸到孔中，从而形成强界面结合，其提供低泄漏侧壁引线框架界面。 底座具有位于至少一个侧壁的厚度内的折入特征，并与至少一个侧壁接合，从而形成低泄漏基底 - 侧壁界面。 基座的顶表面具有凹槽，该凹槽位于至少一个侧壁的厚度内并与至少一个侧壁接合，由此增强了低泄漏的底壁 - 侧壁界面。
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公开(公告)号：US20060170095A1
公开(公告)日：2006-08-03
申请号：US11049407
申请日：2005-02-02
申请人： John Brennan , Joseph Freund , Ralph Moyer , John Osenbach , Hugo Safar , Thomas Shilling
发明人： John Brennan , Joseph Freund , Ralph Moyer , John Osenbach , Hugo Safar , Thomas Shilling
IPC分类号： H01L23/34
CPC分类号： H01L23/047 , H01L23/10 , H01L23/24 , H01L23/36 , H01L23/3675 , H01L23/564 , H01L23/66 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/0655 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48247 , H01L2224/49109 , H01L2224/85203 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/16315 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2224/45099
摘要： Device packages often include walls build on a heat sink that surrounds a device die that thermally interacts with the heat sink. Use of raised or depressed feature on said heat sink that contacts the walls improves the cohesiveness of the package. By appropriately positioning these features contaminant infusion into the package is improved without degrading cohesiveness.
摘要翻译： 设备包通常包括围绕与散热器热相互作用的设备管芯的散热器上的壁。 在所述散热器上使用与壁接触的凸起或凹陷特征改善了包装的内聚性。 通过适当地定位这些特征，可以改善污染物输入到包装中而不降低粘结性。
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公开(公告)号：US20060139896A1
公开(公告)日：2006-06-29
申请号：US11055712
申请日：2005-02-10
申请人： Timothy Bambridge , Juan Herbsommer , Osvaldo Lopez , Joel Lott , Hugo Safar , Thomas Shilling
发明人： Timothy Bambridge , Juan Herbsommer , Osvaldo Lopez , Joel Lott , Hugo Safar , Thomas Shilling
IPC分类号： H05K7/04
CPC分类号： H05K1/021 , H01L23/13 , H01L23/3677 , H01L23/49816 , H01L23/66 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/32188 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49175 , H01L2924/00014 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01074 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H01L2924/30111 , H05K1/141 , H05K1/182 , H05K3/0061 , H05K3/3436 , H05K2201/10734 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： An electronic module has a non-conducting substrate having at least one opening and a die/carrier assembly mounted within the opening in the substrate. The assembly has a conducting carrier and one or more integrated circuit (IC) dies mounted to the carrier. The invention may be implemented as an electronic system comprising a circuit board (CB) and at least one such electronic module mounted to the CB.
摘要翻译： 电子模块具有至少一个开口的非导电衬底和安装在衬底的开口内的模具/载体组件。 组件具有导电载体和安装到载体上的一个或多个集成电路（IC）管芯。 本发明可以被实现为包括电路板（CB）和安装到CB的至少一个这样的电子模块的电子系统。
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公开(公告)号：US20060220194A1
公开(公告)日：2006-10-05
申请号：US11095929
申请日：2005-03-31
申请人： John Osenbach , Thomas Shilling , Weidong Xie
发明人： John Osenbach , Thomas Shilling , Weidong Xie
IPC分类号： H01L23/495
CPC分类号： H01L23/3735 , H01L24/32 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： Techniques for integrated circuit device fabrication are provided. In one aspect, an integrated circuit device comprises a base, at least one die attached to the base, and a counterbalancing layer on at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die. In another aspect, warping of an integrated circuit device comprising at least one die attached to a base is controlled by applying a counterbalancing layer to at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die.
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公开(公告)号：US20080041620A1
公开(公告)日：2008-02-21
申请号：US11891279
申请日：2007-08-09
IPC分类号： H05K1/11
CPC分类号： B23K1/0016 , B23K2101/42 , H01L2224/16225 , H05K3/26 , H05K3/3421 , H05K3/3442 , H05K3/3452 , H05K2201/0989 , H05K2201/09909 , H05K2201/10689 , H05K2201/10727
摘要： The specification describes a surface mount method for the manufacture of high device density circuit boards. The stand-off space of the components on the board can be enlarged significantly by selectively omitting, or selectively removing, the soldermask underneath the component package. This improves access of the cleaning fluid to the underside of the component during the cleaning operation.
摘要翻译： 该说明书描述了用于制造高器件密度电路板的表面贴装方法。 通过选择性地省略或选择性地去除组件封装下方的焊接掩模，可以显着增大板上部件的间隔空间。 这在清洁操作期间改善了清洁流体到组件的下侧的访问。
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公开(公告)号：US20050247761A1
公开(公告)日：2005-11-10
申请号：US10838897
申请日：2004-05-04
CPC分类号： B23K1/0016 , B23K2101/42 , H01L2224/16225 , H05K3/26 , H05K3/3421 , H05K3/3442 , H05K3/3452 , H05K2201/0989 , H05K2201/09909 , H05K2201/10689 , H05K2201/10727
摘要： The specification describes a surface mount method for the manufacture of high device density circuit boards. The stand-off space of the components on the board can be enlarged significantly by selectively omitting, or selectively removing, the soldermask underneath the component package. This improves access of the cleaning fluid to the underside of the component during the cleaning operation.
摘要翻译： 该说明书描述了用于制造高器件密度电路板的表面贴装方法。 通过选择性地省略或选择性地去除组件封装下方的焊接掩模，可以显着增大板上部件的间隔空间。 这在清洁操作期间改善了清洁流体到组件的下侧的访问。
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公开(公告)号：US6003358A
公开(公告)日：1999-12-21
申请号：US740167
申请日：1996-10-22
摘要： The present invention relates generally to bending a workpiece to form a desired configuration and, in particular, to a method and apparatus for forming bends "out of sequence," i.e., in a time sequence different from the spatial sequence of the bends on the workpiece. The apparatus of the present invention include a bending system for bending a workpiece and a positioning system for positioning the workpiece relative to a bending region so that bends can be formed in various locations across the bending region. By virtue of the disclosed structures, a series of bends can be formed on a workpiece at various locations within the bending region. Bends can be formed out sequence and without advancing the workpiece relative to the bending region.
摘要翻译： 本发明一般涉及弯曲工件以形成期望的构造，特别是涉及用于形成“不合序”的弯曲的方法和装置，即在与工件上的弯曲的空间顺序不同的时间序列中 。 本发明的装置包括用于弯曲工件的弯曲系统和用于相对于弯曲区域定位工件的定位系统，使得能够在弯曲区域的不同位置形成弯曲部。 通过所公开的结构，可以在弯曲区域内的各个位置上的工件上形成一系列弯曲部。 可以顺序地形成弯曲并且不使工件相对于弯曲区域前进。
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公开(公告)号：US5415530A
公开(公告)日：1995-05-16
申请号：US197940
申请日：1994-02-16
申请人： Thomas Shilling
发明人： Thomas Shilling
CPC分类号： F04B27/0869 , F04B27/0804 , F04B27/0813 , F04B27/0839 , F04B39/0005 , F05C2225/10 , F05C2253/12
摘要： A new oiless air compressor and vacuum pump design features at least two synchronously rotating disks whose rotations are at intersecting angles of rotation. As each disk rotates, it carries at least one piston or cylinder alternatively to and from its mate. Therefore, a moving piston in a cylinder is used to compress the air. The resultant compressor ideally configured has two pair of six each centrally mounted opposing pistons. It can output 120 p.s.i.g. for 50,000 hours.
摘要翻译： 新的无油空气压缩机和真空泵设计具有至少两个同步旋转的盘，其旋转处于相交的旋转角度。 当每个盘旋转时，它与其配合物交替地携带至少一个活塞或气缸。 因此，气缸中的移动活塞用于压缩空气。 所得压缩机理想地构造有两对六个每个中心安装的相对的活塞。 它可以输出120 p.s.i.g. 50,000小时。
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公开(公告)号：US5304043A
公开(公告)日：1994-04-19
申请号：US967810
申请日：1992-10-28
申请人： Thomas Shilling
发明人： Thomas Shilling
CPC分类号： F04B27/0869 , F04B27/0804 , F04B27/0813 , F04B27/0839 , F04B39/0005 , F05C2225/10 , F05C2253/12
摘要： A new oiless air compressor and vacuum pump design features at least two synchronously rotating disks whose rotations are at intersecting angles of rotation. As each disk rotates, it carries at least one piston or cylinder alternatively to and from its mate. Therefore, a moving piston in a cylinder is used to compress the air. The resultant compressor ideally configured has two pair of six each centrally mounted opposing pistons. It can output 120 p.s.i.g. for 50,000 hours.
摘要翻译： 新的无油空气压缩机和真空泵设计具有至少两个同步旋转的盘，其旋转处于相交的旋转角度。 当每个盘旋转时，它与其配合物交替地携带至少一个活塞或气缸。 因此，气缸中的移动活塞用于压缩空气。 所得压缩机理想地构造有两对六个每个中心安装的相对的活塞。 它可以输出120 p.s.i.g. 50,000小时。
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