公开(公告)号：US06773560B2

公开(公告)日：2004-08-10

申请号：US09823948

申请日：2001-03-30

申请人： John M. Pedersen ,  Jeremy Willey ,  Daniel J. Woodruff

发明人： John M. Pedersen ,  Jeremy Willey ,  Daniel J. Woodruff

IPC分类号： C25D1706

CPC分类号： C25D17/001 ,  A61K35/12 ,  C12N2500/25 ,  C12N2500/32 ,  C12N2500/34 ,  C12N2500/40 ,  C12N2501/11 ,  C12N2501/39 ,  C12N2501/395 ,  C12N2506/22 ,  C25D5/08 ,  C25D7/123 ,  C25D17/004 ,  C25D17/06 ,  H01L21/2885

摘要： Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system carried by the support member. The support member, for example, can be a ring or another structure that has an opening configured to receive the workpiece. In one embodiment, the support member is a conductive ring. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member. The contact members can comprise electrically conductive biasing elements that have contact sites and the contact members can also have a dielectric coating covering at least a portion of the biasing elements. The contact system can also have a shield carried by the support member and a seal on the lip of the shield. The shield and seal are configured to prevent electroplating solution from engaging the contact members.

摘要翻译： 接触组件，具有接触组件的电镀机以及用于制造微电子工件的接触组件的方法。 接触组件可以是干式接触组件。 用于电镀系统的接触组件可以包括由支撑构件承载的支撑构件和接触系统。 例如，支撑构件可以是具有被构造成接收工件的开口的环或另一结构。 在一个实施例中，支撑构件是导电环。 接触系统可以具有相对于支撑构件向内突出到开口中的多个接触构件。 接触构件可以包括具有接触位置的导电偏置元件，并且接触构件还可以具有覆盖偏置元件的至少一部分的电介质涂层。 接触系统还可以具有由支撑构件承载的护罩和护罩的唇缘上的密封。 屏蔽和密封被构造成防止电镀溶液接触接触构件。

公开(公告)号：US06645356B1

公开(公告)日：2003-11-11

申请号：US09386558

申请日：1999-08-31

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

IPC分类号： C25D1700

CPC分类号： C25D17/001 ,  C25D7/123

摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.

公开(公告)号：US06869510B2

公开(公告)日：2005-03-22

申请号：US09998142

申请日：2001-10-30

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

IPC分类号： C23C18/16 ,  A61K35/12 ,  C23C28/00 ,  C25D5/08 ,  C25D7/12 ,  C25D17/06 ,  H01L21/288

CPC分类号： H01L21/2885 ,  A61K35/12 ,  C12N2500/25 ,  C12N2500/32 ,  C12N2500/34 ,  C12N2500/40 ,  C12N2501/11 ,  C12N2501/39 ,  C12N2501/395 ,  C12N2506/22 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06

摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution.

摘要翻译： 阐述了将金属镀在工件表面上的反应器。 反应器包括反应器碗，其包括设置在其中的电镀溶液和设置在与电镀溶液接触的反应器碗中的阳极。 接触组件与反应器碗内的阳极间隔开。 接触组件包括多个触点，其设置成接触工件表面的周边边缘以向工件的表面提供电镀功率。 当工件与其接合时，触头在工件的表面上执行擦拭动作。触头组件还包括设置在多个触点内部的屏障。 阻挡层包括设置成接合工件的表面以帮助将多个触点与电镀溶液隔离的构件。

公开(公告)号：US06309520B1

公开(公告)日：2001-10-30

申请号：US09386803

申请日：1999-08-31

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

IPC分类号： C25D1700

CPC分类号： C25D17/001 ,  C25D7/123

摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.

摘要翻译： 阐述了将金属镀在工件表面上的反应器。 反应器包括反应器碗，其包括设置在其中的电镀溶液和设置在与电镀溶液接触的反应器碗中的阳极。 接触组件与反应器碗内的阳极间隔开。 接触组件包括多个触点，其设置成接触工件表面的周边边缘以向工件的表面提供电镀功率。 当工件与其接合时，触头在工件的表面上执行擦拭动作。触头组件还包括设置在多个触点内部的屏障。 阻挡层包括设置成接合工件的表面以帮助将多个触点与电镀溶液隔离的构件。 在一个实施例中，多个触点是离散弯曲的形式，而在另一个实施例中，多个触点是贝尔维尔环接触的形式。 可以在接触组件中设置流路，以向多个触点和工件的周边边缘提供净化气体。 吹扫气体可用于帮助形成接触组件的屏障。 还提出了组合电镀/无电镀工具和方法。

公开(公告)号：US06303010B1

公开(公告)日：2001-10-16

申请号：US09386197

申请日：1999-08-31

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

IPC分类号： C25D1704

CPC分类号： H01L21/68721 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/687 ,  H01L21/68728 ,  H01L21/68735 ,  H01L21/68785

摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.

摘要翻译： 阐述了将金属镀在工件表面上的反应器。 反应器包括反应器碗，其包括设置在其中的电镀溶液和设置在与电镀溶液接触的反应器碗中的阳极。 接触组件与反应器碗内的阳极间隔开。 接触组件包括多个触点，其设置成接触工件表面的周边边缘以向工件的表面提供电镀功率。 当工件与其接合时，触头对工件的表面执行擦拭动作。触头组件还包括设置在多个触点内部的屏障。 阻挡层包括设置成接合工件的表面以帮助将多个触点与电镀溶液隔离的构件。 在一个实施例中，多个触点是离散弯曲的形式，而在另一个实施例中，多个触点是贝尔维尔环接触的形式。 可以在接触组件中设置流路，以向多个触点和工件的周边边缘提供净化气体。 吹扫气体可用于帮助形成接触组件的屏障。 还提出了组合电镀/无电镀工具和方法。

公开(公告)号：US06699373B2

公开(公告)日：2004-03-02

申请号：US09944152

申请日：2001-08-30

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

IPC分类号： C25D1700

CPC分类号： H01L21/68721 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/687 ,  H01L21/68728 ,  H01L21/68735 ,  H01L21/68785

摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.

摘要翻译： 阐述了将金属镀在工件表面上的反应器。 反应器包括反应器碗，其包括设置在其中的电镀溶液和设置在与电镀溶液接触的反应器碗中的阳极。 接触组件与反应器碗内的阳极间隔开。 接触组件包括多个触点，其设置成接触工件表面的周边边缘以向工件的表面提供电镀功率。 当工件与其接合时，触头在工件的表面上执行擦拭动作。触头组件还包括设置在多个触点内部的屏障。 阻挡层包括设置成接合工件的表面以帮助将多个触点与电镀溶液隔离的构件。 在一个实施例中，多个触点是离散弯曲的形式，而在另一个实施例中，多个触点是贝尔维尔环接触的形式。 可以在接触组件中设置流路，以向多个触点和工件的周边边缘提供净化气体。 吹扫气体可用于帮助形成接触组件的屏障。 还提出了组合电镀/无电镀工具和方法。

公开(公告)号：US06309524B1

公开(公告)日：2001-10-30

申请号：US09386610

申请日：1999-08-31

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

IPC分类号： C25D1704

CPC分类号： H01L21/2885 ,  A61K35/12 ,  C12N2500/25 ,  C12N2500/32 ,  C12N2500/34 ,  C12N2500/40 ,  C12N2501/11 ,  C12N2501/39 ,  C12N2501/395 ,  C12N2506/22 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06

摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith. The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.

摘要翻译： 阐述了将金属镀在工件表面上的反应器。 反应器包括反应器碗，其包括设置在其中的电镀溶液和设置在与电镀溶液接触的反应器碗中的阳极。 接触组件与反应器碗内的阳极间隔开。 接触组件包括多个触点，其设置成接触工件表面的周边边缘以向工件的表面提供电镀功率。 当工件与其接合时，触头对工件的表面执行擦拭动作。 接触组件还包括设置在多个触点内部的屏障。 阻挡层包括设置成接合工件的表面以帮助将多个触点与电镀溶液隔离的构件。 在一个实施例中，多个触点是离散弯曲的形式，而在另一个实施例中，多个触点是贝尔维尔环接触的形式。 可以在接触组件中设置流路，以向多个触点和工件的周边边缘提供净化气体。 吹扫气体可用于帮助形成接触组件的屏障。 还提出了组合电镀/无电镀工具和方法。

公开(公告)号：US20130299343A1

公开(公告)日：2013-11-14

申请号：US13468273

申请日：2012-05-10

申请人： Randy A. Harris ,  Daniel J. Woodruff ,  Jeffrey I. Turner ,  Gregory J. Wilson ,  Paul R. McHugh

发明人： Randy A. Harris ,  Daniel J. Woodruff ,  Jeffrey I. Turner ,  Gregory J. Wilson ,  Paul R. McHugh

IPC分类号： C25D19/00

CPC分类号： C25D17/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002

摘要： An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is attached to the electrode plate with a membrane in between them. Electrolyte moves through the flow path at a high velocity, preventing bubbles from sticking to the bottom surface of membrane. Any bubbles in the flow path are entrained in the fast moving electrolyte and carried away from the membrane. The electroplating processor may alternatively have a wire electrode extending through a tubular membrane formed into a coil or other shape, optionally including shapes having straight segments.

公开(公告)号：US08562752B2

公开(公告)日：2013-10-22

申请号：US13299141

申请日：2011-11-17

申请人： Daniel J. Woodruff

发明人： Daniel J. Woodruff

IPC分类号： B08B7/04 ,  B08B5/04 ,  B08B3/00 ,  B08B1/02 ,  B08B7/00 ,  B08B3/14 ,  B08B3/12 ,  B08B6/00

CPC分类号： C25D17/001 ,  C25D17/16 ,  H01L21/00 ,  Y10S134/902

摘要： A process chamber for processing semi-conductor wafers. The chamber includes at least one rotor within the process chamber. The rotor is adapted to receive and/or process semi-conductor wafers. The top of the process chamber also includes a tiltable rim. This rim tilts from a non-inclined position to an inclined position. The wafers may be loaded into and unloaded from the process chamber when the rim is in its inclined position.

摘要翻译： 用于处理半导体晶片的处理室。 该室包括处理室内的至少一个转子。 转子适于接收和/或处理半导体晶片。 处理室的顶部还包括可倾斜的边缘。 该边缘从非倾斜位置倾斜到倾斜位置。 当轮辋处于其倾斜位置时，晶片可以被装载到处理室中并从处理室卸载。

公开(公告)号：US08313631B2

公开(公告)日：2012-11-20

申请号：US12917997

申请日：2010-11-02

申请人： Paul R. McHugh ,  Gregory J. Wilson ,  Daniel J. Woodruff

发明人： Paul R. McHugh ,  Gregory J. Wilson ,  Daniel J. Woodruff

IPC分类号： C25D5/00

CPC分类号： C25D7/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/10 ,  C25F3/30

摘要： Apparatus and methods for electrochemically processing microfeature wafers. The apparatus can have a vessel including a processing zone in which a microfeature wafer is positioned for electrochemical processing. The apparatus further includes at least one counter electrode in the vessel that can operate as an anode or a cathode depending upon the particular plating or electropolishing application. The apparatus further includes a supplementary electrode and a supplementary virtual electrode. The supplementary electrode is configured to operate independently from the counter electrode in the vessel, and it can be a thief electrode and/or a de-plating electrode depending upon the type of process. The supplementary electrode can further be used as another counter electrode during a portion of a plating cycle or polishing cycle. The supplementary virtual electrode is located in the processing zone, and it is configured to counteract an electric field offset relative to the wafer associated with an offset between the wafer and the counter electrode in the vessel when the wafer is in the processing zone.

摘要翻译： 用于电化学处理微片的装置和方法。 该装置可以具有容器，该容器包括处理区域，微处理区域定位用于电化学处理。 该装置还包括容器中的至少一个对电极，其可以根据具体的电镀或电解抛光应用而作为阳极或阴极操作。 该装置还包括辅助电极和辅助虚拟电极。 辅助电极被配置为独立于容器中的对电极操作，并且其可以是根据工艺类型的小电极和/或去镀电极。 在电镀循环或抛光循环的一部分期间，辅助电极可以进一步用作另一个对电极。 辅助虚拟电极位于处理区域中，并且其被配置为当晶片处于处理区域时，相对于与晶片和对置电极之间的偏移相关联的晶片抵消相对于晶片的电场偏移。