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1.发明授权公开(公告)号：US06488570B1
公开(公告)日：2002-12-03
申请号：US09665840
申请日：2000-09-20
申请人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr. , Lee Melbourne Cook
发明人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr. , Lee Melbourne Cook
IPC分类号： B24B100
CPC分类号： B24B37/26 , B24B41/047 , B24D3/28 , B24D3/34 , B24D13/10 , G11B23/0021 , H01L21/30625
摘要： A method of making a polishing pad composition comprising a high modulus phase component and a low modulus phase component, and a method of polishing a semiconductor substrate by creating nanoasperities at a polishing interface between the polishing layer and the wafer during polishing by providing the high modulus phase component at the polishing interface, either as protrusions from the polishing layer, or by being released from the polishing layer into the polishing interface.
摘要翻译： 一种制造包含高模量相成分和低模量相成分的抛光垫组合物的方法，以及通过在抛光过程中在抛光层和晶片之间的抛光界面处产生纳米级的抛光来提供半模量的方法 抛光界面上的相分量，作为来自抛光层的突起，或通过从抛光层释放到抛光界面中。
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2.发明授权Polishing slurry compositions capable of providing multi-modal particle packing 有权能够提供多模式颗粒包装的抛光浆料组合物公开(公告)号：US06375694B1
公开(公告)日：2002-04-23
申请号：US09575787
申请日：2000-05-22
IPC分类号： C09K314
CPC分类号： H01L21/3212 , C09K3/1463 , H01L21/31053
摘要： Water based polishing slurries, comprising oxide polishing particles. The polishing slurries comprise an innovative (multi-modal) particle distribution for improved polishing performance.
摘要翻译： 水基抛光浆料，包括氧化物抛光颗粒。 抛光浆料包括创新（多模态）颗粒分布，用于改善抛光性能。
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3.发明授权Apparatus and methods for chemical-mechanical polishing of semiconductor wafers 有权用于化学机械抛光半导体晶片的装置和方法公开(公告)号：US06210525B1
公开(公告)日：2001-04-03
申请号：US09634788
申请日：2000-08-09
申请人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr. , Lee Melbourne Cook
发明人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr. , Lee Melbourne Cook
IPC分类号： H01L2100
CPC分类号： B24B37/26 , B24B37/04 , B24B41/047 , B24B57/02 , B24D3/28 , B24D3/34 , B24D13/10 , G11B23/0021 , H01L21/02024
摘要： An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which are particles having an imputed radius (of curvature) of about 0.5 to about 0.1 microns and sufficient resiliency to permanently deform by less than 10% which contact the wafer surface in combination with a reactive liquid solution.
摘要翻译： 提供了一种用于抛光半导体晶片的表面的设备和方法，其中抛光垫在其表面上具有多个纳米级，其是具有约0.5至约0.1微米的插补半径（曲率）的颗粒，并且具有足够的永久性弹性 变形小于10％，其与晶片表面结合反应性液体溶液接触。
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公开(公告)号：US06245679B1
公开(公告)日：2001-06-12
申请号：US09498267
申请日：2000-02-03
申请人： Lee Melbourne Cook , David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr.
发明人： Lee Melbourne Cook , David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr.
IPC分类号： H01L2100
CPC分类号： B24B37/26 , B24B37/04 , B24B41/047 , B24B57/02 , B24D3/28 , B24D3/34 , G11B23/0021
摘要： An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which are particles having an imputed radius (of curvature) of about 0.5 to about 0.1 microns and sufficient resiliency to permanently deform by less than 10% which contact the wafer surface in combination with a reactive liquid solution.
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5.发明授权Polishing system having a multi-phase polishing substrate and methods relating thereto 失效具有多相抛光基板的抛光系统及其相关方法公开(公告)号：US06375559B1
公开(公告)日：2002-04-23
申请号：US09384607
申请日：1999-08-27
申请人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr. , Lee Melbourne Cook
发明人： David B. James , William D. Budinger , John V. H. Roberts , Michael R. Oliver , Nina G. Chechik , Richard M. Levering, Jr. , Lee Melbourne Cook
IPC分类号： B24D1100
CPC分类号： B24B37/26 , B24B41/047 , B24D3/28 , B24D3/34 , B24D13/10 , G11B23/0021 , H01L21/30625
摘要： A chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices or the like. The invention is directed to a polishing pad composition comprising a high modulus phase component and a low modulus phase component. The multi-phase polishing pads are very efficient and effective in providing high performance polishing along an entire polishing surface interface.
摘要翻译： 特别适用于制造半导体器件等的化学机械抛光系统。 本发明涉及一种包括高模量相分量和低模量相分量的抛光垫组合物。 多相抛光垫在提供沿着整个抛光表面界面的高性能抛光方面是非常有效和有效的。
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6.发明授权Polishing slurry compositions capable of providing multi-modal particle packing and methods relating thereto 有权能够提供多模式颗粒包装的抛光浆料组合物和与其相关的方法
公开(公告)号：US6093649A
公开(公告)日：2000-07-25
申请号：US131261
申请日：1998-08-07
IPC分类号： C09K3/14 , H01L21/3105 , H01L21/321 , H01L21/304
CPC分类号： H01L21/3212 , C09K3/1463 , H01L21/31053
摘要： Water based polishing slurries, comprising oxide polishing particles. The polishing slurries comprise an innovative (multi-modal) particle distribution for improved polishing performance.
摘要翻译： 水基抛光浆料，包括氧化物抛光颗粒。 抛光浆料包括创新（多模态）颗粒分布，用于改善抛光性能。
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7.发明授权公开(公告)号：US06210254B1
公开(公告)日：2001-04-03
申请号：US09496327
申请日：2000-02-02
IPC分类号： C09K314
摘要： An innovative method of manufacturing polishing pads using photo-curing polymers and photolithography. The photolithography enables the creation of useful surface patterns not possible with conventional machining techniques and enables the use of pad materials otherwise too soft to pattern by conventional machining techniques.
摘要翻译： 使用光固化聚合物和光刻法制造抛光垫的创新方法。 光刻使得能够利用常规的加工技术创建有用的表面图案，并且能够使用垫子材料，否则太软而不能通过常规的加工技术进行图案化。
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公开(公告)号：US6022264A
公开(公告)日：2000-02-08
申请号：US021437
申请日：1998-02-10
IPC分类号： B24B37/26 , B24B41/047 , B24D3/28 , B24D13/14 , B24B1/00
CPC分类号： B24B37/26 , B24B41/047 , B24D3/28
摘要： A chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices or the like. The invention is directed to a self-dressing, hydrophilic polishing pad capable of releasing particles during polishing. Such a pad design is very efficient in providing polishing particles over the entire polishing surface interface. Since the polishing pad produces polishing particles, the polishing fluid can comprise very low loadings of polishing particles, if any.
摘要翻译： 一种特别适用于制造半导体器件等的化学机械抛光系统。 本发明涉及能够在抛光期间释放颗粒的自修整亲水抛光垫。 这种垫设计在整个抛光表面界面上提供抛光颗粒是非常有效的。 由于抛光垫产生抛光颗粒，因此抛光液可以包含非常低的抛光颗粒的载量（如果有的话）。
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9.发明授权Polymeric polishing pad having photolithographically induced surface patterns(s) and methods relating thereto 失效具有光刻诱导表面图案的聚合物抛光垫和与其相关的方法
公开(公告)号：US06036579A
公开(公告)日：2000-03-14
申请号：US5708
申请日：1998-01-12
摘要： An innovative method of manufacturing polishing pads using photocuring polymers and photolithography. The photolithography enables the creation of useful surface patterns not possible with conventional machining techniques and enables the use of pad materials otherwise too soft to pattern by conventional machining techniques.
摘要翻译： 使用光固化聚合物和光刻制造抛光垫的创新方法。 光刻使得能够利用常规的加工技术创建有用的表面图案，并且能够使用垫子材料，否则太软而不能通过常规的加工技术进行图案化。
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公开(公告)号：US06518188B2
公开(公告)日：2003-02-11
申请号：US10061783
申请日：2002-02-01
IPC分类号： H01L2100
CPC分类号： B24B37/26 , B24B37/04 , B24B41/047 , B24B57/02 , B24D3/28 , B24D3/34 , B24D13/10 , G11B23/0021 , H01L21/02024
摘要： An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which are particles having an imputed radius (of curvature) of about 0.5 to about 0.1 microns and sufficient resiliency to permanently deform by less than 10% which contact the wafer surface in combination with a reactive liquid solution which may be recirculated, analyzed, adjusted, and from which soluble reaction products may be removed.
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