公开(公告)号：US07020362B2

公开(公告)日：2006-03-28

申请号：US10635810

申请日：2003-08-05

申请人： Jonathan Simon ,  Lisa A. Windover ,  Steven A. Rosenau

发明人： Jonathan Simon ,  Lisa A. Windover ,  Steven A. Rosenau

IPC分类号： G02B6/26 ,  G02B6/42

CPC分类号： G02B6/3636 ,  G02B6/3652 ,  G02B6/3692 ,  G02B6/4249

摘要： A single channel optical interconnect for a fiber optic system includes a penetrator made of optically transmissive material and configured for insertion along the length of a plastic optical fiber for transferring light between the optical fiber and an optoelectronic device. A multiple channel optical interconnect uses a linear array of optoelectronic devices and corresponding optically transmissive penetrators. The penetrators may be pyramidal or conical bodies made of plastic or glass that are positioned above corresponding vertical cavity surface emitting lasers (VCSELs). The penetrators may also be etched directly into the substrates of bottom emitting VCSELs. The penetrators may have specially tailored side wall angles, or coatings, to facilitate coupling into the optical fibers and minimize back reflections into the VCSELs.

摘要翻译： 用于光纤系统的单通道光学互连包括由光学透射材料制成的穿透器，并且被配置为沿着塑料光纤的长度插入以在光纤和光电子器件之间传送光。 多通道光学互连使用光电子器件的线性阵列和相应的光学透射穿透器。 穿透器可以是位于相应的垂直腔表面发射激光器（VCSEL）上方的由塑料或玻璃制成的金字塔形或圆锥形体。 穿透器也可以直接蚀刻到底部发射VCSEL的衬底中。 穿透器可以具有特别定制的侧壁角度或涂层，以便于耦合到光纤中并使到VCSEL的后反射最小化。

公开(公告)号：US06879032B2

公开(公告)日：2005-04-12

申请号：US10623304

申请日：2003-07-18

申请人： Steven A. Rosenau ,  Mohammed E. Ali ,  Brian E. Lemoff ,  Lisa A. Windover

发明人： Steven A. Rosenau ,  Mohammed E. Ali ,  Brian E. Lemoff ,  Lisa A. Windover

IPC分类号： H01L21/60 ,  G02B6/42 ,  H05K1/14 ,  H05K1/18 ,  H01L23/48

CPC分类号： G02B6/4201 ,  G02B6/4281 ,  G02B6/4283 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10734 ,  H01L2924/00

摘要： A folded flex circuit interconnect increases a number of interconnection pads of a grid array interface available to accommodate high count outputs from distinct circuit elements. The circuit interconnect includes a substrate capable of being folded, a conductor layer adjacent to a surface of the substrate, and a pad array having an interconnection pad connected to the conductor layer at a first end of the circuit interconnect. The pad array is part of the grid array interface. An optics module includes the folded flex circuit interconnect and an optical unit. The folded flex circuit interconnect further includes an electrical interface at a second end that is connected to the conductor layer. The folded flex circuit interconnect connects to the optical unit using the electrical interface. The circuit interconnect connects the optical unit to a motherboard using the pad array at the first end.

公开(公告)号：US06989500B2

公开(公告)日：2006-01-24

申请号：US10857205

申请日：2004-05-28

申请人： Jonathan Simon ,  Steven A. Rosenau

发明人： Jonathan Simon ,  Steven A. Rosenau

IPC分类号： H01H29/00

CPC分类号： H01P1/127 ,  H01H50/005 ,  H01H2029/008

摘要： A miniaturized relay with an integrated electromagnetic actuator allows scaling a reed relay to a small size to reduce the power needed to actuate it while retaining a high quality liquid metal contact. A dragged liquid metal contact is used. Coplanar waveguides may be used for the switched signal instead of microstrip transmission lines to reduce transmission line discontinuities that occur due to impedance changes.

摘要翻译： 具有集成电磁执行器的小型化继电器允许将簧片继电器缩放到小尺寸，以减少致动它所需的功率，同时保持高质量的液态金属接触。 使用拖曳的液态金属接触。 共面波导可以用于开关信号而不是微带传输线，以减少由于阻抗变化而发生的传输线不连续性。

公开(公告)号：US06963038B1

公开(公告)日：2005-11-08

申请号：US10857306

申请日：2004-05-28

申请人： Jonathan Simon ,  Steven A. Rosenau

发明人： Jonathan Simon ,  Steven A. Rosenau

IPC分类号： H01H29/00 ,  H01H51/22 ,  H01H59/00 ,  H01P1/12

CPC分类号： H01H59/0009 ,  H01H2029/008 ,  H01H2059/0072 ,  H01H2059/0081 ,  H01P1/127

摘要： Liquid metal microrelays may be made where a contact is formed by constraining a quantity of liquid metal at the end of a contact support suspended over a substrate. Movement of the contact support typically drags the liquid metal along the surface of the substrate and allows the liquid metal to bridge contacts located on the substrate. Coplanar waveguides may be used for the switched signal instead of microstrip transmission lines to reduce transmission line discontinuities due to impedance changes.

摘要翻译： 可以通过在悬浮在基板上的接触支撑件的端部约束一定量的液态金属来形成液体金属微型继电器。 接触支撑件的移动通常沿着衬底的表面拖动液体金属，并允许液体金属桥接位于衬底上的接触。 共面波导可以用于开关信号而不是微带传输线，以减少由于阻抗变化引起的传输线不连续性。

公开(公告)号：US07018219B2

公开(公告)日：2006-03-28

申请号：US10787647

申请日：2004-02-25

申请人： Steven A. Rosenau

发明人： Steven A. Rosenau

IPC分类号： H01R12/00

CPC分类号： H05K1/112 ,  H05K1/0237 ,  H05K1/0298 ,  H05K3/3421 ,  H05K3/3436 ,  H05K2201/09472 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2203/049

摘要： An electrical component, such as a trace, signal line, or contact pad connected to the trace or signal line, is covered by one or more layers. The electrical component is connected directly to an electrical device by forming an opening through the one or more layers. The opening exposes a portion of the electrical component. A connector, such as a solder ball, a pin contact, or a wire bond, is then attached to the exposed portion of the electrical component. The connector connects directly to another electrical device to create an electrical connection between the electrical component and the electrical device. The electrical device may be configured, for example, as a second signal line or contact pad in another stripline circuit, a microstrip circuit, an integrated circuit, or an electrical component.

摘要翻译： 连接到迹线或信号线的电气部件，例如迹线，信号线或接触焊盘，被一层或多层覆盖。 电气部件通过形成通过一个或多个层的开口直接连接到电气装置。 开口露出电气部件的一部分。 然后将诸如焊球，针接触或引线接合的连接器附接到电气部件的暴露部分。 连接器直接连接到另一个电气设备，以在电气部件和电气设备之间形成电连接。 电气设备可以被配置为例如另一个带状线电路中的第二信号线或接触焊盘，微带电路，集成电路或电气部件。

公开(公告)号：US07358452B2

公开(公告)日：2008-04-15

申请号：US11171610

申请日：2005-06-30

申请人： Timothy Beerling ,  Steven A. Rosenau ,  Benjamin P. Law ,  Ronald Shane Fazzio ,  Marco Aimi

发明人： Timothy Beerling ,  Steven A. Rosenau ,  Benjamin P. Law ,  Ronald Shane Fazzio ,  Marco Aimi

IPC分类号： H01H29/00

CPC分类号： H01H1/0036 ,  H01H2029/008

摘要： A switch comprises a first wafer having a thin-film structure defined thereon, a second wafer having a plurality of features defined therein, and a seal between the first wafer and the second wafer forming a two-wafer structure having a liquid metal microswitch defined therebetween.

摘要翻译： 开关包括具有限定在其上的薄膜结构的第一晶片，具有限定在其中的多个特征的第二晶片，以及在第一晶片和第二晶片之间的密封，形成两晶片结构，其具有限定在其间的液态金属微动开关 。

公开(公告)号：US07271688B1

公开(公告)日：2007-09-18

申请号：US11240998

申请日：2005-09-30

申请人： Timothy Beerling ,  Steven A. Rosenau

发明人： Timothy Beerling ,  Steven A. Rosenau

IPC分类号： H01H29/00

CPC分类号： H01H29/00 ,  H01H47/004 ,  H01H59/0009 ,  H01H2029/008

摘要： A three-stage liquid metal switch employing electrowetting on dielectric (EWOD), including a common EWOD switch 1310 having an input port 1302, a first shared-EWOD-switch output 1336, and a second shared-EWOD-switch output 1338; a first EWOD switch 1340 having a first-EWOD-switch input 1343, a first output port 1304, and a first-EWOD-switch output 1368; and a second EWOD switch 1370 having a second-EWOD-switch input 1373, a second output port 1306, and a second-EWOD-switch output 1398; wherein the first shared-EWOD-switch output 1336 is operably connected to the first-EWOD-switch input 1343, and the second shared-EWOD-switch output 1338 is operably connected to the second-EWOD-switch input 1373.

摘要翻译： 在电介质（EWOD）上采用电润湿的三级液态金属开关，包括具有输入端口1302的公共EWOD开关1310，第一共享EWOD开关输出1336和第二共享EWOD开关输出1338; 具有第一EWOD开关输入1343，第一输出端口1304和第一EWOD开关输出1368的第一EWOD开关1340; 以及具有第二EWOD开关输入1373，第二输出端口1306和第二EWOD开关输出1398的第二EWOD开关1370; 其中第一共享EWOD开关输出1336可操作地连接到第一EWOD开关输入1343，并且第二共享EWOD开关输出1338可操作地连接到第二EWOD开关输入1373。