摘要:
Reflow Grid Array (RGA) technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a ball grid array (BGA) package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is application of solder to the RGA interposer. Technical solutions described herein provide processes and equipment for application of solder and formation of solder balls to connect an RGA interposer to a BGA package.
摘要:
Reflow Grid Array technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a BGA package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is solder cleaning and removal when removing a BGA package. Technical solutions described herein provide processes and equipment for bulk solder removal from a BGA package that can be executed in the field.
摘要:
A wireless gimbal connection of use with electronics devices such as computer notebooks relatively pivotable portions such as a lid and base. The gimbal includes a carriage on which transmitter and receiver chips are mounted, and further has a magnet whose magnetic forces may be used to bring the gimbaled carriage into a predetermined alignment with the base, which may be used to arrange the chips and any sensors as may be used into alignment as well. As the orientation of the lid varies with respect to the base, the carriage within seeks alignment with the base due to the magnetic forces present. Where the base is located on a flat surface, gravitational forces also contribute to the alignment.
摘要:
Disclosed is structure and methods for engaging/disengaging a peripheral component interconnect compliant card with/from a slot therefor, without having to power down the system (e.g., computer) or remove any system chassis components. The structure includes a bracket to hold the card, which bracket can be adjustable to hold cards of different sizes. The structure also includes a frame member attached to the system chassis, the frame member having a guide rail to guide the bracket and peripheral component interconnect compliant card to engage/disengage the card with/from the slot therefor. The adjustable retention bracket can be used independently of use of the frame member, to hold peripheral component interconnect compliant cards rigid and stable.
摘要:
Particular embodiments described herein provide for an electronic system that includes a docking station configured to wirelessly couple to an electronic device and a wireless charging element removably coupled to the docking station. The wireless charging element includes a power receiving unit and is configured to wireless charge the electronic device. In an example, the docking station is configured for high speed input/output.
摘要:
A mobile device assembly comprising a land grid array (LGA) socket configured to couple with a board of a mobile device. The LGA socket may be configured to couple with a component of the mobile device. A mobile independent loading mechanism (ILM) may at least partially overlap the component and couple with the board of the mobile device via one or more fasteners. By coupling with the board of the mobile device, the mobile ILM may therefore apply pressure to the component, securely holding the component to the LGA socket.
摘要:
In one embodiment an electronic device comprises a housing having a first section and a second section comprising a display coupled to the first section by a hinge assembly, a rotation control assembly to control rotation of the hinge assembly, and a controller to activate the rotation control assembly in response to detection of a force condition at a second section of the housing of an electronic device. Other embodiments may be described.
摘要:
According to some embodiments, a test fluid may be provided into a chamber associated with a cooling system for an electronic integrated circuit. Moreover, a valve may be partially inserted into an opening of the chamber to seal the chamber. The valve may include a first sealing portion to seal the chamber at the opening when the valve shaft is inserted the first distance. The valve may then be inserted an intermediate distance, between the first distance and a second distance, to unseal the chamber. Note that the valve may include a second sealing portion, offset from the first sealing portion, to seal the chamber at the opening when the valve is inserted the second distance. The valve may further define a passage, between the first and second sealing portions, to permit a flow of the test fluid when the valve is inserted the intermediate distance.
摘要:
A computer assembly is described. That computer assembly includes a plate that contains a plurality of receptacles for receiving a plurality of fasteners, and that has a plurality of openings for enabling components to pass through it. The computer assembly also includes a plurality of fasteners, each being coupled to a receptacle, and a printed circuit board. The printed circuit board is attached to the plate by the plurality of fasteners, and a plurality of components pass through the openings formed in the plate.
摘要:
A method and assembly for utilizing a gasket to protect an exposed die from damage, such as chipping and cracking, caused by external forces such as shock, vibrations, installation and/or handling, as well as to prevent electromagnetic interference (EMI) emissions from the exposed die.