摘要:
A method for recognizing positions of a plurality of nodes which constitute a wireless sensor network is provided, the method comprises generating sub-maps which represent the relative position to neighbor nodes by taking each of the plurality of nodes as a reference; selecting a sub-map which takes a node with the highest connectivity as a reference from among the plurality of nodes; selecting a sub-map which takes a node with the highest connectivity as a reference, except for the node which becomes a reference of the selected sub-map among the nodes which are included in the selected sub-map; integrating the selected sub-maps into one map by matching the same nodes among the nodes which are commonly included in the selected sub-maps; and thereafter correcting positions of nodes which are included in the integrated map to real positions, whereby integrating order of the sub-map is adjusted using an information of the connectivity of the nodes, and the positions of the nodes which constitute the wireless sensor network is constituted are correctly recognized by correcting the position of the nodes.
摘要:
Provided is an apparatus and method of dynamically managing a sensor module on a sensor node in a wireless sensor network. The apparatus includes an update unit, a request unit, and a transmission unit. If a change occurs in sensor data corresponding to each sensor node stored in a sensor information storage server, the update unit receives the sensor data from the sensor information storage server, and transmits the received sensor data to the corresponding sensor node. The request unit requests the sensor data from the sensor information storage server upon receipt of a sensor data request message from the sensor node. The transmission unit receives the requested sensor data from the sensor information storage server and transmits the received sensor data to the sensor node.
摘要:
Provided are an apparatus and method for controlling a radiation direction. The apparatus includes parasitic elements disposed in proximity to the antenna, wherein each of the parasitic elements comprises an antenna; a first portion that is inclined with respect to a prepared ground surface at a first angle and a second portion that is inclined with respect to the first portion at a second angle; a lumped element having a variable reactance, which is disposed on each of the first and second portions; and a determination unit controlling the reactance of the lumped element so as to determine the radiation direction of the antenna. By using the apparatus and the method, the antenna has various radiation directions.
摘要:
Provided are an apparatus and method for controlling a radiation direction. The apparatus includes parasitic elements disposed in proximity to the antenna, wherein each of the parasitic elements comprises an antenna; a first portion that is inclined with respect to a prepared ground surface at a first angle and a second portion that is inclined with respect to the first portion at a second angle; a lumped element having a variable reactance, which is disposed on each of the first and second portions; and a determination unit controlling the reactance of the lumped element so as to determine the radiation direction of the antenna. By using the apparatus and the method, the antenna has various radiation directions.
摘要:
A method of fabricating a bottom chassis is provided. The method of fabricating the bottom chassis includes, for example, forming a bottom chassis using a steel plate having a thickness in the range of 0.5 mm to 0.9 mm, the steel plate having a stack structure including an inner layer containing 0.001 to 0.1 weight percent (wt. %) carbon (C), 0.002 to 0.05 wt. % silicon (Si), 0.28 to 2.0 wt. % manganese (Mn), balance iron (Fe), and other impurities, an electro-galvanized layer formed on the inner layer, and a polymer chromium (Cr)-free contamination resistant layer formed on the electro-galvanized layer, and performing a burring process and a tapping process on the bottom chassis to form a burring part to receive a bolt for an engagement.
摘要:
A portable communication device that cradles a first and a second display units at a same angle, and a slide-type cradling apparatus thereof are disclosed. The portable communication device includes: a first housing; a second housing including a first display unit and facing the first housing when being slid and cradled at a known incline angle; and a third housing including a second display unit, and being introduced into the first housing before the second housing is slid and being withdrawn from the first housing after the second housing is slid such that the second housing is inclined and the third housing is inclined in an extension direction of the second housing.
摘要:
A portable terminal is provided, in which a hinge device provides a pair of hinge axes extended in parallel, a pair of folding cases are engaged with the hinge device and rotate upon the hinge axes, respectively, and sliding housings are installed in the respective folding cases. The folding cases rotate in a folding direction or in an unfolding direction via the hinge device, and when the folding cases rotate, the sliding housings slide on the folding cases. When the sliding housings are opened at 180° with respect to each other, one end of the sliding housing is in a close relationship with one end of another sliding housing.
摘要:
A semiconductor device having a contact barrier for insulating contacts with a large aspect ratio and having a fine pitch between adjacent conductive lines and a method of manufacturing the same are provided. The semiconductor device includes a buried contact formed in a region between two adjacent first conductive lines and two adjacent second conductive lines. Insulating lines define a width of the buried contact. To form the contact barrier, an interlayer dielectric layer formed on the second conductive lines is patterned to form a space and an insulating line having an etching ratio different from the interlayer dielectric layer is formed in the space. The interlayer dielectric layer is selectively wet etched relative to an insulating layer covering the second conductive line and the first insulating line to form buried contact hole. The buried contact hole is filled with conductive material to form a buried contact.
摘要:
Wafer structures and wafer bonding methods are provided. In some embodiments, a wafer bonding method includes providing a conductive wafer and a plurality of insulating wafers, the conductive wafer being larger than the insulating wafers; performing a pre-treatment operation on the conductive wafer, the insulating wafers, or both; and directly bonding the insulating wafers to the conductive wafer.
摘要:
The present invention relates to chemical vapor deposition apparatus. In the chemical vapor deposition apparatus, an RF power source connection portionconnected to an external RF power source is installed on an upper side of a chamber; an RF electrode plate is installed within the chamber to be spaced with a predetermined gap from an inner upper surface of the chamber and to be spaced with a predetermined gap from a showerhead disposed below the RF electrode plate; plasma is generated in a first buffer portion, which is defined by a gap between the RF electrode plate and an upper surface of the showerhead, by means of the electric power applied from the external RF power source to the RF electrode plate; the showerhead is divided into two sections in a vertical direction and a second buffer portion is defined by a space between the two sections; reactant gases are supplied to the first buffer portion in which the plasma is generated; and source gases are supplied to the second buffer portion.