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    METHOD OF ELECTROLESS PLATING
    1.
    发明申请
    METHOD OF ELECTROLESS PLATING 审中-公开
    电镀镀层的方法

    公开(公告)号：US20100015362A1

    公开(公告)日：2010-01-21

    申请号：US12505560

    申请日：2009-07-20

    申请人： Joo-Han LEE ,  Dong-Chun LEE ,  Yong-Hyun KIM ,  Seong-Chan Han

    发明人： Joo-Han LEE ,  Dong-Chun LEE ,  Yong-Hyun KIM ,  Seong-Chan Han

    IPC分类号： B05D1/18

    CPC分类号： H05K3/244 ,  C23C18/1673 ,  C23C18/32 ,  C23C18/42 ,  H05K2203/072 ,  H05K2203/104

    摘要： An apparatus for electroless plating includes a plating bath containing an aqueous metal salt solution, and a magnetic field generator for generating a magnetic field. An object to be plated is immersed in the solution. The magnetic field generated by the magnetic field generator increases the level at which the metal ions are attracted to a surface of the object. Therefore, a layer of plating of good quality may be formed at a rapid rate.

    摘要翻译： 无电镀装置包括含有金属盐水溶液的电镀液和用于产生磁场的磁场发生器。 将待镀物体浸入溶液中。 由磁场发生器产生的磁场增加金属离子被吸引到物体表面的水平。 因此，可以以快速的速度形成质量好的电镀层。

    Semiconductor module socket apparatus
    2.
    发明授权
    Semiconductor module socket apparatus 有权
    半导体模块插座设备

    公开(公告)号：US08587946B2

    公开(公告)日：2013-11-19

    申请号：US12987552

    申请日：2011-01-10

    申请人： Joo-Han Lee ,  Jung-Hoon Kim ,  Seong-Chan Han

    发明人： Joo-Han Lee ,  Jung-Hoon Kim ,  Seong-Chan Han

    IPC分类号： H05K7/20

    CPC分类号： G06F1/20 ,  G06F1/183 ,  H05K7/1431

    摘要： A semiconductor module socket apparatus including a socket main body in which a socket groove corresponding to a semiconductor module is formed; a socket pin mounted in the socket groove of the socket main body so as to be electrically connected to a module pin of the semiconductor module; and a heat radiating member mounted in the socket main body so as to externally radiate heat that is generated in the semiconductor module and then is delivered from the socket groove and the socket pin. According to the semiconductor module socket apparatus, it is possible to prevent the heat generated in the semiconductor module from being delivered to the main board, to increase the heat radiation efficiency, to significantly save an installation space, to reduce the installation costs, and to realize no-noise and no-vibration of the semiconductor module socket apparatus.

    摘要翻译： 一种半导体模块插座装置，包括形成有与半导体模块相对应的插座槽的插座主体; 插座销安装在插座主体的插座槽中，以电连接到半导体模块的模块销; 以及散热构件，其安装在插座主体中，以便外部辐射在半导体模块中产生的热量，然后从插座槽和插座销传送。 根据半导体模块插座装置，可以防止半导体模块中产生的热量被传送到主板，从而提高散热效率，显着地节省安装空间，降低安装成本，并且 实现半导体模块插座装置的无噪声和无振动。

    Semiconductor module, socket for the same, and semiconductor module/socket assembly
    3.
    发明授权
    Semiconductor module, socket for the same, and semiconductor module/socket assembly 有权
    半导体模块，插座相同，以及半导体模块/插座组件

    公开(公告)号：US08385080B2

    公开(公告)日：2013-02-26

    申请号：US13006692

    申请日：2011-01-14

    申请人： Jung-Hoon Kim ,  Seong-Chan Han ,  Dong-Chun Lee ,  Jae-Hoon Choi ,  Sun-Kyu Hwang

    发明人： Jung-Hoon Kim ,  Seong-Chan Han ,  Dong-Chun Lee ,  Jae-Hoon Choi ,  Sun-Kyu Hwang

    IPC分类号： H05K7/00

    CPC分类号： H05K7/00

    摘要： A semiconductor module, a socket for the same, and a semiconductor module/socket assembly are disclosed. The semiconductor module includes a printed circuit board including a plurality of semiconductor devices, a plurality of insulating layers and a plurality of metal layers, the plurality of insulating layers and the plurality of metal layers are alternately stacked. Exposed portions of the metal layers are exposed to the outside of the semiconductor module at a first and a second ends of the printed circuit board. The first end and the second end are at opposite ends of the printed circuit board.

    摘要翻译： 公开了半导体模块，用于其的插座和半导体模块/插座组件。 半导体模块包括具有多个半导体器件，多个绝缘层和多个金属层的印刷电路板，多个绝缘层和多个金属层交替堆叠。 金属层的露出部分在印刷电路板的第一和第二端处暴露于半导体模块的外部。 第一端和第二端位于印刷电路板的相对端。

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号：US20100105201A1

    公开(公告)日：2010-04-29

    申请号：US12650093

    申请日：2009-12-30

    申请人： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

    发明人： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

    IPC分类号： H01L21/60

    CPC分类号： H05K3/303 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/2036 ,  Y02P70/613

    摘要： A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

    摘要翻译： 半导体器件包括半导体封装，电路板和间隔保持元件。 半导体封装具有从主体突出的主体和引线。 电路板具有与引线电连接的第一焊盘。 间隔保持构件插入在电路板和主体之间。 间隔保持构件保持引线与第一焊盘之间的间隔。 因此，均匀地保持引线和焊盘之间的间隔，从而提高了半导体器件的热和/或机械可靠性。

    Test socket for testing electrical characteristics of a memory module
    5.
    发明授权
    Test socket for testing electrical characteristics of a memory module 有权
    用于测试内存模块电气特性的测试插座

    公开(公告)号：US08616907B2

    公开(公告)日：2013-12-31

    申请号：US13165927

    申请日：2011-06-22

    申请人： Jung-Hoon Kim ,  Yong-Hyun Kim ,  Seong-Chan Han ,  Kwang-Su Yu ,  Jae-Seon Hwang

    发明人： Jung-Hoon Kim ,  Yong-Hyun Kim ,  Seong-Chan Han ,  Kwang-Su Yu ,  Jae-Seon Hwang

    IPC分类号： H01R13/15

    CPC分类号： H01R12/87 ,  G01R1/0441 ,  H01R2201/20

    摘要： A test socket may include a socket frame, a plate, a socket pin and a link. The socket frame may have a slot configured to accept an object. The plate may be free to move in the slot along an inserting direction of the object to support a lower surface of the object. The socket pin may be movably arranged in a direction substantially perpendicular to the inserting direction of the object. The socket pin may selectively make contact with a tab of the object. A link may be pivotally connected to the socket pin and the plate. Thus, the socket pin of the test socket may avoid dragging along the tab of the object during insertion, and accordingly, the tab of the object may avoid damage.

    摘要翻译： 测试插座可以包括插座框架，板，插座销和连接件。 插座框架可以具有配置成接受对象的插槽。 板可以沿着物体的插入方向在槽中自由移动以支撑物体的下表面。 插座销可以沿着与物体的插入方向基本垂直的方向可移动地布置。 插座销可以选择性地与物体的突片接触。 连杆可以枢转地连接到插座销和板。 因此，测试插座的插座销可以避免在插入期间沿着物体的突出部拖动，因此，物体的突片可以避免损坏。

    Semiconductor device and method of manufacturing the same
    6.
    发明申请
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号：US20080111235A1

    公开(公告)日：2008-05-15

    申请号：US11978370

    申请日：2007-10-29

    申请人： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

    发明人： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

    IPC分类号： H01L23/488 ,  H01L21/60

    CPC分类号： H05K3/303 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/2036 ,  Y02P70/613

    摘要： A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

    摘要翻译： 半导体器件包括半导体封装，电路板和间隔保持元件。 半导体封装具有从主体突出的主体和引线。 电路板具有与引线电连接的第一焊盘。 间隔保持构件插入在电路板和主体之间。 间隔保持构件保持引线与第一焊盘之间的间隔。 因此，均匀地保持引线和焊盘之间的间隔，从而提高了半导体器件的热和/或机械可靠性。

    Semiconductor device and method of manufacturing the same
    10.
    发明授权
    Semiconductor device and method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号：US07906423B2

    公开(公告)日：2011-03-15

    申请号：US12650093

    申请日：2009-12-30

    申请人： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

    发明人： Hyo-Jae Bang ,  Heui-Seog Kim ,  Dong-Chun Lee ,  Seong-Chan Han ,  Jung-Hyeon Kim

    IPC分类号： H01L21/44

    CPC分类号： H05K3/303 ,  H05K2201/0305 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/2036 ,  Y02P70/613

    摘要： A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.

    摘要翻译： 半导体器件包括半导体封装，电路板和间隔保持元件。 半导体封装具有从主体突出的主体和引线。 电路板具有与引线电连接的第一焊盘。 间隔保持构件插入在电路板和主体之间。 间隔保持构件保持引线与第一焊盘之间的间隔。 因此，均匀地保持引线和焊盘之间的间隔，从而提高了半导体器件的热和/或机械可靠性。