公开(公告)号：US10439112B2

公开(公告)日：2019-10-08

申请号：US13554776

申请日：2012-07-20

申请人： Joseph G. Clark ,  Jeffrey Carl Britt ,  Amber C. Abare ,  Raymond Rosado ,  Harsh Sundani ,  David T. Emerson ,  Jeremy Scott Nevins

发明人： Joseph G. Clark ,  Jeffrey Carl Britt ,  Amber C. Abare ,  Raymond Rosado ,  Harsh Sundani ,  David T. Emerson ,  Jeremy Scott Nevins

IPC分类号： H01L33/58 ,  F21V21/00 ,  F21V7/00 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64 ,  F21V29/74 ,  F21Y105/10 ,  F21K9/233 ,  F21Y115/10

摘要： Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A light emitter chip can be disposed over the submount such that the light emitter chip is mounted over at least a portion of the cathode and wirebonded to at least a portion of the anode.

公开(公告)号：USD709464S1

公开(公告)日：2014-07-22

申请号：US29423422

申请日：2012-05-31

申请人： Amber C. Abare ,  Jeffrey Carl Britt ,  Joseph G. Clark ,  Raymond Rosado ,  Harsh Sundani

设计人： Amber C. Abare ,  Jeffrey Carl Britt ,  Joseph G. Clark ,  Raymond Rosado ,  Harsh Sundani

公开(公告)号：USD658139S1

公开(公告)日：2012-04-24

申请号：US29384360

申请日：2011-01-31

申请人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

设计人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

公开(公告)号：US09041042B2

公开(公告)日：2015-05-26

申请号：US13017502

申请日：2011-01-31

申请人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

发明人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

IPC分类号： H01L33/62 ,  H01L25/075 ,  H01L33/58

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  Y10T29/49002 ,  H01L2924/00014

摘要： High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

摘要翻译： 描述了高密度多芯片LED器件。 本发明的实施例提供了具有相对较高效率和小尺寸的光输出的高密度多芯片LED器件。 LED装置包括多个互连的LED芯片和诸如透镜的光学元件。 LED芯片可以分为两组，其中每组中的LED芯片并联连接，并且串联连接。 在一些实施例中，LED装置包括可由陶瓷制成的底座。 底座可以包括连接母线和与芯片接合的半圆形区域。 引线键可以连接到LED芯片，使得所有的引线键都布置在一组LED芯片的外部以最小化光吸收。

公开(公告)号：US20120068198A1

公开(公告)日：2012-03-22

申请号：US13017502

申请日：2011-01-31

申请人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

发明人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

IPC分类号： H01L33/58

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  Y10T29/49002 ,  H01L2924/00014

摘要： High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

摘要翻译： 描述了高密度多芯片LED器件。 本发明的实施例提供了具有相对较高效率和小尺寸的光输出的高密度多芯片LED器件。 LED装置包括多个互连的LED芯片和诸如透镜的光学元件。 LED芯片可以分为两组，其中每组中的LED芯片并联连接，并且串联连接。 在一些实施例中，LED装置包括可由陶瓷制成的底座。 底座可以包括连接母线和与芯片接合的半圆形区域。 引线键可以连接到LED芯片，使得所有的引线键都布置在一组LED芯片的外部以最小化光吸收。

公开(公告)号：US08896013B2

公开(公告)日：2014-11-25

申请号：US13017502

申请日：2011-01-31

申请人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

发明人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

IPC分类号： H01L33/62 ,  H01L25/075 ,  H01L33/58

摘要： High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

公开(公告)号：US08686445B1

公开(公告)日：2014-04-01

申请号：US12969267

申请日：2010-12-15

申请人： Christopher P. Hussell ,  Amber C. Abare ,  Jesse Colin Reiherzer

发明人： Christopher P. Hussell ,  Amber C. Abare ,  Jesse Colin Reiherzer

IPC分类号： H01L33/08

CPC分类号： H01L33/486 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12032 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light emission package includes at least one solid state emitter, a leadframe including at least one electrical lead and a body structure encasing a portion of the leadframe. A thermal transfer material can be isolated from the at least one electrical lead. The body structure can include a plastic body structure wherein a rim portion can be disposed along a portion of the upper surface of the body structure. The light emission package can also include the at least one solid state emitter mounted over thermal transfer material using a direct metal-to-metal bond such as by eutectic die attachment. The light emission package is operable to emit light with an output of approximately 70% or greater of an initial light output for an extrapolated time of at least approximately 150,000 hours or more.

摘要翻译： 发光封装包括至少一个固态发射器，引线框架，其包括至少一个电引线和封装引线框架的一部分的主体结构。 热转印材料可以与至少一个电引线隔离。 身体结构可以包括塑料体结构，其中边缘部分可以沿着身体结构的上表面的一部分设置。 发光封装还可以包括使用直接金属 - 金属键（例如通过共晶管芯附接）安装在热转印材料上的至少一个固态发射器。 发光包可操作以发射具有大约70％或更大的初始光输出的光，用于至少约150,000小时或更长时间的外推时间。