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公开(公告)号：US20170243810A1
公开(公告)日：2017-08-24
申请号：US15590843
申请日：2017-05-09
IPC分类号： H01L23/498 , H01L27/146
CPC分类号： H01L23/4985 , A61B2562/02 , A61B2562/164 , H01L21/30604 , H01L21/6835 , H01L21/768 , H01L23/15 , H01L23/3192 , H01L27/1218 , H01L27/1262 , H01L27/14603 , H01L27/14636 , H01L27/153 , H01L27/156 , H01L27/3293 , H01L29/786 , H01L29/78603 , H01L2221/6835 , H01L2221/68381 , H01L2924/0002 , H01L2924/00
摘要： Some embodiments include a method of providing an electronic device. The method can comprise: providing a first device substrate; providing one or more first active sections over a second side of the first device substrate at a first device portion of the first device substrate; and after providing the first active section(s) over the second side of the first device substrate at the first device portion, folding a first perimeter portion of the first device substrate toward the first device portion at a first side of the first device substrate so that a first edge portion remains to at least partially frame the first device portion. The first edge portion can comprise a first edge portion width dimension smaller than a first smallest cross dimension of one or more pixel(s) of one or more semiconductor device(s) of the first active section(s). Other embodiments of related methods and devices are also disclosed.
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2.发明授权公开(公告)号：US09741742B2
公开(公告)日：2017-08-22
申请号：US14979087
申请日：2015-12-22
IPC分类号： H01L21/44 , H01L27/12 , H01L21/306 , H01L29/786 , H01L23/498 , H01L21/683 , H01L21/768 , H01L27/146 , H01L27/15 , H01L23/31 , H01L23/15
CPC分类号： H01L23/4985 , A61B2562/02 , A61B2562/164 , H01L21/30604 , H01L21/6835 , H01L21/768 , H01L23/15 , H01L23/3192 , H01L27/1218 , H01L27/1262 , H01L27/14603 , H01L27/14636 , H01L27/153 , H01L27/156 , H01L29/786 , H01L29/78603 , H01L2221/6835 , H01L2221/68381 , H01L2924/0002 , H01L2924/00
摘要： Some embodiments include a method of providing an electronic device. The method includes: (i) providing a carrier substrate, (ii) providing a device substrate comprising a first side and a second side opposite the first side, the device substrate having a flexible substrate, (iii) coupling the first side of the device substrate to the carrier substrate; and (iv) after coupling the first side of the device substrate to the carrier substrate, providing two or more active sections over the second side of the device substrate, each active section of the two or more active sections being spatially separate from each other and having at least one semiconductor device. Other embodiments of related methods and devices are also disclosed.
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公开(公告)号：US10170407B2
公开(公告)日：2019-01-01
申请号：US15590843
申请日：2017-05-09
IPC分类号： H01L23/498 , H01L27/12 , H01L21/306 , H01L29/786 , H01L21/683 , H01L27/32 , H01L21/768 , H01L27/146 , H01L27/15 , H01L23/31 , H01L23/15
摘要： Some embodiments include a method of providing an electronic device. The method can comprise: providing a first device substrate; providing one or more first active sections over a second side of the first device substrate at a first device portion of the first device substrate; and after providing the first active section(s) over the second side of the first device substrate at the first device portion, folding a first perimeter portion of the first device substrate toward the first device portion at a first side of the first device substrate so that a first edge portion remains to at least partially frame the first device portion. The first edge portion can comprise a first edge portion width dimension smaller than a first smallest cross dimension of one or more pixel(s) of one or more semiconductor device(s) of the first active section(s). Other embodiments of related methods and devices are also disclosed.
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4.发明申请DEFORMABLE ELECTRONIC DEVICE AND METHODS OF PROVIDING AND USING DEFORMABLE ELECTRONIC DEVICE 有权可变电子设备及其提供和使用可变电子设备的方法公开(公告)号：US20160181288A1
公开(公告)日：2016-06-23
申请号：US14979087
申请日：2015-12-22
IPC分类号： H01L27/12 , H01L21/306 , H01L29/786 , H01L23/498 , A61B5/04 , H01L23/31 , H01L23/522 , H01L23/528 , H01L21/683 , H01L21/768 , H01L23/29
CPC分类号： H01L23/4985 , A61B2562/02 , A61B2562/164 , H01L21/30604 , H01L21/6835 , H01L21/768 , H01L23/15 , H01L23/3192 , H01L27/1218 , H01L27/1262 , H01L27/14603 , H01L27/14636 , H01L27/153 , H01L27/156 , H01L29/786 , H01L29/78603 , H01L2221/6835 , H01L2221/68381 , H01L2924/0002 , H01L2924/00
摘要： Some embodiments include a method of providing an electronic device. The method includes: (i) providing a carrier substrate, (ii) providing a device substrate comprising a first side and a second side opposite the first side, the device substrate having a flexible substrate, (iii) coupling the first side of the device substrate to the carrier substrate; and (iv) after coupling the first side of the device substrate to the carrier substrate, providing two or more active sections over the second side of the device substrate, each active section of the two or more active sections being spatially separate from each other and having at least one semiconductor device. Other embodiments of related methods and devices are also disclosed.
摘要翻译： 一些实施例包括提供电子设备的方法。 该方法包括：（i）提供载体衬底，（ii）提供包括第一侧和与第一侧相对的第二侧的器件衬底，器件衬底具有柔性衬底，（iii）将器件的第一侧 衬底到载体衬底; 和（iv）在将器件衬底的第一侧耦合到载体衬底之后，在器件衬底的第二侧上提供两个或更多个有源部分，两个或更多个有源部分的每个有源部分在空间上彼此分离， 具有至少一个半导体器件。 还公开了相关方法和装置的其它实施例。
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5.发明申请公开(公告)号：US20160181182A1
公开(公告)日：2016-06-23
申请号：US15006935
申请日：2016-01-26
IPC分类号： H01L23/498 , H01L27/15 , H01L27/146 , H01L21/768 , H01L29/786
CPC分类号： H01L23/4985 , A61B2562/02 , A61B2562/164 , H01L21/30604 , H01L21/6835 , H01L21/768 , H01L23/15 , H01L23/3192 , H01L27/1218 , H01L27/124 , H01L27/1262 , H01L27/14603 , H01L27/14636 , H01L27/153 , H01L27/156 , H01L27/3293 , H01L29/786 , H01L29/78603 , H01L2221/6835 , H01L2221/68381 , H01L2924/0002 , H01L2924/00
摘要： Some embodiments include a method of providing an electronic device. The method can comprise: providing a first device substrate; providing one or more first active sections over a second side of the first device substrate at a first device portion of the first device substrate; and after providing the first active section(s) over the second side of the first device substrate at the first device portion, folding a first perimeter portion of the first device substrate toward the first device portion at a first side of the first device substrate so that a first edge portion remains to at least partially frame the first device portion. The first edge portion can comprise a first edge portion width dimension smaller than a first smallest cross dimension of one or more pixel(s) of one or more semiconductor device(s) of the first active section(s). Other embodiments of related methods and devices are also disclosed.
摘要翻译： 一些实施例包括提供电子设备的方法。 该方法可以包括：提供第一器件衬底; 在所述第一器件衬底的第一器件部分处在所述第一器件衬底的第二侧上提供一个或多个第一有源部分; 并且在第一器件部分上在第一器件衬底的第二侧上设置第一有源部分之后，在第一器件衬底的第一侧将第一器件衬底的第一周边部分朝向第一器件部分折叠，从而 第一边缘部分保持以至少部分地框架第一装置部分。 第一边缘部分可以包括小于第一有效部分的一个或多个半导体器件的一个或多个像素的第一最小交叉尺寸的第一边缘部分宽度尺寸。 还公开了相关方法和装置的其它实施例。
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6.发明申请METHOD OF PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SEMICONDUCTOR DEVICE THEREOF 有权提供柔性半导体器件及其柔性半导体器件的方法公开(公告)号：US20170062380A1
公开(公告)日：2017-03-02
申请号：US15349511
申请日：2016-11-11
申请人： Emmett Howard , Nicholas Munizza , Paul Yee , Michael Marrs
发明人： Emmett Howard , Nicholas Munizza , Paul Yee , Michael Marrs
IPC分类号： H01L23/00
CPC分类号： H01L24/83 , H01L21/6835 , H01L24/29 , H01L2221/68318 , H01L2221/6835 , H01L2221/68381 , H01L2224/8309 , H01L2224/83359
摘要： Some embodiments include a method. The method can comprise: providing a carrier substrate; providing an adhesion modification layer over the carrier substrate; providing a device substrate; and coupling the device substrate and the carrier substrate together, the adhesion modification layer being located between the device substrate and the carrier substrate when the device substrate and the carrier substrate are coupled together. In these embodiments, the adhesion modification layer can be configured so that the device substrate couples indirectly with the carrier substrate by way of the adhesion modification layer with a first bonding force that is greater than a second bonding force by which the device substrate couples with the carrier substrate absent the adhesion modification layer. Other embodiments of related methods and devices are also disclosed.
摘要翻译： 一些实施例包括一种方法。 该方法可以包括：提供载体衬底; 在所述载体基底上提供粘附修饰层; 提供器件衬底; 以及将所述器件衬底和所述载体衬底耦合在一起时，当所述器件衬底和所述载体衬底耦合在一起时，所述粘附修饰层位于所述器件衬底和所述载体衬底之间。 在这些实施例中，粘合改性层可以被配置成使得器件衬底通过粘合改性层间接地与载体衬底相互耦合，第一接合力大于第二结合力，器件衬底与 载体基材不存在粘附改性层。 还公开了相关方法和装置的其它实施例。
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7.发明申请Method for preventing electron emission from defects in a field emission device 失效防止场发射装置中的电子发射缺陷的方法公开(公告)号：US20070123134A1
公开(公告)日：2007-05-31
申请号：US11292408
申请日：2005-11-30
申请人： Emmett Howard , Kenneth Dean , Dirk Jordan
发明人： Emmett Howard , Kenneth Dean , Dirk Jordan
CPC分类号： H01J9/025 , H01J3/021 , H01J9/148 , H01J29/481
摘要： A method is provided for preventing electron emission from a sidewall (34) of a gate electrode (20) and the edge (28) of the gate electrode stack of a field emission device (10), the gate electrode (20) having a surface (24) distally disposed from an anode (40) and a side (26) proximate to emission electrodes (38). The method comprises growing dielectric material (22) over the surface (24) and side (26) of the gate electrode (20), and performing an anisotropic etch (32) normal to the surface (24) to remove the dielectric material (22) from the surface (24) and leaving at least a portion of the dielectric material (22) on the side (26) of the gate electrode (20) and edge (28) of the gate electrode stack.
摘要翻译： 提供了一种防止来自栅极电极（20）的侧壁（34）和场致发射器件（10）的栅电极堆叠的边缘（28）的电子发射的方法，栅电极（20）具有表面 （40）和靠近发射电极（38）的侧面（26）远离地设置的（24）。 该方法包括在栅电极（20）的表面（24）和侧面（26）上方生长电介质材料（22），并且执行垂直于表面（24）的各向异性蚀刻（32）以移除电介质材料 ），并且在栅电极（20）的侧面（26）和栅极电极叠层的边缘（28）上留下介电材料（22）的至少一部分。
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公开(公告)号：US5804909A
公开(公告)日：1998-09-08
申请号：US832841
申请日：1997-04-04
申请人： Thomas Nilsson , John Song , Emmett Howard
发明人： Thomas Nilsson , John Song , Emmett Howard
CPC分类号： H01J3/022 , H01J2201/30423 , H01J2201/319
摘要： An edge emission FED (100) includes a supporting substrate (110); a cathode (120) disposed on the supporting substrate (110); a ballast layer (130) disposed on the cathode (120); an emissive layer (140) disposed on the ballast layer (130) and defining an emissive edge (183); a field shaper layer (150) disposed on the emissive layer (140); a dielectric layer (160) disposed on the field shaper layer (150); a gate extraction electrode (170) disposed on the dielectric layer (160); an emission well (180) defined by the ballast layer (130), the emissive edge (183), the field shaper layer (150), the dielectric layer (160), and the gate extraction electrode (170); and an anode plate (188) opposing the gate extraction electrode (170).
摘要翻译： 边缘发射FED（100）包括支撑衬底（110）; 设置在所述支撑基板（110）上的阴极（120）; 设置在阴极（120）上的镇流器层（130）; 设置在所述镇流器层（130）上并限定发射边缘（183）的发射层（140）; 设置在所述发射层（140）上的场整形器层（150）; 设置在所述场整形器层（150）上的电介质层（160）; 设置在介电层（160）上的栅极引出电极（170）; 由镇流器层（130），发射边缘（183），场整形器层（150），电介质层（160）和栅极引出电极（170）限定的发射阱（180）。 以及与栅极引出电极（170）相对的阳极板（188）。
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9.发明授权公开(公告)号：US09953951B2
公开(公告)日：2018-04-24
申请号：US15349511
申请日：2016-11-11
申请人： Emmett Howard , Nicholas Munizza , Paul Yee , Michael Marrs
发明人： Emmett Howard , Nicholas Munizza , Paul Yee , Michael Marrs
IPC分类号： H01L23/00 , H01L21/02 , H01L33/12 , H01L21/683
CPC分类号： H01L24/83 , H01L21/6835 , H01L24/29 , H01L2221/68318 , H01L2221/6835 , H01L2221/68381 , H01L2224/8309 , H01L2224/83359
摘要： Some embodiments include a method. The method can comprise: providing a carrier substrate; providing an adhesion modification layer over the carrier substrate; providing a device substrate; and coupling the device substrate and the carrier substrate together, the adhesion modification layer being located between the device substrate and the carrier substrate when the device substrate and the carrier substrate are coupled together. In these embodiments, the adhesion modification layer can be configured so that the device substrate couples indirectly with the carrier substrate by way of the adhesion modification layer with a first bonding force that is greater than a second bonding force by which the device substrate couples with the carrier substrate absent the adhesion modification layer. Other embodiments of related methods and devices are also disclosed.
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10.发明申请METHOD OF PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SEMICONDUCTOR DEVICE THEREOF 有权提供柔性半导体器件及其柔性半导体器件的方法公开(公告)号：US20160329268A1
公开(公告)日：2016-11-10
申请号：US15217405
申请日：2016-07-22
申请人： Emmett Howard , Nicholas Munizza , Paul Yee
发明人： Emmett Howard , Nicholas Munizza , Paul Yee
IPC分类号： H01L23/498 , H01L21/683 , H01L21/48
CPC分类号： H01L23/4985 , H01L21/2007 , H01L21/4853 , H01L21/52 , H01L21/6835 , H01L51/0097 , H01L2221/68318 , H01L2221/6835 , H01L2221/68381 , H01L2221/68386
摘要： Some embodiments include a method. The method can include providing a carrier substrate, providing a release layer over the carrier substrate, and providing a device substrate over the carrier substrate and the release layer. Providing the device substrate can include bonding the device substrate to the carrier substrate, and bonding the device substrate to the release layer. Further, providing the release layer can include bonding the release layer to the carrier substrate. Meanwhile, the release layer can include polymethylmethacrylate, and the device substrate can be bonded to the carrier substrate with a first adhesion strength, the device substrate can be bonded to the release layer with a second adhesion strength less than the first adhesion strength, and the release layer can be bonded to the carrier substrate with a third adhesion strength greater than the second adhesion strength. Other embodiments of related methods and devices are also disclosed.
摘要翻译： 一些实施例包括一种方法。 该方法可以包括提供载体衬底，在载体衬底上提供释放层，以及在载体衬底和释放层上提供器件衬底。 提供器件衬底可以包括将器件衬底接合到载体衬底，以及将器件衬底接合到释放层。 此外，提供释放层可以包括将释放层粘合到载体基底。 同时，脱模层可以包括聚甲基丙烯酸甲酯，并且装置基板可以以第一粘附强度结合到载体基板上，装置基板可以以小于第一粘合强度的第二粘合强度结合到剥离层，并且 剥离层可以以大于第二粘合强度的第三粘合强度结合到载体基材。 还公开了相关方法和装置的其它实施例。
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