摘要:
In an embodiment, the invention provides a coil transducer isolator package comprising at least one lead frame, at least two integrated circuits (ICs) and a flex circuit comprising at least a first coil transducer. The first coil transducer comprises at least one metal coil. The coil transducer isolator package is fabricated such that no portion of the lead frame is physically located within a spatial volume extending substantially perpendicular to the at least one metal coil. The boundaries of the spatial volume are defined by a periphery of the at least one metal coil. At least one of the two ICs is at least partially located within the spatial volume extending substantially perpendicular to the at least one metal coil.
摘要:
In an embodiment, the invention provides a coil transducer isolator package comprising at least one lead frame, at least two integrated circuits (ICs) and a flex circuit comprising at least a first coil transducer. The first coil transducer comprises at least one metal coil. The coil transducer isolator package is fabricated such that no portion of the lead frame is physically located within a spatial volume extending substantially perpendicular to the at least one metal coil. The boundaries of the spatial volume are defined by a periphery of the at least one metal coil. At least one of the two ICs is at least partially located within the spatial volume extending substantially perpendicular to the at least one metal coil.
摘要:
Galvanic isolators are disclosed herein. An embodiment of a galvanic isolator comprises a generally planar electrically insulating substrate comprising opposing first and second surfaces, the substrate comprising an electrically insulating, low dielectric loss material and having a transmitter coil disposed on the first surface and a receiving coil disposed on the second surface. A transmitter circuit is operably connected to the transmitter coil. The transmitter circuit comprises a first detector that detects a rising edge of an input signal; a first pulse generator that generates a plurality of first pulses upon detection of the rising edge; a second detector that detects a falling edge of the input signal; and a second pulse generator that generates a plurality of second pulses upon detection of the falling edge. A receiver circuit is operably connected to the second receiving coil. The receiver circuit generates a signal that is substantially similar to the input signal based on the first pulses and the second pulses.
摘要:
Galvanic isolators are disclosed herein. An embodiment of a galvanic isolator comprises a generally planar electrically insulating substrate comprising opposing first and second surfaces, the substrate comprising an electrically insulating, low dielectric loss material and having a transmitter coil disposed on the first surface and a receiving coil disposed on the second surface. A transmitter circuit is operably connected to the transmitter coil. The transmitter circuit comprises a first detector that detects a rising edge of an input signal; a first pulse generator that generates a plurality of first pulses upon detection of the rising edge; a second detector that detects a falling edge of the input signal; and a second pulse generator that generates a plurality of second pulses upon detection of the falling edge. A receiver circuit is operably connected to the second receiving coil. The receiver circuit generates a signal that is substantially similar to the input signal based on the first pulses and the second pulses.
摘要:
Various embodiments of means and methods for reducing the pick-up of electromagnetic interference (“EMI”) by coil transducers are described and shown that are configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. In some embodiments, the lengths, heights, and horizontal distances between wires electrically connecting transmitter circuits and receiver circuits to coil transducers are minimized and optimized respecting one another.
摘要:
Disclosed herein are various embodiments of coil transducers and galvanic isolators configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material. Circuits are disclosed herein that permit high speed data signals to be transmitted through the coil transducer and faithfully and accurately reconstructed on the opposing side thereof. The coil transducer may be formed in a small package using, by way of example, printed circuit board, CMOS and other fabrication and packaging processes.
摘要:
A galvanic isolator having a split circuit element, a polymeric substrate, a transmitter and receiver is disclosed. The split circuit element has first and second portions, the first portion being disposed on a first surface of the substrate and the second portion being disposed a second surface of the substrate. The transmitter receives an input signal and couples a signal derived from the input signal to the first portion. The receiver is connected to the second portion of the circuit element and generates an output signal that is coupled to an external circuit. The galvanic isolator can be economically fabricated on conventional printed circuit board substrates and flexible circuit substrates.
摘要:
Embodiments of the present invention include a system for detecting entry of an object from a first area into a second area. The system includes a light source for generating a light beam, the light beam defining a boundary between the first area and the second area. The system further includes a retroreflector positioned across from the light source, the retroreflector for reflecting the light beam back towards the light source and a photodetector positioned adjacent to the light source, the photodetector for detecting the reflected light beam wherein the photodetector generates a signal in response to detecting an interruption in the light beam signaling entry of an object from the first area to the second area.
摘要:
A switching element defines a transmitting state and a reflecting state for a pair of intersecting waveguides that have a gap at their intersection. In the preferred embodiment, the switching element exhibits total internal reflection at the gap sidewall from one waveguide to the other when not in the transmitting state. In the transmitting state, index-matching liquid fills the gap, enabling light to continue in the original waveguide direction. The switching element may use ink jet techniques or bubble techniques to displace index-matching liquid. The index-matching fluid may be projected from a gap between the waveguides by a jet mechanism, or a vapor or dissolved gas bubble may be formed to fill the gap between the waveguides to provide the reflecting state for the switching element. Using either of the techniques, heaters are employed to initiate the switching operation. In some embodiments, more than one heater is utilized. In the preferred embodiment, waveguides are formed on one substrate and heaters are formed on another. Then the substrates are aligned and bonded together to position the heaters in very close proximity to the intersection between the waveguides. Preferably, the switching element is one element in a matrix of such elements for routing signals between arrays of input and output waveguides.
摘要:
Disclosed herein are various embodiments of coil transducers and galvanic isolators configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material. Circuits are disclosed herein that permit high speed data signals to be transmitted through the coil transducer and faithfully and accurately reconstructed on the opposing side thereof. The coil transducer may be formed in a small package using, by way of example, printed circuit board, CMOS and other fabrication and packaging processes.