公开(公告)号：US09722213B2

公开(公告)日：2017-08-01

申请号：US14385970

申请日：2012-03-27

申请人： Jun Sugahara ,  Hidetaka Ohazama ,  Shinsuke Tanaka ,  Hiromu Nara ,  Hiroki Tan

发明人： Jun Sugahara ,  Hidetaka Ohazama ,  Shinsuke Tanaka ,  Hiromu Nara ,  Hiroki Tan

IPC分类号： H01L51/56 ,  H01L51/52 ,  B05D1/26 ,  C23C16/455 ,  H01L27/32 ,  H01L23/31

CPC分类号： H01L51/56 ,  B05D1/26 ,  C23C16/45525 ,  H01L23/3171 ,  H01L27/3246 ,  H01L27/3283 ,  H01L51/5253 ,  H01L2924/0002 ,  H01L2924/00

摘要： When a coating film 4 is formed on a substrate 1, on which elements 3 are formed, by an ALD film forming method or the like, the coating film 4 is partially removed in a simple step. A method for manufacturing an electronic device includes a step of coating the substrate 1 partially with a partially coating member 2, a step of forming the elements 3 on the substrate 1, a step of forming the coating film 4 on the substrate 1 to cover the elements 3 and the partially coating member 2, and a step of forming a crack 4A in the coating film 4 on the partially coating member 2.

公开(公告)号：US08853935B2

公开(公告)日：2014-10-07

申请号：US13552024

申请日：2012-07-18

申请人： Hidetaka Ohazama

发明人： Hidetaka Ohazama

IPC分类号： H01J1/62 ,  H01J63/04 ,  H01L27/32 ,  H01L51/52 ,  H01L51/56

CPC分类号： H01L27/3276 ,  H01L27/3288 ,  H01L51/524 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/529 ,  H01L51/56

摘要： An organic EL module includes an element substrate on which at least one organic EL element is formed, a first terminal provided on the element substrate and is drawn out from the electrode of the at least one organic EL element, a second terminal facing the first terminal and provided on a circuit substrate, and a pole that electrically connects the first terminal with the second terminal through a through-hole of the circuit substrate.

摘要翻译： 有机EL模块包括其上形成有至少一个有机EL元件的元件基板，设置在元件基板上并从该至少一个有机EL元件的电极引出的第一端子，面向第一端子的第二端子 并且设置在电路基板上，以及通过电路基板的通孔将第一端子与第二端子电连接的极。

公开(公告)号：US20130020935A1

公开(公告)日：2013-01-24

申请号：US13552024

申请日：2012-07-18

申请人： Hidetaka Ohazama

发明人： Hidetaka Ohazama

IPC分类号： H05B33/02

CPC分类号： H01L27/3276 ,  H01L27/3288 ,  H01L51/524 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/529 ,  H01L51/56

摘要： An organic EL module 1 includes an element substrate 10 on which a one or a plurality of organic EL elements 1U are formed, a first terminal 11 which is provided on the element substrate 10 and is drawn out from the electrode of the organic EL element 1U, a sealing layer 12 which covers the organic EL element 1U, a circuit substrate 13 which is arranged over the sealing layer 12 at some interval, a second terminal 14 which is provided beneath the circuit substrate 13 and a pole 15 which electrically connects the first terminal 11 with the second terminal 14 while supporting the circuit substrate 13 over the element substrate 10.

摘要翻译： 有机EL模块1包括其上形成有一个或多个有机EL元件1U的元件基板10，设置在元件基板10上并从有机EL元件1U的电极引出的第一端子11 ，覆盖有机EL元件1U的密封层12，以一定间隔布置在密封层12上方的电路基板13，设置在电路基板13下方的第二端子14和电连接第一 端子11与第二端子14同时在元件基板10上支撑电路基板13。

公开(公告)号：US07193157B2

公开(公告)日：2007-03-20

申请号：US10902265

申请日：2004-07-30

申请人： Atsusi Matsuda ,  Hidetaka Ohazama

发明人： Atsusi Matsuda ,  Hidetaka Ohazama

IPC分类号： H05K1/00

CPC分类号： H05K1/0265 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/14 ,  H01L24/17 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/12044 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/094 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10674 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/00

摘要： A flexible circuit board is provided to prevent unsuccessful interconnection between the wirings of the flexible circuit board and the output terminals of a semiconductor chip, the flexible circuit board having a plurality of sections of wirings of different sizes, each section including a pattern of wirings of the same size. The flexible circuit board has predetermined patterns of wirings on an insulating material base, and the wirings are electrically connected to the output terminals of a semiconductor chip. A pattern of the wirings of the same size forms a first wiring section, while another pattern of the wirings of the same size form a second wiring section. The flexible circuit board is provided with a pattern transition region between the neighboring wiring sections with wirings of different sizes to avoid unsuccessful interconnection which would be otherwise caused by the difference in size between the wirings.

摘要翻译： 提供柔性电路板以防止柔性电路板的布线与半导体芯片的输出端子之间的不连接互连，柔性电路板具有多个不同尺寸的布线部分，每个部分包括一条线的图案 相同的大小。 柔性电路板在绝缘材料基体上具有预定的布线图案，并且布线电连接到半导体芯片的输出端子。 相同尺寸的布线的图案形成第一布线部分，而相同尺寸的布线的另一图案形成第二布线部分。 柔性电路板在相邻布线部分之间具有不同尺寸的布线的图案过渡区域，以避免由于布线之间的尺寸差引起的互连不成功。

公开(公告)号：US20150076463A1

公开(公告)日：2015-03-19

申请号：US14380922

申请日：2012-03-01

申请人： Hidetaka Ohazama

发明人： Hidetaka Ohazama

IPC分类号： H01L51/52 ,  H01L51/56

CPC分类号： H01L51/5253 ,  H01L27/3276 ,  H01L27/3288 ,  H01L51/5209 ,  H01L51/5246 ,  H01L51/56

摘要： In an organic EL device, a risk of a short circuit between adjacent terminals in a connection space on a substrate can be reduced. An organic EL device includes a substrate, one or a plurality of organic EL elements formed on the substrate, a plurality of connection terminals provided on the substrate and electrically connected to electrodes of the organic EL elements, an insulating cover layer that covers the connection terminals and the substrate between the connection terminals, and a mounted component mounted via an anisotropic conducive layer and including terminals to be connected electrically connected to the connection terminals. The anisotropic conductive layer includes conductive particulates that electrically connect the connection terminals and the terminals to be connected. The conductive particulates electrically connect the connection terminals and the terminals to be connected piercing through the cover layer.

摘要翻译： 在有机EL器件中，可以减少衬底上的连接空间中的相邻端子之间短路的风险。 有机EL器件包括基板，形成在基板上的一个或多个有机EL元件，设置在基板上并电连接到有机EL元件的电极的多个连接端子，覆盖连接端子的绝缘覆盖层 以及连接端子之间的基板和经由各向异性导电层安装的安装部件，并且包括要连接的端子电连接到连接端子。 各向异性导电层包括电连接连接端子和要连接的端子的导电性微粒。 导电性微粒将连接端子和要连接的端子电连接穿过覆盖层。

公开(公告)号：US07327042B2

公开(公告)日：2008-02-05

申请号：US10726689

申请日：2003-12-04

申请人： Hidetaka Ohazama

发明人： Hidetaka Ohazama

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/361 ,  H01L27/3297 ,  H01L2924/0002 ,  H05K3/323 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09172 ,  H01L2924/00

摘要： Accumulating spaces for conductive particles are formed in gaps of wiring patterns for conductive wirings which are disposed on a surface of a supporting body. When interconnecting a pair of interconnection objects having the respective wiring patterns via an anisotropic conductive film thereon due to a thermocompression bonding, the conductive particles to be flown-out into the gaps by the thermocompression bonding are allowed to escape into the accumulating spaces, so that an over-density of the conductive particles can be prevented to avoid a shortage in the wiring patterns.

摘要翻译： 导电颗粒的积聚空间形成在布置在支撑体的表面上的导电布线的布线图形的间隙中。 当通过热压接合将各对布线图案之间的各向异性导电膜互连在一对互连对象上时，允许通过热压接而流出到间隙中的导电颗粒逃逸到积聚空间中，使得 可以防止导电颗粒的过度密度，以避免布线图案的短缺。

公开(公告)号：US07236624B2

公开(公告)日：2007-06-26

申请号：US10230264

申请日：2002-08-29

申请人： Hidetaka Ohazama

发明人： Hidetaka Ohazama

IPC分类号： G06K9/00 ,  G02F1/1345

CPC分类号： H05K3/361 ,  G01R31/043 ,  H05K1/0269 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/166

摘要： In the neighborhood of each connecting region of a panel substrate, tape automated bonding (TAB) substrates, and a flexible substrate, marks for a visual inspection are provided at a preset distance apart from the connecting region. According to the present marks, inferior products are eliminated with a high rate of accuracy upon visual inspection after completing a connection of display panel.

摘要翻译： 在面板基板的每个连接区域附近，带状自动接合（TAB）基板和柔性基板之间，距离连接区域以预设的距离提供用于目视检查的标记。 根据现在的标记，在完成显示面板的连接之后，在目视检查中，以较高的准确率来消除劣质产品。

公开(公告)号：US06937004B2

公开(公告)日：2005-08-30

申请号：US10263832

申请日：2002-10-04

申请人： Hidetaka Ohazama

发明人： Hidetaka Ohazama

IPC分类号： G02F1/13 ,  G01R31/04 ,  G02F1/1345 ,  G09F9/00 ,  G09G3/00 ,  H01L21/60 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H05K5/00

CPC分类号： G09G3/006 ,  G01R31/04 ,  H05K1/0268 ,  H05K3/361 ,  H05K2201/09781 ,  H05K2203/162

摘要： A test mark is provided, for use in an inspection after a display panel, TAB tapes, and a flexible board have been connected together. Defective panels can be rejected with high accuracy in the simple inspection, thereby mitigating the burden on the microscopic inspection. At a predetermined distance from each of connection areas for connecting a panel substrate, TAB tapes, and a flexible board, there are provided test marks with at least one on each component. The electrical connection is tested between each pair of the test marks to thereby determine whether the interconnection is in a good state.

摘要翻译： 提供了一个测试标记，用于显示面板，TAB磁带和柔性电路板连接在一起后进行检查。 在简单的检查中，不良面板可以高精度地被拒绝，从而减轻了微观检查的负担。 在与用于连接面板基板，TAB带和柔性板的每个连接区域预定距离处，提供了在每个部件上具有至少一个的测试标记。 在每对测试标记之间测试电连接，从而确定互连是否处于良好状态。

公开(公告)号：US20050039945A1

公开(公告)日：2005-02-24

申请号：US10902265

申请日：2004-07-30

申请人： Atsusi Matsuda ,  Hidetaka Ohazama

发明人： Atsusi Matsuda ,  Hidetaka Ohazama

IPC分类号： H01L21/60 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K1/00

CPC分类号： H05K1/0265 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/14 ,  H01L24/17 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/12044 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/094 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10674 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/00

摘要： A flexible circuit board is provided to prevent unsuccessful interconnection between the wirings of the flexible circuit board and the output terminals of a semiconductor chip, the flexible circuit board having a plurality of sections of wirings of different sizes, each section including a pattern of wirings of the same size. The flexible circuit board has predetermined patterns of wirings on an insulating material base, and the wirings are electrically connected to the output terminals of a semiconductor chip. A pattern of the wirings of the same size forms a first wiring section, while another pattern of the wirings of the same size form a second wiring section. The flexible circuit board is provided with a pattern transition region between the neighboring wiring sections with wirings of different sizes to avoid unsuccessful interconnection which would be otherwise caused by the difference in size between the wirings.

摘要翻译： 提供柔性电路板以防止柔性电路板的布线与半导体芯片的输出端子之间的不连接互连，柔性电路板具有多个不同尺寸的布线部分，每个部分包括一条线的图案 相同的大小。 柔性电路板在绝缘材料基体上具有预定的布线图案，并且布线电连接到半导体芯片的输出端子。 相同尺寸的布线的图案形成第一布线部分，而相同尺寸的布线的另一图案形成第二布线部分。 柔性电路板在相邻布线部分之间具有不同尺寸的布线的图案过渡区域，以避免由于布线之间的尺寸差引起的互连不成功。