摘要:
An electronic part mounting method including introducing electronic parts in a bulk form into a bulk feeder, transferring the introduced electronic parts to at least one inspection unit by use of a rotatably installed positioning wheel, inspecting and aligning the electronic parts, transferring the inspected and aligned electronic parts to a part insertion unit by use of the positioning wheel, inserting the electronic parts, determined as good ones by the inspection unit, into the part insertion unit, and picking up the electronic parts received in the part insertion unit to mount the electronic parts on a board.
摘要:
An electronic part mounting method including introducing electronic parts in a bulk form into a bulk feeder, transferring the introduced electronic parts to at least one inspection unit by use of a rotatably installed positioning wheel, inspecting and aligning the electronic parts, transferring the inspected and aligned electronic parts to a part insertion unit by use of the positioning wheel, inserting the electronic parts, determined as good ones by the inspection unit, into the part insertion unit, and picking up the electronic parts received in the part insertion unit to mount the electronic parts on a board.
摘要:
An apparatus for mounting electronic parts includes a bulk feeder into which electronic parts in a bulk form are introduced, at least one inspection unit to inspect and align the electronic parts directed from the bulk feeder, an electronic part insertion unit to receive the electronic parts which have been completely inspected in the inspection unit, a positioning wheel installed to rotate along the bulk feeder, the inspection unit, and the electronic part inspection unit and serving to transfer the electronic parts, and a part supply unit to pick up the electronic parts received in the part insertion unit.
摘要:
A delamination apparatus includes a stage, a first roll unit, a gripper, and a second roll unit. The stage includes a peripheral area and a substrate area. An edge of a donor film is attached at the peripheral area. An acceptor substrate, laminated at on the donor film, is disposed at the substrate area. The first roll unit is disposed on the donor film, moves in a lengthwise direction of the acceptor substrate. The gripper is disposed on the donor film, and is configured to separate the edge of the donor film from the stage so as to cause the donor film to contact the first roll unit. The second roll unit is disposed on the stage, contacts the donor film which contacts the first roll unit, and delaminates the donor film from the acceptor substrate by moving in the lengthwise direction with the first roll unit.
摘要:
A delamination apparatus includes a stage, a first roll unit, a gripper, and a second roll unit. The stage includes a peripheral area and a substrate area. An edge of a donor film is attached at the peripheral area. An acceptor substrate, laminated at on the donor film, is disposed at the substrate area. The first roll unit is disposed on the donor film, moves in a lengthwise direction of the acceptor substrate. The gripper is disposed on the donor film, and is configured to separate the edge of the donor film from the stage so as to cause the donor film to contact the first roll unit. The second roll unit is disposed on the stage, contacts the donor film which contacts the first roll unit, and delaminates the donor film from the acceptor substrate by moving in the lengthwise direction with the first roll unit.
摘要:
Disclosed is a method for forming a contact portion of a semiconductor element. An exemplary method includes the steps of depositing an insulation layer on a lower thin film on which there is formed a semiconductor element electrode or a metal wiring pattern, and then realizing an even upper surface of the insulation layer; forming a photosensitive film pattern thereon having a contact or via hole pattern in which inner walls of the contact holes or via holes smoothly curve downward to reach an upper surface of the insulation layer; dry-etching the insulation layer using a mask following the photosensitive film pattern to form contact holes or via holes; removing the photosensitive film pattern, then depositing a barrier metal and tungsten to fill the contact holes or the via holes; and performing a chemical mechanical polishing process to remove the barrier metal and the tungsten from the upper surface of the semiconductor element until the insulation layer is exposed and a flat surface is realized.
摘要:
A filter element in a canister air filter automatically eliminates impurities according to its contaminated degree, thereby retaining the ventilation resistance of the canister air filter below a predetermined level and preventing damage to a fuel tank and other components adjacent thereto. The canister air filter includes a housing, filter element, and amplitude limiting means.
摘要:
A delamination apparatus that includes a stage to which a lower support, an acceptor substrate disposed on the lower support, and a donor film laminated with the lower support along the edge of the acceptor substrate, interposing the acceptor substrate therebetween are mounted. The delamination apparatus further includes a first gripper disposed in an end side of the stage to move an end of the donor film to a direction far away from the acceptor substrate by gripping the end of the donor film; and a first peeling roll disposed on the donor film to support the donor film disposed between the acceptor substrate and the first gripper, and rotating itself to a direction of the first gripper.
摘要:
Provided is a hydraulic test device for head loss of a strainer and a test method thereof, wherein the hydraulic test device comprises a circulation pipe; an inflow container; a container; a debris interceptor; sensors; a circulation pump; a flow meter; a circulation heating heater; and a data acquisition part which stores data sensed by each sensor, flow rate data.
摘要:
An apparatus for fabricating an organic light emitting display panel is disclosed. In one embodiment, the apparatus includes i) a first roll around which a film is wound to be continuously drawn, ii) a second roll arranged to face the first roll and around which the film is continuously wound, iii) a plurality of chambers disposed between the first and second rolls and through which the film passes, and in which laser induced thermal imaging (LITI) is performed on a substrate by forming a transfer layer on the film, and iv) a gate unit installed at least one of the chambers and disposed at at least one of a film inlet and a film output of the chambers that are installed, to maintain a substantially vacuum state in the chambers during passing of the film.