Method of manufacturing vertical light emitting device
    6.
    发明申请
    Method of manufacturing vertical light emitting device 有权
    制造垂直发光装置的方法

    公开(公告)号:US20080113462A1

    公开(公告)日:2008-05-15

    申请号:US11882259

    申请日:2007-07-31

    IPC分类号: H01L21/02

    CPC分类号: H01L33/0079 H01L33/44

    摘要: Provided is a method of manufacturing a vertical light emitting device. The method of manufacturing the vertical light emitting device may include forming an emissive layer including a n-type semiconductor layer, an active layer, and a p-type semiconductor layer on a substrate, forming a first trench dividing the emissive layer into light emitting device units in which the emissive layer remains on the lower part of the first trench to a desired, or alternatively, a predetermined thickness, forming a passivation layer on the emissive layer, forming a p-type electrode on the p-type semiconductor layer of the emissive layer, forming a metal supporting layer on the passivation layer and the p-type electrode, removing the substrate, removing a remaining portion of the emissive layer when the surface of the emissive layer is exposed by removing the substrate, forming a n-type electrode on the n-type semiconductor layer of the emissive layer, and cutting the metal supporting layer to divide the emissive layer into the light emitting device units.

    摘要翻译: 提供一种垂直发光装置的制造方法。 制造垂直发光器件的方法可以包括在衬底上形成包括n型半导体层,有源层和p型半导体层的发射层,形成将发光层划分成发光器件的第一沟槽 其中发射层保留在第一沟槽的下部上的单元到期望的或可选的预定厚度,在发射层上形成钝化层,在p型半导体层上形成p型电极 发射层,在钝化层和p型电极上形成金属支撑层,去除衬底,当发射层的表面通过去除衬底而暴露时去除发射层的剩余部分,形成n型 电极,并且切割金属支撑层以将发光层划分为发光器件单元。

    Method of manufacturing vertical light emitting device
    7.
    发明授权
    Method of manufacturing vertical light emitting device 有权
    制造垂直发光装置的方法

    公开(公告)号:US07781246B2

    公开(公告)日:2010-08-24

    申请号:US11882259

    申请日:2007-07-31

    IPC分类号: H01L21/00

    CPC分类号: H01L33/0079 H01L33/44

    摘要: Provided is a method of manufacturing a vertical light emitting device. The method of manufacturing the vertical light emitting device may include forming an emissive layer including a n-type semiconductor layer, an active layer, and a p-type semiconductor layer on a substrate, forming a first trench dividing the emissive layer into light emitting device units in which the emissive layer remains on the lower part of the first trench to a desired, or alternatively, a predetermined thickness, forming a passivation layer on the emissive layer, forming a p-type electrode on the p-type semiconductor layer of the emissive layer, forming a metal supporting layer on the passivation layer and the p-type electrode, removing the substrate, removing a remaining portion of the emissive layer when the surface of the emissive layer is exposed by removing the substrate, forming a n-type electrode on the n-type semiconductor layer of the emissive layer, and cutting the metal supporting layer to divide the emissive layer into the light emitting device units.

    摘要翻译: 提供一种垂直发光装置的制造方法。 制造垂直发光器件的方法可以包括在衬底上形成包括n型半导体层,有源层和p型半导体层的发射层,形成将发光层划分成发光器件的第一沟槽 其中发射层保留在第一沟槽的下部上的单元到期望的或可选的预定厚度,在发射层上形成钝化层,在p型半导体层上形成p型电极 发射层,在钝化层和p型电极上形成金属支撑层,去除衬底,当发射层的表面通过去除衬底而暴露时去除发射层的剩余部分,形成n型 电极,并且切割金属支撑层以将发光层划分为发光器件单元。

    Method of manufacturing vertical light emitting device
    8.
    发明授权
    Method of manufacturing vertical light emitting device 有权
    制造垂直发光装置的方法

    公开(公告)号:US07888153B2

    公开(公告)日:2011-02-15

    申请号:US12805132

    申请日:2010-07-14

    IPC分类号: H01L21/00

    CPC分类号: H01L33/0079 H01L33/44

    摘要: Provided is a method of manufacturing a vertical light emitting device. The method of manufacturing the vertical light emitting device may include forming an emissive layer including a n-type semiconductor layer, an active layer, and a p-type semiconductor layer on a substrate, forming a first trench dividing the emissive layer into light emitting device units in which the emissive layer remains on the lower part of the first trench to a desired, or alternatively, a predetermined thickness, forming a passivation layer on the emissive layer, forming a p-type electrode on the p-type semiconductor layer of the emissive layer, forming a metal supporting layer on the passivation layer and the p-type electrode, removing the substrate, removing a remaining portion of the emissive layer when the surface of the emissive layer is exposed by removing the substrate, forming a n-type electrode on the n-type semiconductor layer of the emissive layer, and cutting the metal supporting layer to divide the emissive layer into the light emitting device units.

    摘要翻译: 提供一种垂直发光装置的制造方法。 制造垂直发光器件的方法可以包括在衬底上形成包括n型半导体层,有源层和p型半导体层的发射层,形成将发光层划分成发光器件的第一沟槽 其中发射层保留在第一沟槽的下部上的单元到期望的或可选的预定厚度,在发射层上形成钝化层,在p型半导体层上形成p型电极 发射层,在钝化层和p型电极上形成金属支撑层,去除衬底,当发射层的表面通过去除衬底而暴露时去除发射层的剩余部分,形成n型 电极,并且切割金属支撑层以将发光层划分为发光器件单元。

    Method of manufacturing vertical light emitting device

    公开(公告)号:US20100279448A1

    公开(公告)日:2010-11-04

    申请号:US12805132

    申请日:2010-07-14

    IPC分类号: H01L21/78

    CPC分类号: H01L33/0079 H01L33/44

    摘要: Provided is a method of manufacturing a vertical light emitting device. The method of manufacturing the vertical light emitting device may include forming an emissive layer including a n-type semiconductor layer, an active layer, and a p-type semiconductor layer on a substrate, forming a first trench dividing the emissive layer into light emitting device units in which the emissive layer remains on the lower part of the first trench to a desired, or alternatively, a predetermined thickness, forming a passivation layer on the emissive layer, forming a p-type electrode on the p-type semiconductor layer of the emissive layer, forming a metal supporting layer on the passivation layer and the p-type electrode, removing the substrate, removing a remaining portion of the emissive layer when the surface of the emissive layer is exposed by removing the substrate, forming a n-type electrode on the n-type semiconductor layer of the emissive layer, and cutting the metal supporting layer to divide the emissive layer into the light emitting device units.

    Method for fabricating a laser diode using a reflective layer including an air layer
    10.
    发明授权
    Method for fabricating a laser diode using a reflective layer including an air layer 失效
    使用包括空气层的反射层制造激光二极管的方法

    公开(公告)号:US06790693B2

    公开(公告)日:2004-09-14

    申请号:US10420704

    申请日:2003-04-23

    IPC分类号: H01L2100

    摘要: A laser diode that uses air as a reflective layer, thereby enhancing reflectance with respect to an oscillating laser beam, and a method for fabricating such a laser diode are provided. The laser diode includes a substrate, a laser oscillating layer formed on the substrate, an upper electrode formed on the laser oscillating layer, and a reflective layer formed at one side of the laser oscillating layer, wherein the reflective layer comprises air layers. According to the laser diode and the method for fabricating the same, it is possible to form a reflective layer having a higher reflectivity with a reduced number of pairs of reflective layers, thereby making a laser diode whose threshold voltage is reduced and which can produce a high-output laser beam.

    摘要翻译: 提供使用空气作为反射层的激光二极管,从而提高相对于振荡激光束的反射率,以及制造这种激光二极管的方法。 激光二极管包括基板,形成在基板上的激光振荡层,形成在激光振荡层上的上电极和形成在激光振荡层一侧的反射层,其中反射层包括空气层。 根据激光二极管及其制造方法,可以形成具有较低反射率的反射层,反射层数减少的反射层,从而形成阈值电压降低的激光二极管,并可产生 高输出激光束。