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公开(公告)号:US07196426B2
公开(公告)日:2007-03-27
申请号:US10995384
申请日:2004-11-24
申请人: Jyunichi Nakamura , Tadashi Kodaira , Shunichiro Matsumoto , Hironari Aratani , Takanori Tabuchi , Takeshi Chino
发明人: Jyunichi Nakamura , Tadashi Kodaira , Shunichiro Matsumoto , Hironari Aratani , Takanori Tabuchi , Takeshi Chino
IPC分类号: H01L23/48 , H01L23/498 , H05K3/00 , H05K3/34 , H05K1/02
CPC分类号: H05K3/0061 , H01L23/49822 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/01078 , H01L2924/15311 , H05K1/0271 , H05K3/205 , H05K3/3457 , H05K3/4644 , H05K2201/09472 , H05K2201/0969 , H05K2201/2009 , H05K2203/1536
摘要: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.
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公开(公告)号:US07164198B2
公开(公告)日:2007-01-16
申请号:US10649745
申请日:2003-08-28
申请人: Jyunichi Nakamura , Tadashi Kodaira , Shunichiro Matsumoto , Hironari Aratani , Takanori Tabuchi , Takeshi Chino
发明人: Jyunichi Nakamura , Tadashi Kodaira , Shunichiro Matsumoto , Hironari Aratani , Takanori Tabuchi , Takeshi Chino
CPC分类号: H05K3/0061 , H01L23/49822 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/01078 , H01L2924/15311 , H05K1/0271 , H05K3/205 , H05K3/3457 , H05K3/4644 , H05K2201/09472 , H05K2201/0969 , H05K2201/2009 , H05K2203/1536
摘要: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.
摘要翻译: 一种用于半导体器件的多层衬底,其具有由多组导体层和绝缘层形成的多层衬底本体,并且具有用于安装半导体元件的面和用于外部连接端子的另一面,用于安装的面 半导体器件设置有衬底,衬底通过该焊盘连接到要安装在其上的半导体元件,并且用于外部连接端子的面设置有衬底,衬底通过该衬垫连接到外部电路,其中加强板是 分别连接到用于在其上安装半导体元件的面和多层基板主体的外部连接端子的表面。
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公开(公告)号:US06759739B2
公开(公告)日:2004-07-06
申请号:US10281163
申请日:2002-10-28
申请人: Jyunichi Nakamura , Tadashi Kodaira , Shunichiro Matsumoto , Hironari Aratani , Takanori Tabuchi , Takeshi Chino
发明人: Jyunichi Nakamura , Tadashi Kodaira , Shunichiro Matsumoto , Hironari Aratani , Takanori Tabuchi , Takeshi Chino
IPC分类号: H01L2312
CPC分类号: H05K3/0061 , H01L23/49822 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/01078 , H01L2924/15311 , H05K1/0271 , H05K3/205 , H05K3/3457 , H05K3/4644 , H05K2201/09472 , H05K2201/0969 , H05K2201/2009 , H05K2203/1536
摘要: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.
摘要翻译: 一种用于半导体器件的多层衬底,其具有由多组导体层和绝缘层形成的多层衬底本体,并且具有用于安装半导体元件的面和用于外部连接端子的另一面,用于安装的面 半导体器件设置有衬底,衬底通过该焊盘连接到要安装在其上的半导体元件,并且用于外部连接端子的面设置有衬底,衬底通过该衬垫连接到外部电路,其中加强板是 分别连接到用于在其上安装半导体元件的面和多层基板主体的外部连接端子的表面。
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公开(公告)号:US06988312B2
公开(公告)日:2006-01-24
申请号:US10451850
申请日:2002-10-29
申请人: Jyunichi Nakamura , Shunichiro Matsumoto , Tadashi Kodaira , Hironari Aratani , Takanori Tabuchi , Takeshi Chino , Kiyotaka Shimada
发明人: Jyunichi Nakamura , Shunichiro Matsumoto , Tadashi Kodaira , Hironari Aratani , Takanori Tabuchi , Takeshi Chino , Kiyotaka Shimada
IPC分类号: H05K3/26
CPC分类号: H05K3/4682 , H01L21/4857 , H01L23/3128 , H01L23/36 , H01L23/4334 , H01L2224/16 , H01L2924/00014 , H01L2924/01078 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H05K3/0097 , H05K3/205 , H05K3/3473 , H05K3/4007 , H05K3/4644 , H05K2201/0367 , H05K2203/0152 , H05K2203/0376 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49142 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2224/0401
摘要: The invention relates a method for producing a multilayer circuit board (50) for a semiconductor device, comprising using a composite metal sheet (14) in which two metal sheets are combined, forming, on each side of the composite metal sheet, pads for connecting to a semiconductor element, the pads being made of a metal material which is substantially not etched by an etchant for the metal sheet, and an insulating layer having openings exposing the pads, forming, on the insulating layer, a wiring line layer (26) connected to the pads and having pads for connecting to another wiring line layer to be subsequently formed, subsequently fabricating a multilayer circuit board body (20) by necessary numbers of insulating layers and wiring line layers alternately formed, forming, on the outermost insulating layer of the multilayer circuit board body, an insulating layer provided with through-holes exposing pads for external connecting terminals, which are located on the outermost insulating layer, then dividing the composite metal sheet, to yield intermediates (34) each provided on one side of the metal sheet with the multilayer circuit board body, and etching the metal sheet at an area at which a semiconductor element is to be mounted to remove the material of the metal sheet at that area, to thereby form a frame (10) surrounding the area for the mounting of the semiconductor element.
摘要翻译: 本发明涉及一种用于半导体器件的多层电路板(50)的制造方法,其特征在于,使用复合金属片(14),其中组合有两个金属片,在复合金属片的每一侧上形成用于连接的焊盘 对于半导体元件,所述焊盘由金属材料制成,所述金属材料基本上不被所述金属板的蚀刻剂蚀刻,以及具有暴露所述焊盘的开口的绝缘层,在所述绝缘层上形成布线层(26) 连接到焊盘并具有用于连接到随后形成的另一布线层的焊盘,随后通过必要数量的交替形成的绝缘层和布线层来制造多层电路板主体(20),在绝缘层的最外层 多层电路板主体,设置有位于最外侧绝缘体上的用于外部连接端子的通孔露出焊盘的绝缘层 然后分割复合金属板,得到各自设置在金属板的一侧上的多层电路板体的中间体(34),并在要安装半导体元件的区域上蚀刻金属片 在该区域移除金属片的材料,从而形成围绕用于安装半导体元件的区域的框架(10)。
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公开(公告)号:US20050087860A1
公开(公告)日:2005-04-28
申请号:US10995384
申请日:2004-11-24
申请人: Jyunichi Nakamura , Tadashi Kodaira , Shunichiro Matsumoto , Hironari Aratani , Takanori Tabuchi , Takeshi Chino
发明人: Jyunichi Nakamura , Tadashi Kodaira , Shunichiro Matsumoto , Hironari Aratani , Takanori Tabuchi , Takeshi Chino
IPC分类号: H01L23/12 , H01L23/06 , H01L23/08 , H01L23/498 , H01L23/52 , H05K1/02 , H05K3/00 , H05K3/20 , H05K3/34 , H05K3/46 , H01L23/48
CPC分类号: H05K3/0061 , H01L23/49822 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/01078 , H01L2924/15311 , H05K1/0271 , H05K3/205 , H05K3/3457 , H05K3/4644 , H05K2201/09472 , H05K2201/0969 , H05K2201/2009 , H05K2203/1536
摘要: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.
摘要翻译: 一种用于半导体器件的多层衬底,其具有由多组导体层和绝缘层形成的多层衬底本体,并且具有用于安装半导体元件的面和用于外部连接端子的另一面,用于安装的面 半导体器件设置有衬底,衬底通过该焊盘连接到要安装在其上的半导体元件,并且用于外部连接端子的面设置有衬底,衬底通过该衬垫连接到外部电路,其中加强板是 分别连接到用于在其上安装半导体元件的面和多层基板主体的外部连接端子的表面。
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